5019513010

10 9 7 8 5 6 4 (1.58) F 接点位置 挿入深さ CL (2.55) (1.4) (2.66) 断面図 (参考) A CL D 0.47 3.6 0.55 CIRCUIT NO.1 3.35 CL 0.15 B 3.7 (4.1) オープン時 (4.5) D 4.6 E D C オープン時高さ 1.9 3.5(NAIL) ロック時高さ (0.5) (PITCH) ロック時 1.5 2.25 4.05 4.34 45° C F 2. めっき仕様 PLATING ターミナル TERMINAL コンタクト部：部分金めっき(0.1μm以上) テール部：部分金めっき 下地：ニッケルめっき(1.0μm以上) CONTACT AREA：SEPARATED GOLD PLATING (0.1 MICROMETER MINIMUM) SOLDER TAIL AREA：SEPARATED GOLD PLATING UNDERPLATE：NICKEL OVERALL 金具 FITTING NAIL ニッケル下地錫めっき 錫めっき(1.0μm以上) ニッケルめっき(1.0μm以上) TIN(Sn) OVER NICKEL(Ni) PLATING. TIN PLATING (1.0 MICROMETER MINIMUM) NICKEL PLATING (1.0 MICROMETER MINIMUM) 3. テールと金具を併せた平坦度は 0.1ミリメートル以下(リフロー前) TAILS AND NAILS COPLANARITY TO BE 0.1 MAX. (BEFORE REFLOW) 4. ELV及びRoHS適合品 ELV AND RoHS COMPLIANT 5 R0.3は、FPC導体部にかからないこと。 R0.3 MUST NOT BE OVERLAPPED TO PATTERN OF FPC. E 0.47 1 1. 使用材料 MATERIAL ハウジング ：液晶ポリマー　ガラス充填, UL94V-0(白) HOUSING LIQUID CRYSTAL POLYMER GLASS FILLED, UL94V-0 (WHITE) アクチュエータ ：ポリアミド 9T, ガラス充填, UL94V-0(茶) ACTUATOR POLYAMIDE 9T, GLASS FILLED, UL94V-0 (BROWN) ターミナル ：銅合金(t=0.15) TERMINAL COPPER ALLOY 金具 ：銅合金(t=0.2) FITTING NAIL COPPER ALLOY 1.15 CL CL コネクタ　と吸着面 CL C 2 注記 NOTES 2.1 F 3 8 B F 35.7 30.7 25.7 23.2 20.7 16.7 15.7 12.7 11.7 10.7 37.1 32.1 27.1 24.6 22.1 18.1 17.1 14.1 13.1 12.1 37.4 32.4 27.4 24.9 22.4 18.4 17.4 14.4 13.4 12.4 34.5 29.5 24.5 22.0 19.5 15.5 14.5 11.5 10.5 9.5 37.8 32.8 27.8 25.3 22.8 18.8 17.8 14.8 13.8 12.8 E D C B A 501951-7010 501951-6010 501951-5010 501951-4510 501951-4010 501951-3210 501951-3010 501951-2410 501951-2210 501951-2010 EMBOSSED PACKAGE 70 60 50 45 40 32 30 24 22 20 B CIRCUITS オーダー番号 ORDER NO. CONNECTOR SERIES NO. 501951-**19 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) 0.25 UNDER ±0.03 0.25 OVER 0.5 UNDER ±0.05 0.5 OVER 1.0 UNDER ±0.1 1.0 OVER 10 UNDER ±0.2 ±0.25 10 OVER 30 UNDER ±0.3 30 OVER ANGULAR ±1° A DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 RELEASE DATE 9 2020/05/15 13:39:12 8 7 6 5 DIMENSION UNITS SCALE mm 10:1 CURRENT REV DESC: REVISED GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0.05 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 EC NO: 637653 DRWN: TNAKAGAWA01 CHK'D: HSHIMOYAMA APPR: SHOSHIKAWA INITIAL REVISION: DRWN: TRSUZUKI APPR: HHIRATA THIRD ANGLE PROJECTION DRAWING 2020/05/15 2020/05/15 2020/05/15 2006/08/31 2006/09/05 SERIES A3-SIZE 501951 3 0.5 FPC CONN. HSG ASSY EASY ON / STRAIGHT (GOLD) PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-501951-003 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 G SHEET NUMBER 1 OF 2 1 A 8 7 5 6 4 3 0.5(N+1)±0.07 0.35±0.03 2-R0.3 1.7±0.1 1.3±0.1 2 MINIMUM E E±0.1 0.8±0.1 参考基板レイアウト（マウント面） D 適合FPC推奨寸法 P.C.BOARD PATTERN DIMENSION(REF.) (MOUNT AREA) APPLICABLE FPC RECOMMENDED DIMENSION 5 0.5±0.08 0.5±0.05 PITCH 0.3±0.03 適合FFC推奨寸法 N：極数 N:CIRCUITS F E D N：極数 N:CIRCUITS APPLICABLE FFC RECOMMENDED DIMENSION （仕上がり厚さ：0.3±0.05） (THICKNESS：0.3±0.05) （仕上がり厚さ：0.3±0.05） (THICKNESS：0.3±0.05) FPC/FFCについて ABOUT FPC/FFC FPCについて　ABOUT FPC 打ち抜き方向は導体側から補強板側を推奨します。 導体部については軟箔銅35μmまたは50μmを推奨します。 FFCに規定された定格温度がFFC単体前提である場合が御座います。 コネクタと組み合わせての実使用において、接着層が劣化するなどの信頼性を満足できないケースを回避するため、 C 実機での評価/確認をお願い致します。 補強フィルム材質はポリイミドを推奨します。ベースフィルムは25μmを推奨します。 接着剤は熱硬化接着剤を推奨します。 尚、接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様お願い致します。 C 0.5(N-1)±0.05 3+1.0 0 0.5±0.05 PITCH 3+1.0 0 CL 0.5±0.08 0.5±0.1 2 MINIMUM 0.6±0.1 1.4±0.1 1.2±0.1 0.5±0.05 (PITCH) 0.5(N-1)±0.05 （補強板） 0.5±0.1 B±0.05 1 0.5(N+1)±0.07 (STIFFENER BOARD) F 2 （補強板） 9 (STIFFENER BOARD) 10 RECOMMENDED MATERIAL/THICKNESS. RECOMMENDED STIFFENER MATERIAL: POLYIMIDE RECOMMENDED BASE FILM THICKNESS: 25 MICROMETER RECOMMENDED ADHESIVE: THERMOSETTING ADHESIVE NOTE: PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A 　　 POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES THE DEFECT IN ELECTRICAL CONTINUITY. 　　 THERE IS A POSSIBILITY THAT THE PRESCRIPT TEMPERATURE OF FFC IS SET TO SINGLE IT. RECOMMENDED PUNCHING DIRECTION: FROM CONDUCTOR SIDE TO STIFFENER SIDE RECOMMENDED CONDUCTOR SPEC: SOFT COPPER FOIL RECOMMENDED CONDUCTOR THICKNESS: 35 MICROMETER OR 50 MICROMETER NOTE: WHEN ACTUALLY USING IT WITH CONNECTOR, PLEASE DO THE EVALUATION AND THE 　 CONFIRMATION WITH AN ACTUAL EQUIPMENT TO EVADE THE CASE WHERE RELIABILITY 　 CANNOT BE FILLED (THE ADHESIVE LINE OF FFC IS DETERIORATED ETC,) 補強板：ポリイミド REINFORCE BOARD: POLYIMIDE 熱硬化接着剤 B THERMOSETTING ADHESIVE ベースフィルム：ポリイミド (25µm) 0.3±0.05 BASE FILM: POLYIMIDE(25µm) 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：銅箔 (35µm) COPPER FOIL (35µm) 熱硬化接着剤 THERMOSETTING ADHESIVE カバーレイ：ポリイミド(25µm) COVER FILM: POLYIMIDE(25µm) 仕上がり厚さ THICKNESS B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES (UNLESS SPECIFIED) 0.25 UNDER ±0.03 0.25 OVER 0.5 UNDER ±0.05 0.5 OVER 1.0 UNDER ±0.1 1.0 OVER 10 UNDER ±0.2 ±0.25 10 OVER 30 UNDER ±0.3 30 OVER ANGULAR ±1° (0.5-1.2µm) めっき：金めっき 下地ニッケル (1-5µm) PLATING: GOLD(0.5-1.2µm) 　　 NICKEL UNDER (1-5µm) FPC構成推奨仕様 A STRUCTURE OF FPC DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J DATE: 2020/01/14 P1 RELEASE DATE 9 2020/05/15 13:39:12 8 7 6 5 DIMENSION UNITS SCALE mm 10:1 CURRENT REV DESC: REVISED GENERAL TOLERANCES (UNLESS SPECIFIED) ANGULAR TOL ± 1.0 ° 4 PLACES ± 0.2 3 PLACES ± 0.25 2 PLACES ± 0.3 1 PLACE ± 0.05 0 PLACES ± DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 EC NO: 637653 DRWN: TNAKAGAWA01 CHK'D: HSHIMOYAMA APPR: SHOSHIKAWA INITIAL REVISION: DRWN: TRSUZUKI APPR: HHIRATA THIRD ANGLE PROJECTION DRAWING 2020/05/15 2020/05/15 2020/05/15 2006/08/31 2006/09/05 SERIES A3-SIZE 501951 3 0.5 FPC CONN. HSG ASSY EASY ON / STRAIGHT (GOLD) PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER SD-501951-003 MATERIAL NUMBER PSD 001 CUSTOMER SEE SHEET 1 2 GENERAL MARKET G SHEET NUMBER 2 OF 2 1 A