5025984593

10 9 F 8 7 5 6 4 2.1 FPC挿入深さ (INSERTION DEPTH OF FPC) 2 (PICK-UP AREA) 1.55 0.85 0.5 E 0.3 (ODD TERMINAL) (EVEN TERMINAL) 3.45 断面図 Section B D A (B) 0.3 ACTUATOR OPEN (1.63) 1.15 (PITCH) C 0.1 0.6 C 2 1 注記 NOTES: 1.材質 MATERIAL ハウジング：LCP(液晶ポリマー)、白色、ガラス充填、UL94V-0 HOUSING:LIQUID CRYSTAL POLYMER,WHITE(NATURAL) GLASS FILLED,UL94V-0 アクチュエータ：ポリアミド樹脂 黒色、ガラス充填、UL94HB ACTUATOR: POLYAMIDE BLACK GLASS FILLED,UL94HB ターミナル：燐青銅（t＝0.12） TERMINAL:PHOSPHOR BRONZE(t=0.12) 金具：燐青銅(t=0.15) NAIL:PHOSPHOR BRONZE(t=0.15) 2.めっき仕様 PLATING ターミナル TERMINAL 接点部：金めっき　0.1µm以上 CONTACT AREA: GOLD 0.1 MICROMETER MINIMUM 半田付け部：金めっき 　 SOLDER TAIL AREA: GOLD 下地めっき:ニッケル　1.0µm以上 UNDER PLATING:NICKEL 1.0 MICROMETER MINIMUM 金具 NAIL 錫めっき　1.0µm以上 TIN PLATING 1.0 MICROMETER MINIMUM　 下地めっき:ニッケル　1.0µm以上 UNDER PLATING:NICKEL 1.0 MICROMETER MINIMUM 3.平坦度は、0.1ミリ以下とする。 TAILS COPLANARITY TO BE 0.1 MAXIMUM. 4.ELV及びRoHS適合品 ELV AND RoHS COMPLIANT 5.本製品は502598-**91の端子材料変更品である。 THIS PRODUCT IS CHANGE OF TERMINAL MATERIAL FOR 502598-**91. D 0.1 0.47 3 3.55 3.8 ACTUATOR CLOSE B 14.4 12.6 11.4 10.8 9 7.8 7.2 6.6 6 4.2 3.6 16.95 15.15 13.95 13.35 11.55 10.35 9.75 9.15 8.55 6.75 6.15 15 13.2 12.0 11.4 9.6 8.4 7.8 7.2 6.6 4.8 4.2 17.4 15.6 14.4 13.8 12 10.8 10.2 9.6 9 7.2 6.6 D C B A 502598-5193 502598-4593 502598-4193 502598-3993 502598-3393 502598-2993 502598-2793 502598-2593 502598-2393 502598-1793 502598-1593 EMBOSSED PACKAGE オーダー番号 ORDER NO. F E D C 51 45 41 39 33 29 27 25 23 17 B 15 極　数 CIRCUITS CONNECTOR SERIES NO. 502598-**21 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES: (UNLESS SPECIFIED) 一 10 10 A 30 DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 P1 RELEASE DATE 9 2022/05/09 ANGLE 09:31:46 8 OVER 7 6 5 SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) UNDER OVER DIMENSION UNITS ± 0.2 30 UNDER ± 0.25 ± 0.3 ±1° ANGULAR TOL ± 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 0.3 FPC CONN. BACK FLIP HOUSING ASSY EC NO: 704374 DRWN: KYHWANG CHK'D: SMARUYAMA APPR: YNAITO INITIAL REVISION: DRWN: KMIYAHARA APPR: KMORIKAWA THIRD ANGLE PROJECTION 2022/04/25 2022/05/09 2022/05/09 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2012/07/18 2012/08/01 DRAWING SERIES A3-SIZE 502598 3 SD-502598-003 MATERIAL NUMBER PSD 001 CUSTOMER GENERAL MARKET SEE TABLE 2 C SHEET NUMBER 1 OF 2 1 A 9 7 8 5 6 4 3 0.3(N+1)±0.05 0.3(N-1)±0.03 0.3±0.07 2.1±0.15 2±0.15 1.2±0.15 1.1±0.15 0.25±0.15 0.15±0.15 F 0.2±0.03 0.5±0.05 D±0.05 0.6±0.05 0.3±0.07 F 0.3+0.04 -0.03 0.6±0.02 (PITCH) 0.1MAX. 2-R0.2 0.3±0.02 0.35±0.05 0.6±0.05 (PITCH) B±0.05 0.2 (OVERLAP) 2.5MIN. 0.3±0.05 ※1 0.5MIN. 1±0.1 0.1 0.67±0.05 (0.2) 0.3±0.05 D 1 (PITCH) 0.3±0.05 めっき：金めっき (0.1µm以上) 下地ソフトニッケル (1-5µm) PLATING: GOLD(0.1µmMIN.) SOFT NICKEL UNDER (1-5µm) 3.65±0.1 E 仕上がり厚さ THICKNESS 2 3.5MIN. （補強板） (STIFFENER BOARD) 10 E 0.1MAX. 0.6±0.02 0.3+0.04 -0.03 N：極数 N:CIRCUITS (PITCH) 0.3(N-3)±0.03 0.6±0.07 D 適合する金めっきFPC推奨寸法 0.975±0.05 APPLICABLE FPC OF GOLD PATING RECOMMENDED DIMENSION 推奨基板寸法 補強板：ポリイミド REINFORCE BOARD: POLYIMIDE 熱硬化接着剤 THERMOSETTING ADHESIVE ベースフィルム：ポリイミド (25µm) BASE FILM: POLYIMIDE(25µm) C 熱硬化接着剤 THERMOSETTING ADHESIVE 導体部：銅箔 (35µm) COPPER FOIL (35µm) 熱硬化接着剤 THERMOSETTING ADHESIVE カバーレイ：ポリイミド (25µm) COVER FILM: POLYIMIDE(25µm) (仕上がり厚さ：0.2±0.03) (THICKNESS:0.2±0.03) RECOMMENDED P.W.B. PATTERN LAYOUT マスク厚：100μm マスク開口率：100% SCREEN THICKNESS：100μm SCREEN OPEN RATIO：100% FPCについて： 抜き方向は、導体側から補強板側を推奨致します。 補強フィルム材質は、ポリイミドを推奨致します。 接着剤は熱硬化接着剤を推奨致します。 尚、接着剤の接点部への付着は導通不良の原因になりますので、 染み出しが無い様、お願い致します。　 ABOUT FPC: RECOMMENDED PUNCHER DIRECTION: FROM CONDUCTOR SIDE TO STIFFNER FILM SIDE. RECOMMENDED MATERIAL: STIFFENER FILM : POLYIMIDE BONDING AGENT : THERMOSETTING AGENT PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE CAUSES THE DEFECT IN ELECTRICAL CONTINUITY. FPC構成推奨仕様 C STRUCTURE OF FPC ISO VIEW （参考） B B THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION GENERAL TOLERANCES: (UNLESS SPECIFIED) 一 10 10 A 30 DOCUMENT STATUS FORMAT: master-tb-prod-A3 REVISION: J1 DATE: 2021/05/01 P1 RELEASE DATE 9 2022/05/09 ANGLE 09:31:46 8 OVER 7 6 5 SCALE mm NTS CURRENT REV DESC: GENERAL TOLERANCES (UNLESS SPECIFIED) UNDER OVER DIMENSION UNITS ± 0.2 30 UNDER ± 0.25 ± 0.3 ±1° ANGULAR TOL ± 4 PLACES ± 3 PLACES ± 2 PLACES ± 1 PLACE ± 0 PLACES ± ° DRAFT WHERE APPLICABLE MUST REMAIN WITHIN DIMENSIONS 4 0.3 FPC CONN. BACK FLIP HOUSING ASSY EC NO: 704374 DRWN: KYHWANG CHK'D: SMARUYAMA APPR: YNAITO INITIAL REVISION: DRWN: KMIYAHARA APPR: KMORIKAWA THIRD ANGLE PROJECTION 2022/04/25 2022/05/09 2022/05/09 PRODUCT CUSTOMER DRAWING DOC TYPE DOC PART REVISION DOCUMENT NUMBER 2012/07/18 2012/08/01 DRAWING SERIES A3-SIZE 502598 3 SD-502598-003 MATERIAL NUMBER PSD 001 CUSTOMER SEE SHEET 1 2 GENERAL MARKET C SHEET NUMBER 2 OF 2 1 A