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73659-0001

73659-0001

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73659-0001 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMCPower Rec...

  • 数据手册
  • 价格&库存
73659-0001 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0736590001 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76µm (30µ") Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73659 Backplane Midplane Power Module Power Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 12 12 Black 250 No 94V-0 No None Beryllium Copper Gold Tin High Temperature Thermoplastic 1 Open Pin Field 3 Vertical 0.079 In 2.00 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 150 3.75 Search Parts in this Series 73659Series Mates With 73651 HDM® Board-to-Board Daughterboard Power Module Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A 1.0 Gbps 38 Yes 500V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0819 Sales Drawing SDA-73659-000* HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73659-0001 价格&库存

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