MC75174BDW

Order this document by MC75172B/D Quad EIA-485 Line Drivers with Three-State Outputs The Motorola MC75172B/174B Quad Line drivers are differential high speed drivers designed to comply with the EIA–485 Standard. Features include three–state outputs, thermal shutdown, and output current limiting in both directions. These devices also comply with EIA–422–A, and CCITT Recommendations V.11 and X.27. The MC75172B/174B are optimized for balanced multipoint bus transmission at rates in excess of 10 MBPS. The outputs feature wide common mode voltage range, making them suitable for party line applications in noisy environments. The current limit and thermal shutdown features protect the devices from line fault conditions. These devices offer optimum performance when used with the MC75173 and MC75175 line receivers. Both devices are available in 16–pin plastic DIP and 20–pin wide body surface mount packages. • Meets EIA–485 Standard for Party Line Operation MC75172B MC75174B QUAD EIA–485 LINE DRIVERS SEMICONDUCTOR TECHNICAL DATA P SUFFIX PLASTIC PACKAGE CASE 648 • • • • • • • • • • Meets EIA–422–A and CCITT Recommendations V.11 and X.27 Operating Ambient Temperature: –40°C to +85°C High Impedance Outputs Common Mode Output Voltage Range: –7 to 12 V Positive and Negative Current Limiting Transmission Rates in Excess of 10 MBPS Thermal Shutdown at 150°C Junction Temperature, (± 20°C) Single 5.0 V Supply Pin Compatible with TI SN75172/4 and NS µA96172/4 Interchangeable with MC3487 and AM26LS31 for EIA–422–A Applications Device MC75172BDW MC75174BDW MC75174BP TA = – 40° to +85°C DW SUFFIX PLASTIC PACKAGE CASE 751D (SO–20L) ORDERING INFORMATION Operating Temperature Range Package SO–20L SO–20L Plastic DIP PIN CONNECTIONS MC75172B 1A 1 1Y 2 1Z 3 En 4 2Z 5 2Y 6 2A 7 Gnd 8 P Package 16 VCC 1A 1 15 4A 14 4Y 13 4Z 12 En 11 3Z 10 3Y 9 3A 1Y 2 NC 3 1Z 4 En 5 2Z 6 NC 7 2Y 8 2A 9 Gnd 10 DW Package 20 VCC 19 4A 18 4Y 17 NC 16 4Z 15 En 14 3Z 13 NC 12 3Y 11 3A MC75174B 16 VCC 1A 1 15 4A 1Y 2 20 VCC 19 4A 18 4Y 17 NC 16 4Z 15 En 34 14 3Z 13 NC 12 3Y 11 3A DW Package 1A 1 1Y 2 1Z 3 En 4 12 2Z 5 2Y 6 2A 7 Gnd 8 P Package 14 4Y NC 3 13 4Z 12 En 34 11 3Z 10 3Y 9 3A 1Z 4 En 5 12 2Z 6 NC 7 2Y 8 2A 9 Gnd 10 © Motorola, Inc. 1996 Rev 1 MOTOROLA ANALOG IC DEVICE DATA 1 MC75172B MC75174B MAXIMUM RATINGS Rating Power Supply Voltage Input Voltage (Data, Enable) Input Current (Data, Enable) Applied Output Voltage, when in 3–State Condition (VCC = 5.0 V) Applied Output Voltage, when VCC = 0 V Output Current Storage Temperature Symbol VCC Vin Iin Vza Vzb IO Tstg Value –0.5, +7.0 +7.0 –24 –10, +14 ±14 Self–Limiting –65, +150 – °C Unit Vdc Vdc mA Vdc Devices should not be operated at these limits. The “Recommended Operating Conditions” table provides for actual device operation. RECOMMENDED OPERATING CONDITIONS Characteristic Power Supply Voltage Input Voltage (All Inputs) Output Voltage in 3–State Condition, or when VCC = 0 V Output Current (Normal data transmission) Operating Ambient Temperature (see text) EIA–485 EIA–422 All limits are not necessarily functional concurrently. Symbol VCC Vin Vcm IO TA Min +4.75 0 –7.0 –65 –40 0 Typ +5.0 – – – – – Max +5.25 VCC +12 +65 +85 +85 Unit Vdc Vdc Vdc mA °C ELECTRICAL CHARACTERISTICS (–40°C Characteristic Output Voltage Single–Ended Voltage IO = 0 High @ IO = –33 mA Low @ IO = +33 mA Differential Voltage Open Circuit (IO = 0) RL = 54 Ω (Figure 1) p TA p 85°C, 4.75 V p VCC p 5.25 V, unless otherwise noted.) Symbol Min Typ Max Unit Vdc VO VOH VOL  VOD1   VOD2   ∆VOD2   VOD2A   ∆VOD2A   VOD3   ∆VOD3  VOS  ∆VOS  IO(off) IOZ IOSR IOS 0 – – 1.5 1.5 – – – 1.5 – – – –50 –50 –150 –250 – 4.0 1.6 3.4 2.3 5.0 2.2 5.0 – 5.0 2.9 5.0 0 0 – – 6.0 – – 6.0 5.0 200 – 200 5.0 200 – 200 +50 +50 +150 +250 mVdc Vdc mVdc Vdc mVdc Vdc mVdc µA mA Change in Differential*, RL = 54 Ω (Figure 1) Differential Voltage, RL = 100 Ω (Figure 1) Change in Differential*, RL = 100 Ω (Figure 1) Differential Voltage, –7.0 V Vcm 12 V (Figure 2) Change in Differential*, –7.0 V Vcm 12 V (Figure 2) Offset Voltage, RL = 54 Ω (Figure 1) Change in Offset*, RL = 54 Ω (Figure 1) p p p p Output Current (Each Output) Power Off Leakage, VCC = 0, –7.0 V VO 12 V Leakage in 3–State Mode, –7.0 V VO 12 V pp pp Short Circuit Current to Ground Short Circuit Current, –7.0 V VO p p 12 V *Vin switched from 0.8 to 2.0 V. Typical values determined at 25°C ambient and 5.0 V supply. 2 MOTOROLA ANALOG IC DEVICE DATA MC75172B MC75174B ELECTRICAL CHARACTERISTICS (–40°C Characteristics Inputs Low Level Voltage (Pins 4 & 12, MC75174B only) Low Level Voltage (All Other Pins) High Level Voltage (All Inputs) Current @ Vin = 2.7 V (All Inputs) Current @ Vin = 0.5 V (All Inputs) Clamp Voltage (All Inputs, Iin = –18 mA) Thermal Shutdown Junction Temperature Power Supply Current (Outputs Open, VCC = 5.25 V) Outputs Enable Outputs Disabled p TAp 85°C, 4.75 V p VCC p 5.25 V, unless otherwise noted.) Symbol VIL(A) VIL(B) VIH IIH IIL VIK Tjts ICC – – 60 30 70 40 Min 0 0 2.0 – –100 –1.5 – Typ – – – 0.2 –15 – +150 Max 0.7 0.8 VCC 20 – – – µA Vdc °C mA Unit Vdc TIMING CHARACTERISTICS (TA = 25°C, VCC = 5.0 V) Characteristics Propagation Delay – Input to Single–ended Output (Figure 3) Output Low–to–High Output High–to–Low Propagation Delay – Input to Differential Output (Figure 4) Input Low–to–High Input High–to–Low Differential Output Transition Time (Figure 4) Skew Timing tPLHD – tPHLD  for Each Driver Max – Min tPLHD Within a Package Max – Min tPHLD Within a Package Enable Timing Single–ended Outputs (Figure 5) Enable to Active High Output Enable to Active Low Output Active High to Disable (using Enable) Active Low to Disable (using Enable) Enable to Active High Output (MC75172B only) Enable to Active Low Output (MC75172B only) Active High to Disable (using Enable, MC75172B only) Active Low to Disable (using Enable, MC75172B only) Differential Outputs (Figure 6) Enable to Active Output Enable to Active Output (MC75172B only) Enable to 3–State Output Enable to 3–State Output (MC75172B only) Symbol tPLH tPHL tPLH(D) tPHL(D) tdr, tdf tSK1 tSK2 tSK3 Min – – – – – – – – Typ 23 18 15 17 19 0.2 1.5 1.5 Max 30 30 ns 25 25 25 – – – ns tPZH(E) tPZL(E) tPHZ(E) tPLZ(E) tPZH(E) tPZL(E) tPHZ(E) tPLZ(E) tPZD(E) tPZD(E) tPDZ(E) tPDZ(E) – – – – – – – – – – – – 48 20 35 30 58 28 38 36 47 56 32 40 60 30 45 50 70 35 50 50 ns – – – – ns ns Unit ns MOTOROLA ANALOG IC DEVICE DATA 3 MC75172B MC75174B Figure 1. VDD Measurement VCC Vin (0.8 or 2.0 V) RL/2 VOD2,A RL/2 VOS Vin (0.8 or 2.0 V) VCC 375 VOD3 58 375 + VCM = 12 to –7.0 V Figure 2. Common Mode Test Figure 3. Propagation Delay, Single–Ended Outputs 3.0 V VCC Vin Y Z S.G. Output Z tPHL 3.0 V 2.3 V 27 Ω Output 15 pF Output Y 3.0 V 3.0 V tPLH 3.0 V VOL VOH Vin 1.5 V tPLH 1.5 V 0V tPHL Figure 4. Propagation Delay, Differential Outputs 3.0 V VCC Vin Vin 54 50 pF VOD 1.5 V tPLHD 1.5 V 0V tPHLD S.G. VOD 1.5 V 50% – 1.5 V tdr [4.6 V tdf 1.5 V 50% – 1.5 V NOTES: 1. S.G. set to: f 1.0 MHz; duty cycle = 50%; tr, tf, 5.0 ns. 2. tSK1 =  tPLHD – tPHLD for each driver. 3. tSK2 computed by subtracting the shortest tPLHD from the longest tPLHD of the 4 drivers within a package. 4. tSK3 computed by subtracting the shortest tPHLD from the longest tPHLD of the 4 drivers within a package. p p 4 MOTOROLA ANALOG IC DEVICE DATA MC75172B MC75174B Figure 5. Enable Timing, Single–Ended Outputs VCC Vin 0 or 3.0 V Vin 3.0 V S.G. 50 pF Vout 110Ω 1.5 V tPZH(E) 3.0 V 1.5 V 0V tPHZ(E) VOH Vout 2.3 V 0.5 V VCC 0 or 3.0 V 50 pF Vin 3.0 V VCC 110Ω Vout Vin 1.5 V tPZL(E) 3.0 V 1.5 V 0V tPLZ(E) Vout 2.3 V 0.5 V S.G. VOL Figure 6. Enable Timing, Differential Outputs 3.0 V Vin 0 or 3.0 V Vin 3.0 V VOD S.G. 1.5 V 0 Disabled Active Disabled 1.5 V 0 54 50 pF VOD 1.5 V tPZD(E) tPDZ(E) 1.5 V 0V VCC NOTES: 1. S.G. set to: f 1.0 MHz; duty cycle = 50%; tf, tf, 2. Vin is inverted for Enable measurements. p p 5.0 ns. MOTOROLA ANALOG IC DEVICE DATA 5 MC75172B MC75174B Figure 7. Single–Ended Output Voltage versus Output Sink Current 2.0 2.0 Figure 8. Single–Ended Output Voltage versus Temperature VOL, OUTPUT VOLTAGE (V) VOL, OUTPUT VOLTAGE (V) 1.5 1.75 IOL = 20.0 mA 1.5 IOL = 27.8 mA 1.0 0.5 4.75 V VCC TA = 25°C 0 0 10 20 30 40 50 IOL, OUTPUT CURRENT (mA) p p 5.25 V 60 70 1.25 4.75 V 1.0 – 40 p VCC p 5.25 V 85 – 20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) Figure 9. Single–Ended Output Voltage versus Output Source Current 5.0 VOH, OUTPUT VOLTAGE (V) VCC = 5.25 V VOH, OUTPUT VOLTAGE (V) VCC = 5.00 V 4.0 VCC = 4.75 V 3.0 4.0 Figure 10. Single–Ended Output Voltage versus Temperature IOH = –20.0 mA 3.75 IOH = –27.8 mA 3.5 VCC = 4.75 V 2.0 TA = 25°C 3.25 – 70 – 40 – 20 1.0 0 – 10 – 20 – 30 – 40 – 50 IOH, OUTPUT CURRENT (mA) – 60 20 0 40 60 TA, AMBIENT TEMPERATURE (°C) 85 Figure 11. Output Differential Voltage versus Load Current VOD , DIFFERENTIAL OUTPUT VOLTAGE (V) VOD , DIFFERENTIAL OUTPUT VOLTAGE (V) 4.0 4.0 Figure 12. Output Differential Voltage versus Temperature 3.0 VCC = 5.25 V 2.0 VCC = 5.0 V VCC = 4.75 V 3.0 IO = 20.0 mA 2.0 IO = 27.8 mA 1.0 0.8 or 2.0 V 0 0 10 20 30 40 50 IO, OUTPUT CURRENT (mA) IO VOD TA = 25°C 1.0 0.8 or 2.0 V 0 –40 –20 IO VOD VCC = 4.75 V 85 60 70 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 6 MOTOROLA ANALOG IC DEVICE DATA MC75172B MC75174B Figure 13. Output Leakage Current versus Output Voltage 2.0 IOX, IOZ, LEAKAGE CURRENT ( µ A) IOZ, LEAKAGE CURRENT ( µ A) 20 15 10 5.0 0 Vout = 7.0 V Vout = +12 V Figure 14. Output Leakage Current versus Temperature 1.0 0 –5.0 –10 –15 –20 –40 –20 –1.0 TA = 25°C En = Low, En = High –2.0 –7.0 –3.0 1.0 5.0 9.0 Vz, APPLIED OUTPUT VOLTAGE (V) 12 En = Low, En = High or VCC = 0 V 40 0 20 TA, AMBIENT TEMPERATURE (°C) 60 85 Figure 15. Input Current versus Input Voltage 5.0 IOS , SHORT CIRCUIT CURRENT (mA) 0 I in , INPUT CURRENT ( µ A) – 5.0 – 10 – 15 – 20 – 25 – 0.5 Enable Pins Driver Inputs 150 Figure 16. Short Circuit Current versus Common Mode Voltage Normally Low Output 90 30 0 – 30 Normally High Output 4.75 VCC TA = 25°C p p 5.25 V 4.5 5.5 – 90 TA = 25°C 4.75 VCC 0.5 1.5 2.5 3.5 Vin, INPUT VOLTAGE (V) –150 –7.0 p p 5.25 V 12 –3.0 1.0 5.0 9.0 Vz, APPLIED OUTPUT VOLTAGE (V) MOTOROLA ANALOG IC DEVICE DATA 7 MC75172B MC75174B APPLICATIONS INFORMATION Description The MC75172B and MC75174B are differential line drivers designed to comply with EIA–485 Standard (April 1983) for use in balanced digital multipoint systems containing multiple drivers. The drivers also comply with EIA–422–A and CCITT Recommendations V.11 and X.27. The drivers meet the EIA–485 requirement for protection from damage in the event that two or more drivers attempt to transmit data simultaneoulsy on the same cable. Data rates in excess of 10 MBPS are possible, depending on the cable length and cable characteristics. A single power supply, 5.0 V, ±5%, is required at a nominal current of 60 mA, plus load currents. Outputs Each output (when active) will be a low or a high voltage, which depends on the input state and the load current (see Table 1, 2 and Figures 7 to 10). The graphs apply to each driver, regardless of how many other drivers within the package are supplying load current. Table 1. MC75172B Truth Table Enables Data Input H L H L X EN H H X X L EN X X L L H Y H L H L Z Outputs Z L H L H Z The drivers are protected from short circuits by two methods: a) Current limiting is provided at each output, in both the source and sink direction, for shorts to any voltage within the range of 12 V to –7.0 V, with respect to circuit ground (see Figure 16). The short circuit current will flow until the fault is removed, or until the thermal shutdown circuit activates (see below). The current limiting circuit has a negative temperature coefficient and requires no resetting upon removal of the fault condition. b) A thermal shutdown circuit disables the outputs when the junction temperature reaches 150°C, ± 20°C. The thermal shutdown circuit has a hysteresis of ≈ 12°C to prevent oscillations. When this circuit activates, the output stage of each driver is put into the high impedance mode, thereby shutting off the output currents. The remainder of the internal circuitry remains biased. The outputs will become active once again as the IC cools down. Driver Inputs The driver inputs determine the state of the outputs in accordance with Tables 1 and 2. The driver inputs have a nominal threshold of 1.2 V, and their voltage must be kept within the range of 0 V to VCC for proper operation. If the voltage is taken more than 0.5 V below ground, excessive currents will flow, and proper operation of the drivers will be affected. An open pin is equivalent to a logic high, but good design practices dictate that inputs should never be left open. The characteristics of the driver inputs are shown in Figure 15. This graph is not affected by the state of the Enable pins. Enable Logic Each driver’s outputs are active when the Enable inputs (Pins 4 and 12) are true according to Tables 1 and 2. The Enable inputs have a nominal threshold of 1.2 V and their voltage must be kept within the range of 0 V to VCC for proper operation. If the voltage is taken more than 0.5 V below ground, excessive currents will flow, and proper operation of the drivers will be affected. An open pin is equivalent to a logic high, but good design practices dictate that inputs should never be left open. The Enable input characteristics are shown in Figure 15. Operating Temperature Range The minimum ambient operating temperature is listed as –40°C to meet EIA–485 specifications, and 0°C to meet EIA–422–A specifications. The higher VOD required by EIA–422–A is the reason for the narrower temperature range. Table 2. MC75174B Truth Table Outputs Data Input H L X Enable H H L Y H L Z Z L H Z H = Logic high, L = Logic low, X = Irrelevant, Z = High impedance The two outputs of a driver are always complementary. A “high” output can only source current out, while a “low” output can only sink current (except for short circuit current – see Figure 16). The outputs will be in the high impedance mode when: a) the Enable inputs are set according to Table 1 or 2; b) VCC is less than 1.5 V; c) the junction temperature exceeds the trip point of the thermal shutdown circuit (see below). When in this condition, the output’s source and sink capability are shut off, and only leakage currents will flow (see Figures 13, 14). Disabled outputs may be taken to any voltage between –7.0 V and 12 V without damage. 8 MOTOROLA ANALOG IC DEVICE DATA MC75172B MC75174B The maximum ambient operating temperature (applicable to both EIA–485 and EIA–422–A) is listed as 85°C. However, a lower ambient may be required depending on system use (i.e. specifically how many drivers within a package are used) and at what current levels they are operating. The maximum power which may be dissipated within the package is determined by: PD max where: reducing the load current, reducing the ambient temperature, and/or providing a heat sink. System Requirements EIA–485 requires each driver to be capable of transmitting data differentially to at least 32 unit loads, plus an equivalent DC termination resistance of 60Ω, over a common mode voltage of –7.0 to 12 V. A unit load (U.L.), as defined by EIA–485, is shown in Figure 17. Figure 17. Unit Load Definition I 1.0 mA + TJmax–TA R qJA RθJA = package thermal resistance (typical 70°C/W for the DIP package, 85°C/W for SOIC package); TJmax = max. operating junction temperature, and TA = ambient temperature. –7.0 V –3.0 V V 5.0 V –0.8 mA 12 V Since the thermal shutdown feature has a trip point of 150°C, ± 20°C, TJmax is selected to be 130°C. The power dissipated within the package is calculated from: PD where: = {[(VCC – VOH) • IOH] + VOL • IOL)} each driver = + (VCC • ICC) VCC = the supply voltage; VOH, VOL are measured or estimated from Figures 7 to 10; ICC = the quiescent power supply current (typical 60 mA). Reprinted from EIA–485, Electronic Industries Association, Washington,DC. As indicated in the equation, the first term (in brackets) must be calculated and summed for each of the four drivers, while the last term is common to the entire package. Example 1: TA = 25°C, IOL = IOH = 55 mA for each driver, VCC = 5.0 V, DIP package. How many drivers per package can be used? Maximum allowable power dissipation is: PD max °C * 25 + 13070°C W °C + 1.5 W A load current within the shaded regions represents an impedance of less than one U.L., while a load current of a magnitude outside the shaded area is greater than one U.L. A system’s total load is the sum of the unit load equivalents of each receiver’s input current, and each disabled driver’s output leakage current. The 60Ω termination resistance mentioned above allows for two 120Ω terminating resistors. Using the EIA–485 requirements (worst case limits), and the graphs of Figures 7 and 9, it can be determined that the maximum current an MC75172B or MC75174B driver will source or sink is 65 mA. [ Since the power supply current of 60 mA dissipates 300 mW, that leaves 1.2 W (1.5 W – 0.3 W) for the drivers. From Figures 7 and 9, VOL 1.75 V, and VOH 3.85 V. The power dissipated in each driver is: {(5.0 – 3.85) • 0.055} + (1.75 • 0.055) = 160 mW. Since each driver dissipates 160 mW, the four drivers per package could be used in this application Example 2: TA = 85°C, IOL = 27.8 mA, IOH = 20 mA for each driver, VCC = 5.0 V, SOIC package. How many drivers per package can be used? Maximum allowable power dissipation is: [ [ System Example An example of a typical EIA–485 system is shown in Figure 18. In this example, it is assumed each receiver’s input characteristics correspond to 1.0 U.L. as defined in Figure 17. Each “off” driver, with a maximum leakage of ±50 µA over the common mode range, presents a load of 0.06 U.L. The total load for the active driver is therefore 8.3 unit loads, plus the parallel combination of the two terminating resistors (60Ω). It is up to the system software to control the driver Enable pins to ensure that only one driver is active at any time. [ PD max °C * 85 + 13085°C W °C + 0.53 W Since the power supply current of 60 mA dissipates 300 mW, that leaves 230 mW (530 mW – 300 mW) for the drivers. From Figures 8 and 10 (adjusted for VCC = 5.0 V), VOL 1.38 V, and VOH 4.27 V. The power dissipated in each driver is: [ [ {(5.0 – 4.27) • 0.020} + (1.38 • 0.0278) = 53 mW Since each driver dissipates 53 mW, the use of all four drivers in a package would be marginal. Options include Termination Resistors Transmission line theory states that, in order to preserve the shape and integrity of a waveform traveling along a cable, the cable must be terminated in an impedance equal to its characteristic impedance. In a system such as that depicted in Figure 18, in which data can travel in both directions, both physical ends of the cable must be terminated. Stubs, leading to each receiver and driver, should be as short as possible. Leaving off the terminations will generally result in reflections which can have amplitudes of several volts above VCC or below ground. These overshoots and undershoots can disrupt the driver and/or receiver operation, create false data, and in some cases damage components on the bus. MOTOROLA ANALOG IC DEVICE DATA 9 MC75172B MC75174B Figure 18. Typical EIA–485 System En R #1 En TTL D #1 5 “off” drivers (@ 0.06 U.L. each), +8 receivers (@ 1.0 U.L. each) = 8.3 Unit Loads RT = 120 Ω at each end of the cable. En TTL D #2 TTL #3 R RT 120 Ω Twisted Pair TTL R #2 TTL TTL D #3 En TTL D #4 TTL R #6 En TTL D #6 RT TTL #4 R En TTL #8 R R #7 TTL R #5 TTL TTL D #5 NOTES: 1. Terminating resistors RT must be located at the physical ends of the cable. 2. Stubs should be as short as possible. 3. Circuit ground of all drivers and receivers must be connected via a dedicated wire within the cable. Do not rely on chassis ground or power line ground. 10 MOTOROLA ANALOG IC DEVICE DATA MC75172B MC75174B Comparing System Requirements Characteristic GENERATOR (DRIVER) Output Impedance (Note 1) Open Circuit Voltage Differential Single–Ended Loaded Differential Voltage Differential Voltage Balance Output Common Mode Range Offset Voltage Offset Voltage Balance Short Circuit Current Leakage Current (VCC = 0) Output Rise/Fall Time (Note 2) RECEIVER Input Sensitivity Input Bias Voltage Input Common Mode Range Dynamic Input Impedance Vth Vbias Vcm Rin ± 200 mV Zout VOCD VOCS VOD ∆VOD VCM VOS ∆VOS IOS IOLK tr, tf Not Specified 1.5 to 6.0 V 6.0 V Symbol EIA–485 EIA–422–A V.11 and X.27 50 10 100 Ω t 100 Ω p 6.0 V p 6.0 V q 2.0 V or q 0.5 p 400 mV Not Specified t 1.5 to 5.0 V, w/54 Ω load t 200 mV –7.0 to +12 V –1.0 VOCD, w/100 Ω load p 6.0 V, w/3.9 kΩ, Load p 6.0 V, w/3.9 kΩ, Load q 2.0 V or q 0.5 VOCD, w/100 Ω load t 400 mV t 200 mV p 250 mA for –7.0 to 12 V Not Specified t VOS t 3.0 V p 3.0 V p 400 mV p 150 mA to ground p 100 µA to –0.25 V p 0.1 TB or p 20 ns, w/100 Ω load ± 200 mV thru 6.0 V Not Specified p 3.0 V t 400 mV p 150 mA to ground p 100 µA to ± 0.25 V 0.1 TB or 20 ns, w/100 Ω load ± 300 mV p 0.3 TB, w/54 Ω/1150 pF load p p p 3.0 V p 3.0 V q 4 kΩ p 3.0 V q 4 kΩ –7.0 to 12 V Spec number of U.L. –7.0 to 7.0 V –7.0 to 7.0 V NOTES: 1. Compliance with V.11 and X.27 (Blue book) output impedance requires external resistors in series with the outputs of the MC75172B and MC75174B. 2. TB = Bit time. Additional Information Copies of the EIA Recommendations (EIA–485 and EIA–422–A) can be obtained from the Electronics Industries Association, Washington, D.C. (202–457–4966). Copies of the CCITT Recommendations (V.11 and X.27) can be obtained from the United States Department of Commerce, Springfield, VA (703–487–4600). MOTOROLA ANALOG IC DEVICE DATA 11 MC75172B MC75174B OUTLINE DIMENSIONS P SUFFIX PLASTIC PACKAGE CASE 648–08 ISSUE R 9 –A– 16 B 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 F S C L –T– H G D 16 PL SEATING PLANE K J TA M M 0.25 (0.010) M –A– 20 11 DW SUFFIX PLASTIC PACKAGE CASE 751D–04 (SO–20L) ISSUE E –B– 1 10 10X P 0.010 (0.25) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 J 20X D M 0.010 (0.25) TA S B S F R X 45 _ C –T– 18X SEATING PLANE G K M Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 12 ◊ *MC75172B/D* MOTOROLA ANALOG IC DEVICE DATA MC75172B/D This datasheet has been downloaded from: www.DatasheetCatalog.com Datasheets for electronic components.