MOC2A6010-10

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MOC2A60–10/D POWER OPTO™ Isolator 2 Amp Zero–Cross Triac Output This device consists of a gallium arsenide infrared emitting diode optically coupled to a zero–cross triac driver circuit and a power triac. It is capable of driving a load of up to 2 amps (rms) directly, on line voltages from 20 to 280 volts ac (rms). • Provides Normally Open Solid State AC Output with 2 Amp Rating • 70 Amp Single Cycle Surge Capability • Zero–Voltage Turn–on and Zero–Current Turn–off • High Input–Output Isolation of 3750 vac (rms) • Static dv/dt Rating of 400 Volts/µs Guaranteed • 2 Amp Pilot Duty Rating Per UL508 W117 (Overload Test) and W118 (Endurance Test) [File No. 129224] • CSA Approved [File No. CA77170–1]. • SEMKO Approved Certificate #9507228 • Exceeds NEMA 2–230 and IEEE472 Noise Immunity Test Requirements (See Fig.14) DEVICE RATINGS (TA = 25°C unless otherwise noted) Rating INPUT LED Forward Current — Maximum Continuous Forward Current — Maximum Peak (PW = 100µs, 120 pps) Reverse Voltage — Maximum OUTPUT TRIAC Output Terminal Voltage — Maximum Transient (1) Operating Voltage Range — Maximum Continuous (f = 47 – 63 Hz) On–State Current Range (Free Air, Power Factor ≥ 0.3) Non–Repetitive Single Cycle Surge Current — Maximum Peak (t = 16.7 ms) Main Terminal Fusing Current (t = 8.3 ms) Load Power Factor Range Junction Temperature Range TOTAL DEVICE Input–Output Isolation Voltage — Maximum(2) 47 – 63 Hz, 1 sec Duration Thermal Resistance — Power Triac Junction to Case (See Fig. 15) Ambient Operating Temperature Range Storage Temperature Range Lead Soldering Temperature — Maximum (1/16″ from Case, 10 sec Duration) VISO RθJC Toper Tstg TL 3750 8.0 – 40 to +100 – 40 to +150 260 Vac(rms) °C/W °C °C °C VDRM VT IT(rms) ITSM I2T PF TJ 600 20 to 280 0.03 to 2.0 70 26 0.3 to 1.0 – 40 to 125 V(pk) Vac(rms) A A A2sec — °C IF IF(pk) VR 50 1.0 6.0 mA A V Symbol Value Unit MOC2A60-10 MOC2A60-5* *Motorola Preferred Device OPTOISOLATOR 2 AMP ZERO CROSS TRIAC OUTPUT 600 VOLTS 7 23 9 CASE 417–02 Style 2 PLASTIC PACKAGE CASE 417A–02 Style 1 PLASTIC PACKAGE CASE 417B–01 Style 1 PLASTIC PACKAGE DEVICE SCHEMATIC 7 3 2 ZVA * 9 * Zero Voltage Activate Circuit 1. Test voltages must be applied within dv/dt rating. 2. Input–Output isolation voltage, VISO, is an internal device dielectric breakdown rating. For this 2. test, pins 2, 3 and the heat tab are common, and pins 7 and 9 are common. POWER OPTO is a trademark of Motorola, Inc. Preferred devices are Motorola recommended choices for future use and best overall value. 1, 4, 5, 6, 8. 2. 3. 7. 9. NO PIN LED CATHODE LED ANODE MAIN TERMINAL 2 MAIN TERMINAL 1 REV 2 ©MotorolaInc. 1995 Motorola, Optoelectronics Device Data 1 MOC2A60-10 MOC2A60-5 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic INPUT LED Forward Voltage (IF = 10 mA) Reverse Leakage Current (VR = 6.0 V) Capacitance OUTPUT TRIAC Off–State Leakage, Either Direction (IF = 0, VDRM = 600 V) Critical Rate of Rise of Off–State Voltage (Static) Vin = 400 vac(pk)) (1)(2) Holding Current, Either Direction (IF = 0, VD = 12 V, IT = 200 mA) COUPLED LED Trigger Current Required to Latch Output Either Direction (Main Terminal Voltage = 2.0 V)(3)(4) MOC2A60–10 MOC2A60–5 IFT(on) IFT(on) VTM VINH dv/dt (c) dv/dt(cm) CISO RISO — — — — 5.0 — — 1012 7.0 3.5 0.96 8.0 — 40,000 1.3 1014 10 5.0 1.3 10 — — — — mA mA V V V/µS V/µS pF Ω IDRM dv/dt(s) IH — 400 — 0.25 — 10 10 — — µA V/µs mA VF IR C 1.00 — — 1.17 1.0 18 1.50 100 — V µA pF Symbol Min Typ Max Unit On–State Voltage, Either Direction (IF = Rated IFT(on), ITM = 2.0 A) Inhibit Voltage, Either Direction (IF = Rated IFT(on))(5) (Main Terminal Voltage above which device will not trigger) Commutating dv/dt (Rated VDRM, IT = 30 mA – 2.0 A(rms), TA = – 40 ± 100°C, f = 60 Hz)(2) Common–mode Input–Output dv/dt(2) Input–Output Capacitance (V = 0, f = 1.0 MHz) Isolation Resistance (VI–O = 500 V) 1. 2. 3. 3. 4. 5. Per EIA/NARM standard RS–443, with VP = 200 V, which is the instantaneous peak of the maximum operating voltage. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 43. All devices are guaranteed to trigger at an IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between the device’s maximum IFT(on) limit and the Maximum Rating of 50 mA. Current–limiting resistor required in series with LED. Also known as “Zero Voltage Turn–On.” TYPICAL CHARACTERISTICS 100 I F, FORWARD LED CURRENT (mA) 2.00 1.80 V F, FORWARD VOLTAGE (V) 1.60 1.40 1.20 1.00 0.80 –20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 100 120 1 PULSE ONLY PULSE OR DC 80 60 40 TA = – 40°C 25°C 100°C 10 100 IF, FORWARD CURRENT (mA) 1000 20 0 –40 Figure 1. Maximum Allowable Forward LED Current versus Ambient Temperature Figure 2. LED Forward Voltage versus LED Forward Current 2 Motorola Optoelectronics Device Data MOC2A60-10 MOC2A60-5 1.60 I IFT , FORWARD TRIGGER CURRENT 1.50 1.40 1.30 1.20 1.10 1.00 0.90 0.80 –40 –20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 100 120 WORST CASE UNIT NORMALIZED TO TA = 25°C I T, TERMINAL CURRENT (A) 2.4 2.0 1.6 1.2 0.8 0.4 0.0 –40 –20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 100 120 Figure 3. Forward LED Trigger Current versus Ambient Temperature Figure 4. Maximum Allowable On–State RMS Output Current (Free Air) versus Ambient Temperature 2.20 VTM, MAIN TERMINAL VOLTAGE (V) PD, POWER DISSIPATION (WATTS) 2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.03 TJ = 25°C 100°C 0.1 1.0 ITM, INSTANTANEOUS ON–STATE CURRENT (A) PULSE ONLY PULSE OR DC 2.5 2.0 1.5 MAXIMUM 1.0 MEAN 0.5 0.0 0.01 0.1 1.0 IT, MAIN TERMINAL CURRENT (A) 10 Figure 5. On–State Voltage Drop versus Output Terminal Current Figure 6. Power Dissipation versus Main Terminal Current TA = 25°C TJ , JUNCTION TEMPERATURE (°C) 100 80 60 40 20 0 0.01 IDRM , LEAKAGE CURRENT (NORMALIZED) 120 100 10 NORMALIZED TO TA = 25°C 1.0 0.1 0.1 1 IT, MAIN TERMINAL CURRENT (A) 10 0.01 – 40 – 20 0 20 40 60 80 TA, AMBIENT TEMPERATURE (°C) 100 120 Figure 7. Junction Temperature versus Main Terminal RMS Current (Free Air) Figure 8. Leakage with LED Off versus Ambient Temperature Motorola Optoelectronics Device Data 3 MOC2A60-10 MOC2A60-5 2.00 1.80 IH , HOLDING CURRENT (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 – 40 – 20 0 + 25 + 40 + 60 TA, AMBIENT TEMPERATURE (°C) + 80 + 100 0 – 40 IT = 30 mA – 2A(RMS) F = 60 Hz – 20 40 0 20 60 80 TA, AMBIENT TEMPERATURE (°C) 100 120 NORMALIZED TO TA = 25°C dv / dt (V/ µS) 100 1000 STATIC 10 COMMUTATING Figure 9. Holding Current versus Ambient Temperature Figure 10. dv/dt versus Ambient Temperature LED INPUT VOLTAGE PIN 7 TO 9 TURN ON POINTS Figure 11. Operating Waveforms MOC2A60 VCC R1 ZVA * LOAD *ZERO VOLTAGE ACTIVATE CIRCUIT R2 C1 MOV Select the value of R1 according to the following formulas: [1] R1 = (VCC – VF) / Max. IFT (on) per spec. [2] R1 = (VCC – VF) / 0.050 Typical values for C1 and R2 are 0.01 µF and 39 Ω, respectively. You may adjust these values for specific applications. The maximum recommended value of C1 is 0.022 µF. See application note AN1048 for additional information on component values. The MOV may or may not be needed depending upon the characteristics of the applied ac line voltage. For applications where line spikes may exceed the 600 V rating of the MOC2A60, an MOV is required. Figure 12. Typical Application Circuit 4 Motorola Optoelectronics Device Data MOC2A60-10 MOC2A60-5 Use care to maintain the minimum spacings as shown. Safety and regulatory requirements dictate a minimum of 8.0 mm between the closest points between input and output conducting paths, Pins 3 and 7. Also, 0.070 inches distance is required between the two output Pins, 7 and 9. Keep pad sizes on Pins 7 and 9 as large as possible for optimal performance. 0.315″ MIN [8 MM MIN] 0.070″ MIN Figure 13. PC Board Layout Recommendations Each device, when installed in the circuit shown in Figure 14, shall be capable of passing the following conducted noise tests: • IEEE 472 (2.5 KV) • Lamp Dimmer (NEMA Part DC33, w 3.4.2.1) • NEMA ICS 2–230.45 Showering Arc • MIL–STD–461A CS01, CS02 and CS06 DEVICE UNDER TEST 2 3 7 9 NOISE SOURCE AC SUPPLY 10Ω IF = RATED IF 0.022µF MOV 150V Z LOAD Figure 14. Test Circuit for Conducted Noise Tests NO ADDITIONAL HEATSINK TJ JUNCTION TEMPERATURE OF MOC2A60 . . . OUTPUT CHIP TC RθCA TA { RθJC HEAT FLOW TJ WITH ADDITIONAL HEATSINK TS TC RθJC RθCS RθSA } TA AMBIENT AIR TEMPERATURE Terms in the model signify: TA = Ambient temperature RθSA = Thermal resistance, heat sink to ambient TS = Optional additional RθCA = Thermal resistance, case to ambient TS = heat sink temperature RθCS = Thermal resistance, heat sink to case TC = Case temperature RθJC = Thermal resistance, junction to case TJ = Junction temperature PD = Power dissipation Values for thermal resistance components are: RθCA = 36°C/W/in maximum Values for thermal resistance components are: RθJC = 8.0°C/W maximum The design of any additional heatsink will determine the values of RθSA and RθCS. TC – TA = PD (RθCA) TC – TA = PD (RθJC) + RθSA), where PD = Power Dissipation in Watts. Figure 15. Approximate Thermal Circuit Model Thermal measurements of RθJC are referenced to the point on the heat tab indicated with an ‘X’. Measurements should be taken with device orientated along its vertical axis. Motorola Optoelectronics Device Data 5 MOC2A60-10 MOC2A60-5 PACKAGE DIMENSIONS C –A– E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.018 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.695 0.715 0.100 BSC STYLE 2: PIN 2. 3. 7. 9. MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 17.65 18.16 2.54 BSC S P –T– SEATING PLANE –B– 2 3 7 9 N K V G D 4 PL 0.13 (0.005) M L H TA M J DIM A B C D E G H J K L N P S V B M LED CATHODE LED ANODE TRIAC MT TRIAC MT CASE 417–02 PLASTIC STANDARD HEAT TAB ISSUE C ORDER “F” SUFFIX HEAT TAB OPTION (EX: MOC2A60–10F) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. –A– U Z RADIUS Y W Q C E X S R –B– P 2 3 7 9 N –T– SEATING PLANE K V G L H M J D 4 PL 0.13 (0.005) DIM A B C D E G H J K L N P Q R S U V W X Y Z INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.018 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.057 0.067 0.734 0.754 0.840 0.870 0.593 0.613 0.100 BSC 0.074 0.094 0.265 0.295 0.079 0.089 0.026 0.036 STYLE 1: PIN 2. 3. 7. 9. MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 1.45 1.70 18.64 19.15 21.34 22.10 15.06 15.57 2.54 BSC 1.88 2.39 6.73 7.49 2.01 2.26 0.66 0.91 TA M B M CASE 417A–02 PLASTIC FLUSH MOUNT HEAT TAB ISSUE A LED CATHODE LED ANODE TRIAC MT TRIAC MT 6 Motorola Optoelectronics Device Data MOC2A60-10 MOC2A60-5 PACKAGE DIMENSIONS — CONTINUED ORDER “C” SUFFIX HEAT TAB OPTION (EX: MOC2A60–10C) C –A– E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.965 1.005 0.416 0.436 0.170 0.190 0.025 0.035 0.040 0.060 0.400 BSC 0.040 0.060 0.012 0.060 0.134 0.154 0.200 BSC 0.190 0.210 0.023 0.043 0.439 0.529 0.100 BSC MILLIMETERS MIN MAX 24.51 25.53 10.57 11.07 4.32 4.83 0.64 0.89 1.02 1.52 10.16 BSC 1.02 1.52 0.30 0.46 3.40 3.91 5.08 BSC 4.83 5.33 0.58 1.09 11.15 13.44 2.54 BSC SP 2 3 7 9 –B– N –T– SEATING PLANE K V G D 4 PL 0.13 (0.005) M T A M L J H DIM A B C D E G H J K L N P S V B M STYLE 1: PIN 2. 3. 7. 9. LED CATHODE LED ANODE TRIAC MT TRIAC MT CASE 417B–01 PLASTIC CUT HEAT TAB ISSUE O Motorola Optoelectronics Device Data 7 MOC2A60-10 MOC2A60-5 Motorola reserves the right to make changes without further notice to any products herein. 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