MPX50

MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX50/D 50 kPa Uncompensated Silicon Pressure Sensors The MPX50 silicon piezoresistive pressure sensor provides a very accurate and linear voltage output — directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. Features • Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • 60 mV Span (Typ) • Differential and Gauge Options • ± 0.25% (Max) Linearity Application Examples • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure sensor chip. PIN 3 + VS PIN 2 + Vout X–ducer PIN 4 – Vout PIN 1 1 2 MPX50 SERIES 0 to 50 kPa (0 – 7.25 psi) 60 mV FULL SCALE SPAN (TYPICAL) BASIC CHIP CARRIER ELEMENT CASE 344–15, STYLE 1 DIFFERENTIAL PORT OPTION CASE 344C–01, STYLE 1 NOTE: Pin 1 is the notched pin. PIN NUMBER Gnd +Vout 3 4 VS –Vout Figure 1. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the X–ducer is directly proportional to the differential pressure applied. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Senseon and X–ducer are trademarks of Motorola, Inc. REV 5 Motorola Sensor Device Data © Motorola, Inc. 1997 1 MPX50 SERIES MAXIMUM RATINGS Rating Overpressure(8) (P1 > P2) Burst Pressure(8) (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Pburst Tstg TA Value 200 500 – 40 to +125 – 40 to +125 Unit kPa kPa °C °C OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 50 kPa) Temperature Hysteresis(5) (– 40°C to +125°C) Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm–Up Offset Stability(9) Symbol POP VS Io VFSS Voff ∆V/∆P — — — TCVFSS TCVoff TCR Zin Zout tR — — Min 0 — — 45 0 — – 0.25 — — – 0.22 — 0.21 400 750 — — — Typ — 3.0 6.0 60 20 1.2 — ± 0.1 ± 0.5 — ± 15 — — — 1.0 20 ± 0.5 Max 50 6.0 — 90 35 — 0.25 — — – 0.16 — 0.27 550 1800 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/°C µV/°C %Zin/°C Ω Ω ms ms %VFSS MECHANICAL CHARACTERISTICS Characteristic Weight (Basic Element Case 344–15) Common Mode Line Pressure(7) Symbol — — Min — — Typ 2.0 — Max — 690 Unit Grams kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • TCR: Zin deviation with minimum rated pressure applied, over the temperature range of – 40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. 8. Exposure beyond these limits may cause permanent damage or degradation to the device. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data MPX50 SERIES TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX50 series over temperature. The X–ducer piezoresistive pressure sensor element is a semiconductor device which gives an electrical output signal proportional to the pressure applied to the device. This device uses a unique transverse voltage diffused semiconductor strain gauge which is sensitive to stresses produced in a thin silicon diaphragm by the applied pressure. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2050 series sensors. Several approaches to external temperature compensation over both – 40 to +125°C and 0 to + 80°C ranges are presented in Motorola Applications Note AN840. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (see Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. 70 100 90 80 70 OUTPUT (mVdc) 60 50 40 30 20 OFFSET (TYP) 1 10 2 3 20 4 30 5 40 6 7 50 8 10 0 0 PRESSURE (kPA) OFFSET (VOFF) MAX POP MPX50 VS = 3 Vdc P1 > P2 + 25°C 60 – 40°C 50 OUTPUT (mVdc) ACTUAL 40 30 20 THEORETICAL SPAN (VFSS) + 125°C SPAN RANGE (TYP) LINEARITY 10 0 PSI 0 kPa 0 PRESSURE DIFFERENTIAL Figure 2. Output versus Pressure Differential Figure 3. Linearity Specification Comparison SILICONE DIE COAT WIRE BOND DIE P1 STAINLESS STEEL METAL COVER EPOXY CASE LEAD FRAME Figure 4. Cross–Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344–15). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX50 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉ P2 RTV DIE BOND 3 MPX50 SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX Part Number MPX50D MPX50DP MPX50GP MPX50GVP MPX50GS MPX50GVS MPX50GSX MPX50GVSX Case Type 344–15 344C–01 344B–01 344D–01 344E–01 344A–01 344F–01 344G–01 pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap Side with Port Attached Stainless Steel Cap ORDERING INFORMATION MPX50 series pressure sensors are available in differential and gauge configurations. Devices are available with basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type DiT Basic Element Ported Elements Options Oi Differential Differential Gauge Gauge Vacuum Gauge Stovepipe Gauge Vacuum Stovepipe Gauge Axial Gauge Vacuum Axial Case Type C T Case 344–15 Case 344C–01 Case 344B–01 Case 344D–01 Case 344E–01 Case 344A–01 Case 344F–01 Case 344G–01 Order Number MPX50D MPX50DP MPX50GP MPX50GVP MPX50GS MPX50GVS MPX50GSX MPX50GVSX Device Marking MPX50D MPX50DP MPX50GP MPX50GVP MPX50D MPX50D MPX50D MPX50D 4 Motorola Sensor Device Data MPX50 SERIES PACKAGE DIMENSIONS NOTES: C R M B –A– N PIN 1 1 2 3 4 POSITIVE PRESSURE (P1) 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_ NOM 0.475 0.495 0.430 0.450 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_ NOM 12.07 12.57 10.92 11.43 L –T– J SEATING PLANE POSITIVE PRESSURE (P1) G F 4 PL D 0.136 (0.005) M TA M DIM A B C D F G J L M N R STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344–15 ISSUE W PORT #2 VACUUM PRESSURE (P2) C POSITIVE PRESSURE (P1) PIN 1 A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 GROUND + OUTPUT + SUPPLY – OUTPUT MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 –B– V 12 34 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N –T– TB M STYLE 1: PIN 1. 2. 3. 4. CASE 344A–01 ISSUE B Motorola Sensor Device Data 5 MPX50 SERIES PACKAGE DIMENSIONS — CONTINUED SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC –Q– B 12 34 PIN 1 K S F G D 4 PL 0.13 (0.005) –P– 0.25 (0.010) J C M TQ S DIM A B C D F G H J K L N P Q R S U M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344B–01 ISSUE B V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1234 –P– –T– J C 0.13 (0.005) M K S –T– 0.25 (0.010) M TQ S G D 4 PL F TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344C–01 ISSUE B 6 Motorola Sensor Device Data MPX50 SERIES PACKAGE DIMENSIONS — CONTINUED –A– –T– R N –Q– SEATING PLANE PORT #2 VACUUM (P2) U L H POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC B 12 34 K S PIN 1 DIM A B C D F G H J K L N P Q R S U C J –P– 0.25 (0.010) M F TQ S G D 4 PL 0.13 (0.005) M TS S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344D–01 ISSUE B PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K N R S V INCHES MIN MAX 0.690 0.720 0.245 0.255 0.780 0.820 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.178 0.186 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 4.52 4.72 5.59 6.10 4.62 4.93 –B– V 43 21 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.13 (0.005) M N –T– TB M GROUND + OUTPUT + SUPPLY – OUTPUT CASE 344E–01 ISSUE B Motorola Sensor Device Data 7 MPX50 SERIES PACKAGE DIMENSIONS — CONTINUED –T– C E A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R PORT #1 POSITIVE PRESSURE (P1) B –P– 0.25 (0.010) M PIN 1 TQ M 4 3 2 1 S K DIM A B C D E F G J K N P Q R S U V J F D 4 PL 0.13 (0.005) G STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT M TP S Q S CASE 344F–01 ISSUE B –T– C E POSITIVE PRESSURE (P1) A U –Q– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92 V N R B PORT #2 VACUUM (P2) PIN 1 –P– 0.25 (0.010) M TQ M 1 2 3 4 S K DIM A B C D E F G J K N P Q R S U V J F D 4 PL 0.13 (0.005) G M TP S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (–) OUT CASE 344G–01 ISSUE B 8 Motorola Sensor Device Data MPX50 SERIES Motorola reserves the right to make changes without further notice to any products herein. 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Motorola Sensor Device Data 9 MPX50 SERIES Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax™: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 INTERNET: http://motorola.com/sps 10 ◊ MPX50/D Motorola Sensor Device Data