BL02RN1R2N1A

Spec. No. JENF243G – 0004G-01 Reference Only P 1 / 12 Ferrite Bead Inductor BL02/BL03 Series Reference Specification 1. Scope This reference specification applies Ferrite Bead Inductor (Radial Type). 2. Part Numbering (Ex.) BL 02 Product ID Series RN 1 Bead Core Number of Material Bead Core (*1) R1 : Radial Straight Type R2 : Radial Straight and Wave Formed Leads R3 : Radial Crimp Type R2 N (*1)Lead (*2)Lead Length, Type Space (*2) J : Lead Length M : Lead Length N : Lead Length P : Lead Length Q : Lead Length 5.0mm 10.0mm 16.5mm 18.5mm 20.0mm 1 (*3)Lead Diameter (*3) 1 : 0.60mm 2 : 0.65mm A (*4)Packaging (*4) A : Ammo Pack B : Bulk 3. Rating Customer Part Number MURATA Part Number BL02RN1R2M2B BL02RN1R2N1A BL02RN1R2Q1A BL02RN1R2P1A BL02RN1R3J2B BL02RN1R3N1A BL02RN2R1M2B BL02RN2R1N1A BL02RN2R1Q1A BL02RN2R1P1A BL02RN2R3J2B BL02RN2R3N1A BL03RN2R1M1B BL03RN2R1N1A BL03RN2R1Q1A BL03RN2R1P1A Inductance (1MHz) Rated Current DC Resistance 7A 0.45 H min. 6A 7A 6A 7A 1.10 H min. 6A 0.02  max. 7A 6A 0.45 H min. 6A · Operating Temperature : - 40 °C to + 85 °C (1) H1 : See item 10.1. Remark H1 size Packing (1) mm Style － 16.5±0.5 20.0±0.5 18.5±0.5 － 16.5±0.5 － 16.5±0.5 20.0±0.5 18.5±0.5 － 16.5±0.5 － 16.5±0.5 20.0±0.5 18.5±0.5 Bulk Ammo Pack Bulk Ammo Pack Bulk Ammo Pack Bulk Ammo Pack Bulk Ammo Pack Unit Mass (Typical value) 0.34g 0.40g 0.42g 0.41g 0.34g 0.42g 0.57g 0.63g 0.65g 0.64g 0.57g 0.65g 0.21g 0.29g 0.30g 0.29g · Storage Temperature : - 40 °C to + 100 °C 4. Style and Dimension Bulk : See item 9. / Taping : See item 10.1. ■ Equivalent Circuits ( ) Resistance element becomes dominant at high frequencies. 5. Marking No Marking 6. Testing Conditions Temperature : Ordinary Temp. 15°C to 35°C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Temperature : 20°C ± 2°C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86kPa to 106kPa MURATA MFG CO., LTD. Spec. No. JENF243G – 0004G-01 Reference Only P 2 / 12 7. Electrical Performance No. Item Specification 7.1 Bend Bonding Strength Appearance : No damage. 7.2 Drop Appearance : No damage. 7.3 Solderability Along the circumference of terminal shall be covered with new solder at least 75% 7.4 Resistance to Soldering Heat Appearance : No damage. 7.5 Resistance to Soldering iron 7.6 Vibration 7.7 Humidity 7.8 Thermal Shock 7.9 Heat Resistance Appearance : No damaged. Inductance change : within ± 15% Test Method Applying Force : 9.8N Applying direction : The lead wire in the direction of the axes. Keeping Time : 1s to 5s Products shall be dropped on the plate of oak. Hight : 75 cm The Number of Times : 3 times Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 245 ± 5 °C Immersion Time : 2 ± 0.5 s Flux : Ethanol solution of rosin, 25(wt)% Pre-heat : 150 ± 10 °C, 60 ~ 90 s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 260 ± 5 °C Immersion Time : 10 ± 1 s Immersion Depth : 1.6 ± 0.8 mm from the end of Ferrite Bead Immersion and emersion rates : 25 ± 5 mm / s Tip Temperature : 350 °C ± 10 °C Soldering Time : 3 s ± 0.5 s Putting place of soldering iron : lead wire (1.6±0.8mm from the bottom of the Ferrite Bead) Do not touch the Ferrite Bead directly with the tip of the soldering iron. Oscillation Frequency : 10 Hz to 2000 Hz for 20 min. Total Amplitude or acceleration : 2 1.5 mm or 196 m/s Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) Temperature : 85 °C ± 2 °C Humidity : 80 %(RH) to 85 %(RH) Time : 500 h (+ 24h , - 0h) Then measured after exposure in the room condition for 1 to 2 hours. 1 cycle : 1 step : - 40°C (+0,-3) °C / 30 min. (+3,-0) min. 2 step : Ordinary Temp. / within 1 min. 3 step : + 85°C (+3,-0) °C / 30min. (+3,-0) min. 4 step : Ordinary Temp. / within 1min. Total of 10 cycles Then measured after exposure in the room condition for 4 to 48 hours. Temperature : 85 °C ± 3 °C Time : 1000 h (+ 48h , - 0h) Then measured after exposure in the room condition for 1 to 2 hours. MURATA MFG CO., LTD. Reference Only Spec. No. JENF243G – 0004G-01 P 3 / 12 8. Frequency-Impedance Characteristics (Typical)  BL02RN1 Type  BL02RN2 Type  BL03RN2 Type 9. Style and Dimension (Bulk) (1) BL02RN1R2M2B (2) BL02RN1R3J2B  3.4±0.2 12.0 max. 5.0±0.8  0.65   0.65 5.0±1.0 10.0±1.0 5.0±0.8   15.0 min. 7.5 max.   3.4±0.2 8.0 max. 15.0 min. 7.5 max.  There is a excess bond stick on the wire. (4) BL02RN2R3J2B  3.4±0.2  3.4±0.2 12.0 max. 9.0 max. 5.0±0.8  0.65  0.65 5.0±1.0 10.0±1.0 5.0±0.8 15.0 min. 7.5 max. 9.0 max. 15.0 min. (3) BL02RN2R1M2B (5) BL03RN2R1M1B  2.3 max. 10.0±1.0 5.0±0.8 15.0 min. 6.5 max. 8.3 max.  0.60 (in mm) MURATA MFG CO., LTD. Reference Only Spec. No. JENF243G – 0004G-01 P 4 / 12 10. Specification of Packaging 10.1. Style and Dimension (1) BL02RN1R2□1A Series S P2 T D P H  P1 F H1 W0 t l D0 P0  There is a excess bond stick on the wire. Symbol Description P Pitch of component P0 F P1 Pitch of sprocket hole Lead spacing Hole center to lead Hole center to component center Body width Height of bead Deviation along tape, left or right Carrier tape width Position of sprocket hole P2 D H S W W1 H1 l D0 d t h1 h2 L W0 W2 T  h2 L W1 W W2  h1 d Lead length between sprocket hole and forming position Protruding length Diameter of sprocket hole Lead Diameter Total tape thickness Deviation across tape Deviation across tape rear Cutting position of failure Hold down tape width Hold down tape position Body thickness Dimension (mm) Remarks Product inclination S determines tolerance 12.7 12.7 ± 0.2 5.0 (+0.8 , -0.2) 3.85 ± 0.7 6.35 ± 1.3 Tape deviation in feeding direction 7.5 max. 7.5 max. ± 1.0 18.0 ± 0.5 9.0 (+0 , -0.5) Lead Length Number : N Lead Length Number : Q Lead Length Number : P Tape with deviation 16.5 ± 0.5 20.0 ± 0.5 18.5 ± 0.5 + 0.5 ~ - 1.0  4.0 ± 0.1  0.60 0.7 ± 0.2 1.0 max. 11.0 (+0 , -1.0) 12.0 ± 0.5 1.5 ± 1.5 3.4 ± 0.2 MURATA MFG CO., LTD. Including bonding tape thickness Spec. No. JENF243G – 0004G-01 Reference Only (2) BL02RN1R3N1A D P P2 P 5 / 12 S T H  d H1 W2 F  h1  h2 P0 D0 l W0 L W1 W P1 t  There is a excess bond stick on the wire. Symbol Description P Pitch of component P0 F P1 Pitch of sprocket hole Lead spacing Hole center to lead Hole center to component center Body width Height of bead Deviation along tape, left or right Carrier tape width Position of sprocket hole P2 D H S W W1 H1 l D0 d t h1 h2 L W0 W2 T Lead length between sprocket hole and forming position Protruding length Diameter of sprocket hole Lead Diameter Total tape thickness Deviation across tape Deviation across tape rear Cutting position of failure Hold down tape width Hold down tape position Body thickness Dimension (mm) 12.7 Remarks Product inclination S determines tolerance 12.7 ± 0.2 5.0 (+0.8 , -0.2) 3.85 ± 0.7 6.35 ± 1.3 Tape deviation in feeding direction 8.0 max. 12.0 max. ± 1.0 18.0 ± 0.5 9.0 (+0 , -0.5) Tape with deviation 16.5 ± 0.5 + 0.5 ~ - 1.0  4.0 ± 0.1  0.60 0.7 ± 0.2 1.0 max. 11.0 (+0 , -1.0) 12.0 ± 0.5 1.5 ± 1.5 3.4 ± 0.2 MURATA MFG CO., LTD. Including bonding tape thickness Reference Only Spec. No. JENF243G – 0004G-01 (3) BL02RN2R1□1A Series P 6 / 12 S P2 T D H P H1 d  h1  h2 W0 L D0 t P0 l W1 W W2 P1 F Symbol Description P Pitch of component P0 F P1 Pitch of sprocket hole Lead spacing Hole center to lead Hole center to component center Body width Height of bead Deviation along tape, left or right Carrier tape width Position of sprocket hole P2 D H S W W1 H1 l D0 d t h1 h2 L W0 W2 T Lead length between sprocket hole and forming position Protruding length Diameter of sprocket hole Lead Diameter Total tape thickness Deviation across tape Deviation across tape rear Cutting position of failure Hold down tape width Hold down tape position Body thickness Dimension (mm) Remarks Product inclination S determines tolerance 12.7 12.7 ± 0.2 5.0 (+0.8 , -0.2) 3.85 ± 0.7 6.35 ± 1.3 Tape deviation in feeding direction 9.0 max. 7.5 max. ± 1.0 18.0 ± 0.5 9.0 (+0 , -0.5) Lead Length Number : N Lead Length Number : Q Lead Length Number : P Tape with deviation 16.5 ± 0.5 20.0 ± 0.5 18.5 ± 0.5 + 0.5 ~ - 1.0  4.0 ± 0.1  0.60 0.7 ± 0.2 1.0 max. 11.0 (+0 , -1.0) 12.0 ± 0.5 1.5 ± 1.5 3.4 ± 0.2 MURATA MFG CO., LTD. Including bonding tape thickness Reference Only Spec. No. JENF243G – 0004G-01 (4) BL02RN2R3N1A P D S T H P2 P 7 / 12 H1 d  h1  h2 W0 L W2 F D0 t P0 l W W1 P1 Symbol Description P Pitch of component P0 F P1 Pitch of sprocket hole Lead spacing Hole center to lead Hole center to component center Body width Height of bead Deviation along tape, left or right Carrier tape width Position of sprocket hole P2 D H S W W1 H1 l D0 d t h1 h2 L W0 W2 T Lead length between sprocket hole and forming position Protruding length Diameter of sprocket hole Lead Diameter Total tape thickness Deviation across tape Deviation across tape rear Cutting position of failure Hold down tape width Hold down tape position Body thickness Dimension (mm) 12.7 Remarks Product inclination S determines tolerance 12.7 ± 0.2 5.0 (+0.8 , -0.2) 3.85 ± 0.7 6.35 ± 1.3 Tape deviation in feeding direction 9.0 max. 12.0 max. ± 1.0 18.0 ± 0.5 9.0 (+0 , -0.5) Tape with deviation 16.5 ± 0.5 + 0.5 ~ - 1.0  4.0 ± 0.1  0.60 0.7 ± 0.2 1.0 max. 11.0 (+0 , -1.0) 12.0 ± 0.5 1.5 ± 1.5 3.4 ± 0.2 MURATA MFG CO., LTD. Including bonding tape thickness Reference Only Spec. No. JENF243G – 0004G-01 P 8 / 12 S (5) BL03RN2R1□1A Series P2 D T H P H1 d  h1  h2 W0 L D0 t P0 l W1 W W2 P1 F Symbol Description P Pitch of component P0 F P1 Pitch of sprocket hole Lead spacing Hole center to lead Hole center to component center Body width Height of bead Deviation along tape, left or right Carrier tape width Position of sprocket hole P2 D H S W W1 H1 l D0 d t h1 h2 L W0 W2 T Lead length between sprocket hole and forming position Dimension (mm) Remarks Product inclination S determines tolerance 12.7 12.7 ± 0.2 5.0 (+0.8 , -0.2) 3.85 ± 0.7 6.35 ± 1.3 Tape deviation in feeding direction 8.3 max. 6.5 max. ± 1.0 18.0 ± 0.5 9.0 (+0 , -0.5) Lead Length Number : Q Lead Length Number : P Protruding length Diameter of sprocket hole Lead Diameter Total tape thickness Deviation across tape Deviation across tape rear Cutting position of failure Hold down tape width Hold down tape position Body thickness Tape with deviation 16.5 ± 0.5 20.0 ± 0.5 18.5 ± 0.5 Lead Length Number : N + 0.5 ~ - 1.0  4.0 ± 0.1  0.60 0.7 ± 0.2 Including bonding tape thickness 1.0 max. 11.0 (+0 , -1.0) 12.0 ± 0.5 1.5 ± 1.5 2.3 max. 10.2. Supplement condition of taping (1) A maximum of 0.3% of the components quantity per reel or Ammo pack may be missing without consecutive missing components. (2) The adhesive power of the tape shall have over 2.94N at the following condition. W 2.94N Adhesive tape Carrier tape MURATA MFG CO., LTD. Spec. No. JENF243G – 0004G-01 Reference Only (3) Splicing method of tape 1. Carrier tape Overall thickness Direction of feed Hold down tape Carrier tape 30 to 50 Cellophane tape Carrier tape shall be spliced by cellophane tape. Overall thickness shall be less than 1.05 mm max. (in mm) 2. Hold down tape 20 to 30 Direction of feed Hold down tape Hold down tape Carrier tape Overall thickness · Hold down tape shall be spliced with overlapping. · Overall thickness shall be less than 1.05 mm. (in mm) 3. Both carrier tape and hold down tape Both tapes shall be cut zigzag and spliced with splicing tape. 10.3. Leader of tape Not less than 3 consecutive of component shall be missing on both edge of tape. 11. Packing 11.1. Packing quantity The standard packing quantity is as follows. Murata Part Number BL02RN1 Type BL02RN2 Type BL03RN2 Type BL02RN1 Type BL02RN2 Type BL03RN2 Type Quantity (pcs.) 500 Remark Bulk 1000 1500 2000 11.2. Packing Form (1) Bulk Product are packed into a plastic bag. MURATA MFG CO., LTD. Ammo Pack P 9 / 12 Reference Only Spec. No. JENF243G – 0004G-01 P 10 / 12 (2) An ammo pack The tape with inductors is created each 25 pitches and packed zigzag into a case, when case body of the inductor is piled on other body under it. Packing way The size of packing case 120 max. ・BL02RN1R2□1A The hold down tape : Upper The product body :this side zig zag label 340 max. 51 max. 240 max. ・Except for BL02RN1R2□1A 25 pitches (in mm) label 340 max. 51 max. 11.3. Marking of packaging (1) Making for indivisual packaging The following items shall be marked on a label and the label is stuck on the indivisual packaging . Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc 1) « Expression of Inspection No. » □□ OOOO  (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day (3) Serial No. 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (2) Marking for Outside package These indivisual packagings shall be packed in the corrugated cardboard package and the followingitems shall be marked on a label and the label is stuck on the box. Customer name , Purchasing Order Number , Customer Part Number , MURATA part number , RoHS marking (2), Quantity , etc 12. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1) Aircraft equipment (7) Traffic signal equipment (2) Aerospace equipment (8) Disaster prevention / crime prevention equipment (3)Undersea equipment (9) Data-processing equipment (4)Power plant control equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above (5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) MURATA MFG CO., LTD. Reference Only Spec. No. JENF243G – 0004G-01 P 11 / 12 13. Notice 13.1. Soldering (1) Flux, Solder · Rosin-based flux should be used. Do not use strong acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value.) · Use Sn-3.0Ag-0.5Cu solder. T e m p e ra tu re (° C ) (2) Standard flow soldering profile. Pre- heating(in air) Soldering 300 Gradual Cooling (in air) Solder Temperature 250 200 150 150°C 100 Solder Temperature 250 ~ 260 °C 50 Soldering Time 4~6s 1 minutes min. Soldering Time (3) Resistance to soldering iron goes in the following condition that tip temperature is 350 °C max. and soldering time is 5 s max. (4) Products and the leads should not be subjected to any mechanical stress during soldering process. (and also while subjected to the equivalent high temperature.) 13.2. Cleaning conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner ･Isopropyl alcohol (IPA) 2. Aqueous agent ･PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 13.3. Operating Environment (1) Do not use products in corrosive gases such as chlorine gas, acid or sulfide gas. (2) Do not use products in the environment where water, oil or organic solvents may adhere to product. (3) Do not adhere any resin to products, coat nor mold products with any resin (including adhesive) to prevent mechanical and chemical stress on products. 13.4. Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. MURATA MFG CO., LTD. Spec. No. JENF243G – 0004G-01 Reference Only P 12 / 12 (2) Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 14．! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.