BLM18AG331BH1D

Reference Only Spec. No. JENF243A-9129E-01 P.1/9 Chip Ferrite Bead BLM18□□□□□(B/J)H1D Murata Standard Reference Specification [AEC-Q200] 1.Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_(B/J)H Series based on AEC-Q200. 2.Part Numbering (ex.) BL M 18 AG 121 B H 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (4)Characteristics (7)Category(for Automotive Electronics) (2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit (3)Dimension (L×Ｗ) (6)Dimension (T) (B:Standard J:Low profile) (9)Packaging (D:Taping) 3.Rating Customer Part Number MURATA Part Number Impedance () (at 100MHz) (refer to below comment) Typical   26±25％ 30±25％ 70±25％ 100±25％ 120±25％ 220±25％ 330±25％ 470±25％ 600±25％ 1000±25％ 120±25％ 150±25％ 220±25％ 330±25％ 470±25％ 600±25％ 1000±25％ 47±25％ 120±25％ 150±25％ 220±25％ 330±25％ 420±25％ 470±25％ 600±25％ 1000±25％ 1500±25％ 1800±25％ 2200±25％ 2500±25％ BLM18KG260JH1D BLM18KG300JH1D BLM18KG700JH1D BLM18KG101JH1D BLM18KG121JH1D BLM18KG221BH1D BLM18KG331BH1D BLM18KG471BH1D BLM18KG601BH1D BLM18KG102BH1D BLM18AG121BH1D BLM18AG151BH1D BLM18AG221BH1D BLM18AG331BH1D BLM18AG471BH1D BLM18AG601BH1D BLM18AG102BH1D BLM18BD470BH1D BLM18BD121BH1D BLM18BD151BH1D BLM18BD221BH1D BLM18BD331BH1D BLM18BD421BH1D BLM18BD471BH1D BLM18BD601BH1D BLM18BD102BH1D BLM18BD152BH1D BLM18BD182BH1D BLM18BD222BH1D BLM18BD252BH1D  Operating Temperature : -55°C to +150°C 26 30 70 100 120 220 330 470 600 1000 120 150 220 330 470 600 1000 47 120 150 220 330 420 470 600 1000 1500 1800 2200 2500 DC Resistance ( max.) (refer to below ESD Rank comment) 2:2kV Initial Values Values After at 125℃ at 150℃ Testing 4000*1 10*1 0.007 0.012 3300*1 10*1 0.010 0.015 2200*1 10*1 0.022 0.032 1900*1 10*1 0.030 0.040 1900*1 10*1 0.030 0.040 1500*1 10*1 0.050 0.060 1200*1 10*1 0.080 0.095 1000*1 10*1 0.130 0.145 1000*1 10*1 0.150 0.165 800*1 10*1 0.200 0.230 800*1 10*1 0.18 0.28 700*1 10*1 0.25 0.35 700*1 10*1 0.25 0.35 600*1 10*1 0.30 0.40 550*1 10*1 0.35 0.45 2 500*1 10*1 0.38 0.48 *1 *1 450 10 0.50 0.60 500*1 10*1 0.3 0.4 300*1 10*1 0.4 0.5 300*1 10*1 0.4 0.5 250*1 10*1 0.45 0.55 250*1 10*1 0.5 0.6 250*1 10*1 0.55 0.65 250*1 10*1 0.55 0.65 *1 200 10*1 0.65 0.75 200*1 10*1 0.85 0.95 150*1 10*1 1.2 1.3 150*1 10*1 1.5 1.6 150*1 10*1 1.5 1.6 150*1 10*1 1.5 1.6 Rated Current (mA)  Storage Temperature : -55°C to +150°C MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 P.2/9 R a te d C u rre n t ( A ) (*１)Rated Current is derated as right figure depending on the operating temperature. Rated current at 125℃ 85°C Rated current at 125°C 150℃ 0 85 125 125℃ 150℃ Operating Temperature (°C) 4.Style and Dimensions 1.6 ±0.15 0 . 8 ±0 . 1 5 ■ Equivalent Circuit Ｔ 0 . 4 ± 0 .2 : E le c t r o d e (in (inmm) mm) P/N BLM18_BH BLM18_JH ( ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) BLM18_BH：0.005g BLM18_JH：0.004g T(mm) 0.8±0.15 0.6±0.15 5.Marking No marking. 6.Standard Testing Conditions  Unless otherwise specified  Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH))  In case of doubt  Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa 7.Specifications 7-1.Electrical Performance No. Item 7-1-1 Impedance Specification Meet item 3. 7-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent Measuring Equipment : Digital multi meter ＊Except resistance of the Substrate and Wire MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 P.3/9 7-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 No. Stress Test Method 3 High 1000hours at 150 deg C Set for 24hours at room Temperature Exposure temperature, then measured. 4 Temperature Cycling 5 Destructive Physical Analysis Biased Humidity 7 Murata Specification / Deviation Meet Table A after testing. Table A Appearance Impedance Change (at 100MHz) DC Resistance No damage Within ±50% Meet item 3. 1000cycles Meet Table A after testing. -55 deg C to +150 deg C Set for 24hours at room temperature, then measured. Per EIA469 No defects No electrical tests 1000hours at 85 deg C, 85%RH Meet Table B after testing. Apply max rated current. TableB Appearance No damage Impedance Within ±30% Change (for BLM18KG (at 100MHz) Within ±50%) DC Resistance Meet item 3. Meet Table A after testing. If the rated current of parts exceed 10mA, the operating temperature should be 125 deg C. 8 Operational Life Apply 150deg C 1000hours Set for 24hours at room temperature, then measured 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 （Style and Dimensions） No defects 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Condition F 1500g's (14.7N)/0.5ms/ Half sine Meet Table C after testing. Table C 14 Vibration 15 Resistance to Soldering Heat 17 18 Appearance Impedance Change (at 100MHz) DC Resistance No damage Within ±30% Meet item 3. Meet Table C after testing. ESD 5g's(0.049N) for 20 minutes, 12cycles each of 3 orientations Test from 10-2000Hz. Solder temperature 260C+/-5 deg C Immersion time 10s Per AEC-Q200-002 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. Pre-heating:150C +/-10 deg,60s to 90s Meet Table A after testing. Meet Table Ｃ after testing. ESD Rank: Meet Item 3. (Rating) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 P.4/9 AEC-Q200 20 21 22 30 Murata Specification / Deviation Test Method Measured : Impedance No defects Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding tim Per AEC-Q200-006 Per ISO-7637-2 Terminal Strength Electrical Transient Conduction Not Applicable Meet TableＢafter testing. No defects Not Applicable 8.Specification of Packaging 8-1.Appearance and Dimensions (8mm-wide paper tape) 2.0±0.05 4.0±0.1 4.0±0.1 +0.1 1.85±0.1 3.5±0.05  1.5 -0 8.0±0.3 19 Stress Electrical Characterization Flammability Board Flex 1.75±0.1 No. 1.05±0.1 1.1max. BLM18_BH：1.1 max. Direction of feed BLM18_JH：0.85max. (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel are kept. 8-2.Tape Strength (1)Pull Strength Top tape Bottom tape 5N min. (2)Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree Bottom tape MURATA MFG.CO., LTD. Top tape F Base tape Reference Only Spec. No. JENF243A-9129E-01 P.5/9 8-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc) 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS discrimination(2) ,Quantity, etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 9. P.6/9 Caution 9-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 9-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-3.Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 9-4.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains,ships,etc.) (4)Power plant control equipment (9)Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 9-5. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1.Land pattern designing Standard land dimensions Chip Ferrite Bead c Rated Current (A) d a Solder Resist ~1.0 ~1.5 ~2.5 b Pattern ~4.0 Soldering a Flow 0.8 Flow/ Reflow Reflow 0.7 b Flow 2.5 Reflow 2.0 c 0.7 Land pad thickness and dimension d 18µm 35µm 70µm 0.7 0.7 0.7 1.2 0.7 0.7 2.4 1.2 0.7 6.4 The excessive heat by land pads may cause deterioration at joint of products with substrate. 10-2.Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 m MURATA MFG.CO., LTD. 3.3 1.65 (in mm) Reference Only Spec. No. JENF243A-9129E-01 P.7/9 (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3)soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Time. (s) Limit Profile above 230°C、60s max. 260°C,10s 2 times 10-3.Reworking with soldering iron Pre-heating: 150°C, 1 min Tip temperature: 350°C max. Soldering time : 3(+1,-0) seconds. Soldering iron output: 80W max.  Tip diameter:φ3mm max.  Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 P.8/9 10-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. t 10-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:ab) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9129E-01 P.9/9 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9.Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.