BLM18PG331SH1D

Reference Only Spec. No. JENF243A-9101V-01 P.1/10 Chip Ferrite Bead BLM18□□□□□□H1D Murata Standard Reference Specification[AEC-Q200] 1.Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM18_□H Series based on AEC-Q200. 2.Part Numbering (ex.) BL M 18 (1) (2) (3) (1)Product ID (2)Type (3)Dimension (L×Ｗ) AG 121 S Ｈ 1 D (4) (5) (6) (7) (8) (9) (4)Characteristics (7)Category(for Automotive Electronics) (5)Typical Impedance at 100MHz (8)Numbers of Circuit (6)Performance (9)Packaging (D:Taping) 3.Rating Customer Part Number MURATA Part Number Impedance () (at 100MHz)(*1) (refer to below comment) Typical BLM18PG300SH1D BLM18PG330SH1D BLM18PG600SH1D BLM18PG121SH1D BLM18PG181SH1D BLM18PG221SH1D BLM18PG331SH1D BLM18PG471SH1D BLM18SP300SH1D BLM18SP101SH1D BLM18SP221SH1D BLM18SP601SH1D BLM18SP102SH1D BLM18KG221SH1D BLM18KG331SH1D BLM18KG471SH1D BLM18KG601SH1D BLM18KG102SH1D BLM18SN220TH1D BLM18KG260TH1D BLM18KG300TH1D BLM18KG700TH1D BLM18KG101TH1D BLM18KG121TH1D BLM18AG121SH1D BLM18AG151SH1D BLM18AG221SH1D BLM18AG331SH1D BLM18AG471SH1D BLM18AG601SH1D BLM18AG102SH1D 20 min. 33±25% 40 min. 120±25% 180±25% 220±25% 330±25% 470±25% 30±10 100±25% 220±25% 600±25% 1000±25% 220±25% 330±25% 470±25% 600±25% 1000±25% 22±7 26±25% 30±25% 70±25% 100±25% 120±25% 120±25% 150±25% 220±25% 330±25% 470±25% 600±25% 1000±25% 30 33 60 120 180 220 330 470 30 100 220 600 1000 220 330 470 600 1000 22 26 30 70 100 120 120 150 220 330 470 600 1000 DC Resistance ( max.) (*1) (refer to below comment) Initial Values Values After at 85℃ at 125℃ Testing 1000 0.05 0.10 3000*2 1000*2 0.025 0.050 1000 0.1 0.2 2000*2 1000*2 0.05 0.10 1500*2 1000*2 0.09 0.18 1400*2 1000*2 0.10 0.14 1200*2 1000*2 0.15 0.20 1000 0.20 0.26 6000*2 4000*2 0.010 0.008 3700*2 2500*2 0.026 0.022 2800*2 1900*2 0.048 0.040 1500*2 1000*2 0.168 0.140 1200*2 800*2 0.222 0.185 2200*2 1500*2 0.050 0.060 1700*2 1200*2 0.080 0.095 1500*2 1000*2 0.130 0.145 1300*2 1000*2 0.150 0.165 1000*2 800*2 0.200 0.230 8000*2 5000*2 0.004 0.005 6000*2 4000*2 0.007 0.012 5000*2 3300*2 0.010 0.015 3500*2 2200*2 0.022 0.032 3000*2 1900*2 0.030 0.040 3000*2 1900*2 0.030 0.040 800 0.18 0.28 700 0.25 0.35 700 0.25 0.35 600 0.30 0.40 550 0.35 0.45 500 0.38 0.48 450 0.50 0.60 Rated Current (mA) MURATA MFG.CO., LTD. Remark ESD Rank 2:2kV 6:25kV 6 For DC power line 2 For DC power line (Thin type) 2 For general use 2 Reference Only Spec. No. JENF243A-9101V-01 Customer Part Number MURATA Part Number P.2/10 Impedance () (at 100MHz)(*1) (refer to below comment) Typical 5±25% 5±25% 10±25% 10±25% 22±25% 22±25% 47±25% 47±25% 47±25% 5 5 10 10 22 22 47 47 47 BLM18BB600SH1D BLM18BA750SH1D BLM18BB750SH1D BLM18BB121SH1D BLM18BD121SH1D BLM18BA121SH1D BLM18BB141SH1D BLM18BB151SH1D BLM18BD151SH1D BLM18BB221SH1D BLM18BD221SH1D BLM18BB331SH1D BLM18BD331SH1D BLM18BD421SH1D BLM18BB471SH1D BLM18BD471SH1D BLM18BD601SH1D BLM18BD102SH1D BLM18BD152SH1D BLM18BD182SH1D BLM18BD222SH1D BLM18BD252SH1D 60±25% 75±25% 75±25% 120±25% 120±25% 120±25% 140±25% 150±25% 150±25% 220±25% 220±25% 330±25% 330±25% 420±25% 470±25% 470±25% 600±25% 1000±25% 1500±25% 1800±25% 2200±25% 2500±25% 60 75 75 120 120 120 140 150 150 220 220 330 330 420 470 470 600 1000 1500 1800 2200 2500 600 300 600 550 300 200 500 450 300 450 250 400 250 250 300 250 200 200 150 150 150 150 0.25 0.70 0.30 0.30 0.4 0.9 0.35 0.37 0.4 0.45 0.45 0.58 0.5 0.55 0.85 0.55 0.65 0.85 1.2 1.5 1.5 1.5 0.35 0.80 0.40 0.40 0.5 1.0 0.45 0.47 0.5 0.55 0.55 0.68 0.6 0.65 0.95 0.65 0.75 0.95 1.3 1.6 1.6 1.6 For high speed signal line  Storage Temperature : -55°C to +125°C  Operating Temperature : -55°C to +125°C (*1) Standard Testing Conditions  Unless otherwise specified  Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) (Note)As for Rated currentmarked with *2, Rated Current is derated as right figure depending on the operating temperature.  In case of doubt  Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa R a te d C u rre n t ( A )  BLM18BB050SH1D BLM18BA050SH1D BLM18BB100SH1D BLM18BA100SH1D BLM18BB220SH1D BLM18BA220SH1D BLM18BB470SH1D BLM18BD470SH1D BLM18BA470SH1D DC Resistance ( max.) (*1) Rated (refer to below ESD Rank Current comment) Remark 2:2kV (mA) 6:25kV Initial Values Values After at 85℃ at 125℃ Testing 800 0.05 0.10 500 0.2 0.3 700 0.10 0.20 500 0.25 0.35 For 700 0.20 0.30 high speed 2 500 0.35 0.45 signal line 600 0.25 0.35 500 0.3 0.4 300 0.55 0.65 Rated current at 85°C Rated current at 125°C 0 85 125 Operating Temperature (°C) MURATA MFG.CO., LTD. 2 Reference Only Spec. No. JENF243A-9101V-01 P.3/10 4.Style and Dimensions 1.6 ±0.15 0 . 8 ±0 . 1 5 ■ Equivalent Circuit Ｔ 0 . 4 ± 0 .2 : E le c t r o d e P/N BLM18_SH BLM18_TH ( ) Resistance element becomes dominant at high frequencies. ■ Unit Mass (Typical value) BLM18_SH：0.005g BLM18_TH：0.004g T 0.8±0.15 0.6±0.15 (in mm) 5.Marking No marking. 6.Specifications 6-1.Electrical Performance No. Item 6-1-1 Impedance Specification Meet item 3. 6-1-2 DC Resistance Meet item 3. Test Method Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT 4991A or the equivalent Test Fixture : KEYSIGHT 16192A or the equivalent Measuring Equipment : Digital multi meter For BLM18SN Measuring Equipment : YOKOGAWA 755611 or the equivalent Test Fixture : KEYSIGHT 16044A or the equivalent ＊Except resistance of the Substrate and Wire 6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June. 1 2010 AEC-Q200 Stress Test Method No. 3 High 1000hours at 125 deg C Temperature Set for 24hours at room Exposure temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance No damage Impedance Within ±30% Change （for BLM18SN (at 100MHz) Within ±50%） DC Resistance 4 Temperature Cycling 1000cycles -55 deg C to +125 deg C Set for 24hours at room temperature, then measured. Meet item 3. Meet Table B after testing. TableB Appearance No damage Impedance Within ±30% （for BLM18SN Change Within ±50%） (at 100MHz) (for BLM18KG Within-10%to+50%) DC Resistance Meet item 3. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.4/10 AEC-Q200 Murata Specification / Deviation 5 Stress Destructive Physical Analysis Test Method Per EIA469 No electrical tests 7 Biased Humidity 1000hours at 85 deg C, 85%RH Meet Table C after testing. Apply max rated current. TableC No. No defects Appearance No damage Impedance Within ±30% （for BLM18KG/SN Change Within ±50%） (at 100MHz) DC Meet item 3. Resistance 8 Operational Life Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Meet Table C after testing. If the rated current of parts exceed 1A, the operating temperature should be 85 deg C. 9 10 External Visual Physical Dimension No abnormalities No defects 12 Resistance to Solvents 13 Mechanical Shock Visual inspection Meet ITEM 4 （Style and Dimensions） Per MIL-STD-202 Method 215 Per MIL-STD-202 Method 213 Condition F 1500g's (14.7N)/0.5ms/ Half sine 14 Vibration 15 Resistance to Soldering Heat 17 Not Applicable Meet Table D after testing. Table D Appearance Impedance Change (at 100MHz) DC Resistance No damage Within ±30% Meet item 3. 5g's(0.049N) for 20 minutes, 12cycles each of 3 orientations Test from 10-2000Hz. Solder temperature 260C+/-5 deg C Immersion time 10s Meet Table D after testing. ESD Per AEC-Q200-002 Meet Table D after testing. ESD Rank: Meet Item 3. (Rating) 18 Solderability Per J-STD-002 Method b : Not Applicable 95% of the terminations is to be soldered. 19 Electrical Characterization Measured : Impedance No defects 20 21 Flammability Board Flex Not Applicable Meet Table C after testing. 22 Terminal Strength Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) 60s minimum holding tim Per AEC-Q200-006 30 Electrical Transient Conduction Per ISO-7637-2 Not Applicable Pre-heating:150C +/-10 deg,60s to 90s Meet Table C after testing. No defects MURATA MFG.CO., LTD. Reference Only P.5/10 2.0±0.05 4.0±0.1 4.0±0.1 +0.1 1.85±0.1 3.5±0.05  1.5 -0 8.0±0.3 7.Specification of Packaging 7-1.Appearance and Dimensions (8mm-wide paper tape) 1.75±0.1 Spec. No. JENF243A-9101V-01 1.05±0.1 1.1max. BLM18_SH：1.1 max. Direction of feed BLM18_TH：0.85max. (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously and sealed by top tape and bottom tape. (2) The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point:The base tape and top tape have no spliced point (4) Cavity:There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel are kept. 7-2.Tape Strength (1)Pull Strength Top tape Bottom tape 5N min. (2)Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) *Speed of Peeling off:300mm/min 165 to 180 degree Bottom tape Top tape F Base tape 7-3.Taping Condition (1)Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4)Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc) 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) RoHS regulation conformity parts. (2) MURATA classification number (1) (2) MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.6/10 (5)Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS discrimination(2) ,Quantity, etc) (6)Dimensions of reel and taping(leader-tape, trailer-tape) 7-4. Specification of Outer Case Label H D W 8. Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 Above Outer Case size is typical. It depends on a quantity of an order. Caution 8-1.Rating Do not use products beyond the Operating Temperature Range and Rated Current. 8-2.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 8-3.Fail Safe Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage that may be caused by the abnormal function or the failure of our products. 8-4.Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)Disaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Transportation equipment (trains,ships,etc.) (4)Power plant control equipment (9)Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.7/10 8-5. Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. 9. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 9-1.Land pattern designing < For BLM18 series (except BLM18P/BLM18S/BLM18K type) > Chip Ferrite Bead Type BLM18 (except18P/18S/ BLM18K type) c a Solder Resist b Pattern Soldering Flow Reflow a 0.8 0.7 b 2.5 2.0 c 0.7 0.7 (in mm) < For BLM18P/BLM18S/BLM18K type > Chip Ferrite Bead Rated Current Soldering a b (A) 0.5 to 1.5 BLM18P 1.7 to 2.5 Flow Flow BLM18K 3 to 4 0.8 Flow/ 2.5 Reflow Reflow Reflow 5 to 6 2.0 0.7 BLM18SN 8 BLM18SP 1.2 to 6.0 Type c d a b c 0.7 Land pad thickness and dimension d 18µm 35µm 70µm 0.7 0.7 0.7 1.2 0.7 0.7 2.4 1.2 0.7 6.4 3.3 1.65 6.4 3.3 6.4 (in mm) Solder Resist Pattern The excessive heat by land pads may cause deterioration at joint of products with substrate. 9-2.Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux,Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 m (2) Soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.8/10 (3)soldering profile □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time 60s min. Pre-heating Heating Cycle of flow Standard Profile Time. (s) Standard Profile 150℃、60s min. 250℃、4～6s 2 times Limit Profile 265℃±3℃、5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow 9-3.Reworking with soldering iron Pre-heating: 150°C, 1 min Tip temperature: 350°C max. Soldering time : 3(+1,-0) seconds. Time. (s) Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 245±3°C 2 times Limit Profile above 230°C、60s max. 260°C,10s 2 times Soldering iron output: 80W max.  Tip diameter:φ3mm max.  Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 9-4.Solder Volume Solder shall be used not to be exceeded as shown below. Upper Limit Recommendable 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. t MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.9/10 9-5.Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a Products shall be located in the sideways direction (Length:ab) to the mechanical stress. b 〈 Poor example〉 〈 Good example〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Perforation Stress Level A > D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 9-6.Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 9-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-9101V-01 P.10/10 9-9. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 9-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 9-11.Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.  Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. Avoid storing the product by itself bare (i.e.exposed directly to air). (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 10. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.