BLM18SG700TN1D

Reference Only Spec. No. JENF243A-0021P-01 P.1/8 GHz Noise Suppression Chip Ferrite Bead BLM18EG□□□□N1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM18EG_□N Series. 2. Part Numbering (ex.) BL M 18 EG 601 S N 1 D (1) (2) (3) (4) (5) (6) (7) (8) (9) (1)Product ID (2)Type (3)Dimension(L×Ｗ) (4)Characteristics (5)Typical Impedance at 100MHz (6)Performance (7)Category (8)Numbers of Circuit (9)Packaging (D:Taping / B:Bulk) 3. Rating Customer Part Number DC Resistance (Ω max. ) Rated Current Values at 1GHz (mA) Initial After Values Typical Testing Impedance (Ω) (Under Standard Testing Condition) MURATA Part Number at 100MHz BLM18EG101TN1D BLM18EG101TN1B BLM18EG221TN1D BLM18EG221TN1B BLM18EG331TN1D BLM18EG331TN1B BLM18EG391TN1D BLM18EG391TN1B BLM18EG121SN1D BLM18EG121SN1B BLM18EG221SN1D BLM18EG221SN1B BLM18EG471SN1D BLM18EG471SN1B BLM18EG601SN1D BLM18EG601SN1B • Operating Temperature : -55°C to +125°C 100±25% 80 min. 140 2000 0.045 0.07 220±25% 180 min. 300 1000 0.15 0.21 330±25% 280 min. 450 500 0.21 0.30 390±25% 320 min. 520 500 0.30 0.40 120±25% 90 min. 145 2000 0.04 0.06 220±25% 160 min. 260 2000 0.05 0.08 470±25% 340 min. 550 500 0.21 0.30 600±25% 450 min. 700 500 0.35 0.45 For general use (Thin type) For general use • Storage Temperature : -55°C to +125°C As for BLM18EG type,Rated Current is derated as right figure depending on the operating temperature. 3 t n e r r u C d e t a R 2 2A 1 0 4. Style and Dimensions 1.6±0.15 Remark 85 125 Operating Temperature（ ℃ ） 0.8±0.15 T ■ Equivalent Circuit 0.4±0.2 ( : Electrode ■Unit Mass (Typical value) BLM18EG∗∗∗TN1 : 0.004g BLM18EG∗∗∗SN1 : 0.005g Part Number BLM18EG∗∗∗TN1 BLM18EG∗∗∗SN1 Dimension(T) 0.5±0.15 0.8±0.15 (in mm) MURATA MFG.CO., LTD. ) Resistance element becomes dominant at high frequencies. Spec. No. JENF243A-0021P-01 Reference Only P.2/8 5. Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. (15 °C to 35 °C ) Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) 7. Specifications 7-1. Electrical Performance No. Item Specification 7-1-1 Impedance Meet item 3. 7-1-2 DC Resistance Meet item 3. 7-2. Mechanical Performance No. Item Specification 7-2-1 Appearance and Meet item 4. Dimensions 7-2-2 Bonding Meet Table 1. Strength Table 1 Appearance Impedance Change (at 100MHz) DC Resistance < In case of doubt > Temperature : 20°C±2 °C Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa Test Method Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire Test Method Visual Inspection and measured with Slide Calipers. It shall be soldered on the substrate. Applying Force(F) : 10N Applying Time : 5s±1s Applying Direction: Parallel to the substrate. No damage Side view Ｆ Ｆ Within ±30% R0.5 Meet item 3. Substrate 7-2ｰ3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection : 2.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Pressure jig R340 F Deflection 45mm 7-2ｰ4 Vibration 7-2-5 Resistance to Soldering Heat 7-2-6 Drop Products shall be no failure after tested. 45mm Product It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 2000Hz to 10Hz for 20 min Total Amplitude 1.5mm or Acceleration 196m/s2 whichever is smaller Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. It shall be dropped on concrete or steel board. Method : free fall Height : 1m The number of times : 10 times MURATA MFG.CO., LTD. Specification The electrodes shall be at least 95% covered with new solder coating. Test Method Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 3s±1s Immersion and emersion rates : 25mm/s 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification 7-3-1 Temperature Meet Table 1. Cycle Test Method 1 cycle: 1 step: -55 °C (+0 °C, -3 °C) / 30min±3min 2 step: Ordinary temp. / 3min max. 3 step: +125 °C (+3 °C, -0 °C) / 30min±3min 4 step: Ordinary temp. / 3min max. Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. Temperature : 85°C±2°C Humidity : 80%(RH) to 85%(RH) Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h±4h. Temperature : 125°C±3°C Applying Current : Rated Current Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h±4h. Temperature : -55±2°C Time : 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h±4h. 7-3-2 Humidity 7-3-3 Heat Life 7-3-4 Cold Resistance 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide paper tape) +0.1 φ 1.5 -0 1.85±0.1 3.5±0.05 2.0±0.05 4.0±0.1 4.0±0.1 P.3/8 8.0±0.3 No. Item 7-2-7 Solderability Reference Only 1.75±0.1 Spec. No. JENF243A-0021P-01 Part Number a 1.05±0.1 Direction of feed BLM18EG∗∗∗TN1 BLM18EG∗∗∗SN1 Dimension (a) 0.85 max. 1.1 max. (in mm) (1) Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 4mm-pitch continuously and sealed by top tape and bottom tape. (2) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point The base tape and top tape have no spliced point (4) Cavity There shall not be burr in the cavity. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0021P-01 8-2. Tape Strength (1)Pull Strength Top tape Bottom tape P.4/8 5N min. 165 to 180 degree (2)Peeling off force of Top tape 0.1N to 0.6N (Minimum value is typical.) ∗Speed of Peeling off:300mm/min Top tape F Bottom tape Base tape 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel: 4000 pcs. / reel (2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (1) Factory Code (2) Date (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (∗2), Quantity , etc) (6) Dimensions of reel and taping (leader-tape, trailer-tape) Leader Trailer 2.0±0.5 160 min. 190 min. 210 min. Empty tape Top tape Label φ 13.0±0.2 1 φ 60± 0 φ 21.0±0.8 9± 10 Direction of feed 13±1.4 0 φ 180± 3 (in mm) 8-4. Specification of Outer Case Label H D W Outer Case Dimensions Standard Reel Quantity in Outer Case (mm) (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO., LTD. Spec. No. JENF243A-0021P-01 Reference Only P.5/8 9. ！ Caution 9-1.Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment (7)Traffic signal equipment (8)Transportation equipment (vehicles, trains, ships, etc.) (9)Data-processing equipment (10)Applications of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing • Standard land dimensions (Flow and Reflow soldering) Chip Ferrite Bead c a Solder Resist b Pattern Soldering Flow Reflow a 0.8 0.7 b 2.5 2.0 c 0.7 0.7 (in mm) 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux, Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100℃ max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0021P-01 P.6/8 □Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time. (s) Standard Profile 150°C, 60s min. 250°C, 4s~6s 2 times Pre-heating Heating Cycle of flow Limit Profile 265°C±3°C, 5s max. 2 times □Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow 10-3. Reworking with soldering iron • Pre-heating: 150°C, 1 min • Tip temperature: 350°C max. • Soldering time : 3 (+1, -0) s Time. (s) Standard Profile 150°C~180°C, 90s±30s above 220°C, 30s~60s 245°C±3°C 2 times Limit Profile above 230°C, 60s max. 260°C, 10s 2 times • Soldering iron output: 80W max. • Tip diameter: φ3mm max. • Times : 2times max. Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. MURATA MFG.CO., LTD. Reference Only Spec. No. JENF243A-0021P-01 P.7/8 10-4. Solder Volume Solder shall be used not to be exceed as shown below. Upper Limit Recommendable t 1/3T≦t≦T (T: Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. a b 〈 Poor example〉 Products shall be located in the sideways direction (Length: a D *1 A > B A > C C B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. MURATA MFG.CO., LTD. Spec. No. JENF243A-0021P-01 Reference Only P.8/8 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA) (2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max. (3)Cleaner 1.Cleaner •Isopropyl alcohol (IPA) 2.Aqueous agent •PINE ALPHA ST-100S (4)There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5)Other cleaning Please contact us. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1)Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2)Storage conditions • Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. • Products should be stored under the airtight packaged condition. (3)Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD.