DFE2HCAH2R2MJ0L

Reference Only Spec No. JETE243A-9105D-01 P 1/9 Chip Coil (Chip Inductors) DFE2HCAH□□□□J0L REFERENCE SPECIFICATION Murata Standard Specification【AEC-Q200】 1.Scope This reference specification applies to DFE2HCAH□□□□J0L, Chip Coil (Chip Inductors) for Automotive Electronic based on AEC-Q200. 2.Part Numbering (ex) DF E 2H CA H Product Structure Dimension Applications ID (L×W) and Characteristics Category 1R0 M J Inductance Tolerance Dimension 0 L Other Packaging (T) 3.Rating Operating Temperature Range (Ambient temperature; Self-temperture rise is not included) -40 to +110°C (Product temperature; Self- temperature rise is included) -40 to +150°C -40 to +110°C Storage Temperature Range. It can be considered for use ith DCDC conerters ith a maximum oltage of 40  or less. Customer Part Number Murata Part Number Inductance (µH) Tolerance (%) DC Resistance Max. (Ω) *3 Rated Current (A) ∗1 Based on ∗2 Based on Inductance change Temperature rise DFE2HCAHR33MJ0L 0.33 0.021 5.8 4.9 DFE2HCAHR47MJ0L 0.47 0.025 5.1 4.5 DFE2HCAHR68MJ0L 0.68 0.031 4.4 3.6 DFE2HCAH1R0MJ0L 1.0 0.050 3.4 3.0 DFE2HCAH1R5MJ0L 1.5 0.074 2.9 2.3 DFE2HCAH2R2MJ0L 2.2 0.101 2.5 1.9 ±20 ESD Leel (HBM) 1k ∗1: The saturation alloable DC current alue is specified hen the decrease of the initial Inductance alue at 30%. *2: Rated current (Based on Temperature rise) is the current alue at hich the product temperature rises to 40℃ hen direct current is applied to the inductor ith the product mounted on our designated board. ∗3: alue defined hen DC current flos and Rated Current (Based on Inductance change) or hen DC current flos and Rated Current (Based on Temperature rise) hicheer is smaller. 4. Testing Conditions (Standard atmospheric conditions) Temperature : Ordinary Temperature (5 to 35℃) Humidity : Ordinary Humidity (45 to 85% (RH)) Temperature Humidity Atmospheric Pressure : 20 ± 2°C : 65±5% (RH) : 86 to 106 kPa 5.Appearance and Dimensions 0.6±0.3 ■Unit Mass (Typical alue) 2.0±0.2 ※no marking 2.5±0.2 1.2max. (in mm) MURATA MFG.CO., LTD 0.0324g Reference Only Spec No. JETE243A-9105D-01 P 2/9 6. Electrical Performance No. 6.1 No. Inductance 6.2 DC Resistance 6.3 Withstand oltage Item Meet item 3 Inductance：Meet item 3 Specification Measuring Equipment: KEYSIGHT 4284A or equialent (0.5) Measuring Frequency: 1MHz Measuring Equipment: Resistance Hitester 3541(HIOKI) or equialent machine: impulse testing machine applied oltage: 60-70 7. Q200 Requirement AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 Stress No. 3 High Temperature Exposure Test Method 1000±12h at 150±2 deg C Set for 24±2hours at room temperature, then measured. 4 Temperature Cycling 1000cycles -40 deg C for 30 min and 150 deg C for 30 min ith the transit period of 2min or less Measured ithin 24±2hours at room temperature. 7 Biased Humidity 1000±12h at 85±2 deg C, 85%RH Measured ithin 24±2hours at room temperature. 8 Operational Life Apply 110±2 deg C 1000±12h Measured ithin 24±2h at room temperature. 10 Physical Dimension Measures using digital slide calipers and an optical microscope. MURATA MFG.CO., LTD Murata Specification / Deiation Meet Table A after testing. Table A Appearance Inductance Change from an initial alue No damage ithin ± 10% According to specification Reference Only Spec No. JETE243A-9105D-01 P 3/9 AEC-Q200 Stress No. 13 Mechanical Shock 14 ibration 15 Resistance to Soldering Heat 17 ESD 18 Solderability 21 Board Flex 22 Terminal Strength Test Method Peak acceleration: 981 m/s2 （≒100G） Duration of pulse: 6 ms 3 times in each of 6(±X, ±Y, ±Z) axes Murata Specification / Deiation Meet Table A after testing. Three successie shock shall be applied in the perpendicular direction of each surface of the specimen. 5G for 20 min, for 4 hours in each of 3(X, Y, Z) axes Test from 10-2000Hz Pre-heating：150 to 180 deg C / 90±30sec Reflo soldering method aboe 220 deg C, 60±30 sec Temperature condition aboe 255 deg C, aboe 30sec Peak：aboe 260deg C The specimen shall be subjected to the reflo process under the aboe condition 3 times. Test board shall be 1.6 mm thick. Base material shall be glass epoxy resin. The specimen shall be stored at standard atmospheric conditions for 1 h in prior to the measurement. Per AEC-Q200-002 Meet Table A after testing. 1 time in each of terminals ESD leel: Meet Item 3 (Rating) Per J-STD-002 Condition SMD)C Method D Ne solder shall coer 90% minimum of Electrode shall be immersed in flux at the surface immersed. room temperature and then shall be immersed in solder bath after preheat. Soldering 245±5 deg C, 5sec Board : 40 × 100mm Meet Table A after testing. Thickness 1.6mm Apply pressure gradually in the direction of the arro at a rate of about 0.5mm/s until bent depth reaches 2mm and hold for 60 sec. A static load using a R0.5 pressing tool shall be applied to the body of the specimen in the direction of the arro and shall be hold for 60s. Measure afte r remoing pressure. Pressure 18N MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 P 4/9 8. Specification of Packaging 8.1 Appearance and Dimensions of plastic tape Unreeling direction (in mm) 8.2 Specification of Taping (1) Packing quantity (standard quantity) 3,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed caity of plastic tape and sealed by coer tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toard the user. (4) Spliced point Plastic tape and Coer tape has no spliced point. (5) Missing components number Missing components number ithin 0.1 % of the number per reel or 1 pc., hicheer is greater, and are not continuous. The specified quantity per reel is kept. 8.3 Peeling off force of coer tape The force to peel aay the fixing seal tape 0.1～1.0N 8.4 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape(coer tape) and trailer-tape (empty tape) as follos. (in mm) MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 P 5/9 8.5 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) LL OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 8.6 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 8.7 Specification of Outer Case Outer Case Dimensions (mm) Label H W D H Standard Reel Quantity in Outer Case (Reel) 200 185 67 5 Aboe Outer Case size is typical. It depends on a quantity of an order. D W 9. Caution 9.1 Limitation of Applications Please contact us before using our products for the applications listed belo hich require especially high reliability for the preention of defects hich might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment ( trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster preention / crime preention equipment (4) Poer plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the aboe 9.2 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 9.3 Fail-safe Be sure to proide an appropriate fail-safe function on your product to preent a second damage that may be caused by the abnormal function or the failure of our product. 10. Notice This product is designed for solder mounting. Please consult us in adance for applying other mounting method such as conductie adhesie. This product employs a core ith lo insulation resistance, Pay strict attention hen use it. a) Do not make any through holes and copper pattern under the coil except a copper pattern to the electrode. b) Design/mount any components not to contact this product. MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 P 6/9 10.1 Land pattern designing (Reflo Soldering) Recommended land pattern for reflo soldering is as follos: It has been designed for Electric characteristics and solderability. Please follo the recommended patterns. Otherise, their performance hich includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. UNIT : mm 10.2 Flux, Solder Flux Solder ・Use rosin-based flux. ・Don’t use highly acidic flux ith halide content exceeding 0.2(t)% (chlorine conersion alue). ・Don’t use ater-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder ・Standard thickness of solder paste : 100μm to 150μm Other flux (except （aboe) Please contact us for details, then use. 10.3 soldering conditions (Reflo) ・Pre-heating should be in such a ay that the temperature difference beteen solder and product surface is limited to 100°C max. Cooling into solent after soldering also should be in such a ay that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile profile is as follos. Standard Profile Pre-heating 150℃～180℃ 、90s±30s Heating Peak temperature Cycle of reflo aboe 230℃ 、20s～40s 250+5/-0°C 2 times MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 P 7/9 10.4 Solder olume ・Solder shall be used not to be exceeded the upper limits as shon belo. ・Accordingly increasing the solder olume, the mechanical stress to Chip is also increased. Exceeding solder olume may cause the failure of mechanical or electrical performance. Upper Limit Recommendable t 1/3T≦t≦T T： thickness of electrode 10.5 Product's location The folloing shall be considered hen designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to arping the board. ［Products direction］ a Products shall be located in the sideays direction to the mechanical stress. b 〈 Poor example 〉 〈 Good example〉 (2) Components location on P.C.B. separation. It is effectie to implement the folloing measures, to reduce stress in separating the board. It is best to implement all of the folloing three measures; hoeer, implement as many measures as possible to reduce stress. Contents of Measures Stress Leel (1) Turn the mounting direction of the component parallel to the board separation surface. A > D ∗1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component aay from the board separation surface. A > C Perforation C B D A ∗1 A > D is alid hen stress is added ertically to the perforation as ith Hand Separation. If a Cutting Disc is used, stress ill be diagonal to the PCB, therefore A > D is inalid. Slit (3) Mounting Components Near Scre Holes When a component is mounted near a scre hole, it may be affected by the board deflection that occurs during the tightening of the scre. Mount the component in a position as far aay from the scre holes as possible. Scre Hole Recommended 10.6 Resin coating The inductance alue may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating/molding products. So please pay your careful attention hen you select resin. In prior to use, please make the reliability ealuation ith the product mounted in your application set. 10.7 Temperature rating of the circuit board and components located around Temperature may rise up to max. 40 ℃ hen applying the rated current to the Products. Be careful of the temperature rating of the circuit board and components located around. 10.8 Caution for use There is possibility that the Impedance alue change due to magnetism. Don‘t use a magnet or a pair of teezers ith magnetism hen chip coil are handled. (The tip of the teezers should be molded ith resin or pottery.) MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 P 8/9 10.9 Magnetic Saturation When the excessie current oer rated current is applied, the Impedance alue may change due to magnetism. 10.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or tisting to the substrate hen cropping the substrate, inserting and remoing a connector from the substrate or tightening scre to the substrate. Excessie mechanical stress may cause cracking in the product. Bending Twisting 10.11 Storage and Handing Requirements (1) Storage period Use the products ithin 6 months after deliered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the arehouse on the folloing conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relatie humidity No rapid change on temperature and humidity Don't keep products in corrosie gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the preention of the influence from humidity, dust and so on. ・Products should be stored in the arehouse ithout heat shock, ibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken hen transporting or handling product to aoid excessie ibration or mechanical shock. 10.12 Derating Max. current (DC, AC) as function of product temperature (derating cure) IOP : Loaded Current IR : Rated Current MURATA MFG.CO., LTD Reference Only Spec No. JETE243A-9105D-01 11． P 9/9 Note (1)Please make sure that your product has been ealuated in ie of your specifications ith our product being mounted to your product. (2)You are requested not to use our product deiating from the reference specifications. (3)The contents of this reference specification are subject to change ithout adance notice. Please approe our product specifications or transact the approal sheet for product specifications before ordering. MURATA MFG.CO., LTD