DLW5BTH251TQ2L

Reference Only Spec. No. JEFL243C-9120A-01 P 1/10 Wire Wound Chip Common Mode Choke Coil DLW5BTH□□□TQ2□ Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5BTH_TQ Series for Automotive Electronics based on AEC-Q200. 2. Part Numbering (ex.) DL (1) W 5B (2) (3) T H (4) (5) 102 (6) (1) Chip Common Mode Choke Coil (2) Structure (W : Winding Type) (3) Dimension (L×W) (4) Type (5) Category 3.Rating Customer Part Number MURATA Part Number T Q (7) (8) 2 L (9) (10) (6) Impedance (Typ. at 100MHz) (7) Circuit (8) Features (9) Number of Line (10) Packaging Code L : Taping (φ180mm/reel) K : Taping (φ330mm/reel) B : Bulk Impedance at 10MHz, Under Standard Tesiting Conditions (Ω min.) Impedance at 100MHz, Under Standard Tesiting Conditions (Ω Typ.) 10 Rated Voltage V(DC) Withstanding Voltage V(DC) Rated Current(*) (A) DC Resistance (Rdc) (Ωmax.) at 105℃ at 125℃ 100 4.0 2.5 0.013 20 250 3.0 2.0 0.020 30 500 2.5 1.5 0.027 60 1000 2.0 1.2 0.034 100 1400 1.5 1.0 0.056 Insulation Resistance (MΩ min.) ESD Rank 2.2kV 10 2 DLW5BTH101TQ2L DLW5BTH101TQ2K DLW5BTH101TQ2B DLW5BTH251TQ2L DLW5BTH251TQ2K DLW5BTH251TQ2B DLW5BTH501TQ2L DLW5BTH501TQ2K 50 125 DLW5BTH501TQ2B DLW5BTH102TQ2L DLW5BTH102TQ2K DLW5BTH102TQ2B DLW5BTH142TQ2L DLW5BTH142TQ2K DLW5BTH142TQ2B (*)As for DLW5BTH_TQ type Rated Current is derated as following figure depending on the operating temperature. Rated Current [A] Rated Current at 105℃ Rated Current at 125℃ 105 125 Operating Temperature (Ambient temperature)[℃] ꞏ Operating Temperature : - 40 °C to + 125 °C ꞏ Storage Temperature : - 40 °C to + 125 °C MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120A-01 P 2/10 4. Standard Testing Conditions < Unless otherwise specified > Temperature : Ordinary Temp. 15 ºC to 35 °C Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) < In case of doubt > Temperature : 20 °C ± 2 °C Humidity : 60 %(RH) to 70 %(RH) Atmospheric pressure : 86 kPa to 106 kPa 5. Style and Dimensions 0.5±0.3 (TOP) 0.5 min. 3.6 ±0.3 0.21g ② 1.7 1.3 1.7 ±0.3 ±0.3 ±0.3 6. Marking ■ Unit Mass (Typical value) (L)5.0 ±0.3 (W)5.0 ±0.3 ① 2.35±0.15 0.45min. 3.0±0.5 ■Equivalent Circuites : Marking ② ① : Electrode ④ ③ 1.3 ±0.3 1.3 ±0.3 （in: mm） ・Top of the tape ③ ④ No polarity 0.9 ±0.3 Tape Sprocket Hole marking DLW5BT 7. Electrical Performance No. Item 7.1 Impedance (|Z|) (at 10MHz) 7.2 Insulation Resistance (I.R.) DC Resistance (Rdc) 7.3 Specifications Meet item 3. Test Method Measuring Equipment : KEYSIGHT 4191A or the equivalents. Measuring Frequency : 10MHz (ref. Item 9.) Measuring Equipment : R8340A or the equivalents. Measuring voltage : Rated Voltage Time : within 60 s (ref. Item 9.) Measuring Current : 100 mA max. (ref. Item 9.) (In case of doubt in the above mentioned standard condition,measure by 4 terminal method.) MURATA MFG CO., LTD. Spec. No. JEFL243C-9120A-01 No. 7.4 Item Withstanding Voltage Reference Only Specifications Products shall not be damaged. P 3/10 Test Method Test Voltage : 2.5 times for Rated Voltage Time : 1 to 5 seconds Charge Current : 1 mA max. (ref. Item 9.) 8. Q200 Requirement 8-1. Performance (based on Table 13 for Ferrite EMI SUPPRESSORS/FILTERS) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No. Stress 3 High Temperature Exposure Test Method 1000hours at 125 deg C Set for 24hours at room temperature, then measured. Murata Specification / Deviation Meet Table A after testing. Table A Appearance No damaged. Impedance change (at 10MHz) within ± 20% I.R. 10MΩ min. Withstanding Voltage 4 5 7 Temperature Cycling 1000cycles -40 deg C to +125 deg C Set for 24hours at room temperature, then measured. Destructive Per EIA469 Physical Analysis No electrical tests Biased Humidity No damaged. Meet Table A after testing. Not Applicable 1000hours at 85 deg C, 85%RH Apply max rated voltage and current. Meet Table A after testing. Apply rated voltage. Apply 125 deg C 1000hours Set for 24hours at room temperature, then measured Visual inspection Meet ITEM 5 （Style and Dimensions） Meet Table A after testing. Apply derating of rated current. (ref.item 9) 8 Operational Life 9 10 External Visual Physical Dimension 12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable 13 Mechanical Shock Per MIL-STD-202 Method 213 Conditon F: 1500g’s(14.7N)/0.5ms/ Half sine 5g's(0.049N) for 20 minutes, 12cycles each of 3 oritentations Test from 10-2000Hz. 12cycles each of 3 orientations No-heating Solder temperature 260C+/-5 deg C Immersion time 10s Per AEC-Q200-002 Meet Table A after testing. 14 Vibration 15 Resistance to Soldering Heat 17 ESD (ref.item 9) No abnormalities No defects Meet Table A after testing. Pre-heating：150 to 180C / 90±30s Meet Table A after testing. Meet Table A after testing. ESD Rank: Refer to Item 3. Rating. MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120A-01 AEC-Q200 Murata Specification / Deviation No. Stress 18 Solderbility Test Method Per J-STD-002 19 Electrical Characterization Measured : Impedance 20 Flammability 21 Board Flex Per UL-94 Epoxy-PCB(1.6mm) Deflection 2mm(min) 60 sec minimum holding time Per AEC-Q200-006 A force of 17.7N for 60sec Per ISO-7637-2 22 Terminal Strength 30 Electrical Transient Conduction 9. Terminal to be Tested No. 9.1 No defects Not Applicable Terminal to be Tested 9.6 Operational Life (Supply Terminal) 9.4 Not Applicable Meet Table A after testing. Item 9.5 9.3 Method b : Not Applicable 90% of the terminations is to be soldered. (except partly-exposed wire) Flux:Ethanol solution of rosin,25(wt)% includes activator equivalent to 0.06 to 0.10(wt)% chlorine No defects When measuring and supplying the voltage, the following terminal is applied. Impedance (|Z|) (Measurement Terminal) DC Resistance (Rdc) (Measurement Terminal) Insulation Resistance (I.R.) (Measurement Terminal) Withstanding Voltage (Measurement Terminal) Biased Humidity (Supply Terminal) 9.2 Terminal Terminal Terminal Terminal Terminal Terminal Terminal Terminal 10. Impedance Frequency Characteristics (Typical) DLW5BTH _TQ series 10000 Common Mode DLW5BTH142TQ2 DLW5BTH102TQ2 DLW5BTH501TQ2 DLW5BTH251TQ2 DLW5BTH101TQ2 Impedance (ohm) 1000 100 10 Diffrential mode DLW5BTH142TQ2 DLW5BTH102TQ2 DLW5BTH501TQ2 DLW5BTH251TQ2 DLW5BTH101TQ2 1 1 P 4/10 10 100 Frequency (MHz) MURATA MFG CO., LTD. 1000 Reference Only Spec. No. JEFL243C-9120A-01 P 5/10 11. P.C.B., Flux, Solder and Soldering condition Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 14 except the case of being specified special condition. 12. Specification of Packaging 5.5±0.1 5.5 ±0.05 0.4±0.05 5.5±0.1 8.0±0.1 12.0±0.2 0.1 φ1.5 ＋ －0 4.0±0.1 2.0±0.05 1.75±0.1 12.1. Appearance and Dimensions Direction of feed *Dimension of the Cavity is measured at the bottom side. 2.7±0.1 (in mm) 12.2. Specification of Taping (1) Packing quantity (Standard quantity) φ180 mm reel : 700 pcs. / reel φ330 mm reel :2500 pcs. / reel (2) Packing Method Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape. (3) Sprocket Hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point The cover tape have no spliced point. (5) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous.The specified quantity per reel is kept. 12.3. Pull Strength of Plastic Tape Plastic Tape Cover Tape 5 N min. 10 N min. 165 to 180 degree 12.4. Peeling off force of Cover Tape 0.2N to 0.7N (minimum value is typical.) Speed of Peeling off : 300 mm / min F Cover tape Plastic tape 12.5. Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » 2.0±0.5 Trailer 160 min. Leader 210 min. 190 min. Empty Tape Cover tape Label  13.0±0.2  60± 1 0  21.0±0.8 13± 1 0 Direction of feed 17±1.4 0  180± 3 (in mm) « Packaging Code : K (φ330mm reel) » 2.0±0.5 Trailer Leader 160 min. 190 min. 210 min. Empty Tape Cover tape Label  13.0±0.5  50 min.  21.0±0.8 Direction of feed 2.0±0.5 14±1.5  330±2.0 (in mm) MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120A-01 P 6/10 12.6 Marking for reel Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc 1) « Expression of Inspection No. » □□ OOOO  (1) Factory Code (2) Date (3) Serial No. (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O,N,D Third, Fourth digit : Day 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 12.7 Marking for Outside package Customer name Purchasing Order Number, Customer Part Number, MURATA part number, RoHS marking (2), Quantity, etc 12.8 Specification of Outer Case Label H D W Outer Case Dimensions (mm) Reel W D H Standard Reel Quantity in Outer Case (Reel) 4 4 186 186 93 φ180mm φ330mm 340 340 85  Above Outer Case size is typical. It depends on a quantity of an order. △ 13. ! Caution 13.1. Mounting Direction Mount products in right direction. Wrong direction which is 90 ° rotated from right direction cause not open or short circuit but also flames or other serious trouble. Z right direction Z wrong direction 13.2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment (5) Medical equipment (6) Transportation equipment (trains, ships, etc.) (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (9) Data-processing equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 13.3 Caution(Rating) Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short/open circuit of the product or falling off the product may be occurred. 13.4 Fail-safe Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product. 13.5 Corrosive gas Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments. MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120A-01 P 7/10 14.Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 14.1. Flux and Solder Flux Solder Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ), but not highly acidic flux (with Halogen content exceeding 0.2(wt)% conversion to chlorine). Do not use water-soluble flux. Use Sn-3.0Ag-0.5Cu solder 14.2. Assembling < Exclusive use of Reflow soldering > Flow soldering may cause deterioration in insulation resistance. So,reflow soldering shall be applied for this product. < Thermal Shock > Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is limited to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Not enough preheating may cause deterioration in insulation resistance and / or crank or ceramic body. 14.3. Cleaning Conditions Do not clean after soldering. 14.4. Resin coating The impedance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 14.5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example〉 Products shall be location the sideways direction (Length:ab) to the mechanical stress. 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. C Perforation B D A Stress Level A > D *1 A > B A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. Slit MURATA MFG CO., LTD. Reference Only Spec. No. JEFL243C-9120A-01 P 8/10 (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Recommende Screw Hole Portion of Perforation 14.6. Attention Regarding P.C.B. Design < The Arrangement of Products > •P.C.B. shall be designed so that products are far from the portion of perforation. •The portion of perforation shall be designed as narrow as possible, and shall be designed so as not to be applied the stress in the case of P.C.B. separation. × P.C.B. ○ ○ Portion of Perforation •Products shall not be arranged on the line of a series of holes when there are big holes in P.C.B. (Because the stress concentrate on the line of holes.) Product × ○ P.C.B. × Product Hole < Products Placing > •Support pins shall be set under P.C.B. to prevent causing a warp to P.C.B. during placing the products on the other side of P.C.B.. Pick- up nozzle < P.C.B. Separation > •P.C.B. shall not be separated with hand. P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending. Product P.C.B. Support pin 14.7. Standard Land Dimensions 3.3 4.7 ① 1.3 ② * ① ② ③ ④ indicates terminal number. Resist Copper foil pattern No pattern (in mm) 14.8. Reflow Soldering (1) Standard printing pattern of solder paste ・Standard thickness of solder paste should be 150 to 200µm. Solderability is subject to reflow condition and thermal conductivity. Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. ・Use the solder paste printing pattern of the right pattern. ・For the resist and copper foil pattern, use standard land dimensions. ・Use the Solder Sn-3.0Ag-0.5Cu for pattern printing. MURATA MFG CO., LTD. 0.9 2.9 5.5 4.7 ④ 3.3 0.9 2.9 5.5 1.3 ③ (in mm) Spec. No. JEFL243C-9120A-01 Reference Only P 9/10 (2) Soldering Conditions Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Temp. (℃) 260℃ 250±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Standard Profile 150～180°C 、90s±30s above 220°C、30s～60s 250±3°C 2 times Time (s) Limit Profile above 230°C、60s max. 260°C, 10s 2 times 14.9. Reworking with Soldering iron The following conditions must be strictly followed when using a soldering iron after being mounted by reflow soldering. · Pre-heating: 150°C, 1 min ꞏ Soldering iron output: 30W max. · Tip temperature: 350°C max. ꞏ Tip diameter:φ3mm max. · Soldering time : 3(+1,-0) seconds. ꞏ Times : 2times max. Notes: Do not touch the products directly with the soldering iron. 14.10. Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 14.11. Brushing of neighborhood of products When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not be touched to the winding portion to prevent the breaking of wire. 14.12. Operating Environment Do not use this product under the following environmental conditions,on deterioration of the performance, such as inslation resistance may result from the use. (1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent,may splash on the products. MURATA MFG CO., LTD. Spec. No. JEFL243C-9120A-01 Reference Only P 10/10 14.13. Storage condition (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage environment conditions ꞏ Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to +40 °C Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity. ꞏProducts should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases, to prevent the following deterioration. Poor solderabirity due to the oxidized electrode. ꞏProducts should be stored on the palette for the prevention of the influence from humidity, dust and so on. ꞏProducts should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ꞏAvoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 15. ! △ Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG CO., LTD.