Reference Only
SpecNo.JEFK243A-0002H-01
P1/10
Micro Chip Transformer DXP18BN□□□□□□
Reference Specification
1. Scope
This reference specification applies to Micro Chip Transformer DXP18BN Series.
2. Part Numbering
(ex.)
DX P
18 B
N
(1)
(2) (3) (4) (5)
(1) Micro Chip Transformer
(2) Structure (P: Film Type)
(3) Dimension (L×W)
(4) Type of Transformer (B: Balun)
(5) Category
50
(6)
14
(7)
T
L
(8) (9)
(6) Port Impedance (50:50ohm / 75: 75ohm)
(7) Impedance ratio (14: one to four)
(8) Main Application (T:50~870MHz/H:470~790MHz/D:470~870MHz)
(9) Packing Code L:Taping / B:Bulk
3. Electrical Specification
Customer
Part Number
Murata
Part Number
DXP18BN5014TL
DXP18BN5014TB
DXP18BN5014HL
DXP18BN5014HB
DXP18BN5016DL
DXP18BN5016DB
DXP18BN7514TL
DXP18BN7514TB
Operating Temperature : -40 to +85°C
Freq.
Range
[MHz]
input-output
Impedance
[ohm]
Insertion Loss
[dB max.]
50-870
50-200
1.5
470-790
50-200
1.2
470-870
50-300
1.2
50-870
75-300
1.5
CMRR
[dB min.]
Rated
Power
[dBm]
25
20
Storage Temperature : -40 to +85°C
4. Standard Testing Condition
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
5. Style and Dimensions
■Dimension
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
■Eqivalent Circuit
(5)
(4)
(1)
(2)
(3)
(6)B1
1.6±0.1
0.2±0.1
0.4±0.1
0.45±0.1
Polarity
Marking
(6)
(5)GND
(4)B2
(2)NC
(3)GND
0.8±0.1
0.15±0.1
(Top View)
(1)UB
0.3±0.1
(Bottom View)
: Electrode
(in mm)
■Unit Mass (typ.)
0.003g
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JEFK243A-0002H-01
P2/10
■ NC (Non-Contact) Terminal
Don't connect NC terminal with any signal lines/GND lines on the circuit board.
6. Marking
Polarity Marking is on the upper surface of a Product.
7. Electrical Performance
No.
7.1
Item
Insertion
Loss
(IL)
Specification
Meet item 3.
Definition and Measurement Method
Insertion Loss is given by Sds21 mag extracted from the below circuit.
Port Impedance [ohm]
Port1
5014H
50
5014T
50
5016D
50
7514T
75
Port2
100
100
150
150
Port3
100
100
150
150
IL[dB] = 20log10(Sds21)
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Parasitics and loss factors caused by the test board have to be removed.
UB
B1
Port2
Port1
NC
GND
7.2
CMRR
Meet item 3.
GND
Port3
B2
CMRR is given by the following equation, S-parameters are extracted from
the below circuit.
Port Impedance [ohm]
Port1
5014H
50
5014T
50
5016D
50
7514T
75
Port2
100
100
150
150
Port3
100
100
150
150
CMRR[dB] = 20log10(Sds21/Scs21)=20log10{(S21+S31)/(S21-S31)}
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Scs21 is S-parameter of single mode stimulus - Common mode response
Parasitics and loss factors caused by the test board have to be removed.
UB
B1
Port2
Port1
NC
GND
MURATA MFG.CO.,LTD
GND
B2
Port3
Reference Only
SpecNo.JEFK243A-0002H-01
8. Mechanical Performance
No.
8.1
8.2
8.3
Item
Appearance
and
Dimensions
Solderability
Specification
Meet all dimension on item 5.
Test Method
Visual Inspection and measurement with microscope.
The electrodes shall be at least
95% covered with new solder
coating.
Resistance
to Soldering
Heat
Meet Table 1.
Table 1
Appearance
IL
CMRR
Flux:Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C 60s to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240±5°C
Immersion Time : 3±1 seconds
Immersion and emersion rates : 25mm/s
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : : 150±10°C 60s to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 seconds
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Times : 3 times
It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz
for 15 minutes
8.4
Drop
8.5
Vibration
8.6
P3/10
No damaged
Meet Item 3.
Total Amplitude 3.0mm or Acceleration 196m/s2
whichever is smaller
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
It shall be soldered on the Glass-epoxy substrate.
Deflection : 3mm
(t=1.0mm).
Keeping time : 5 seconds
Speed of Applying Force : 0.5mm/s
Bending
Strength
Pressure jig
R230
F
Deflection
45
45
Product
(in mm)
9. Environmental Performance(Products shall be soldered on the substrate.)
No.
9.1
Item
Temperature
Cycle
9.2
Humidity
9.3
Heat
Resistance
9.4
Cold
Resistance
Specification
Meet Table 1.
Test Method
1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition for
4 to 48 hours.
Temperature : 70±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : 85±2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Temperature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JEFK243A-0002H-01
10. Frequency Characteristics (Typ.)
DXP18BN5014T
0.0
- 0.2
- 0.4
- 0.6
- 0.4
- 0.6
- 0.8
- 1.0
- 0.8
- 1.0
- 1.2
- 1.4
- 1.6
- 1.8
- 2.0
DXP18BN7514T
0.0
- 0.2
IL[dB]
IL[dB]
P4/10
- 1.2
- 1.4
- 1.6
- 1.8
0
- 2.0
200M 400M 600M 800M 1000M
0
200M 400M 600M 800M 1000M
Freq[Hz]
45
45
40
40
CMRR[dB]
CMRR[dB]
Freq[Hz]
35
30
25
20
35
30
25
0
200M
400M
600M
800M
20
1000M
0
200M
Freq[Hz]
0.0
- 0.2
0
- 0.2
- 0.4
- 0.6
- 0.4
- 0.6
- 0.8
- 1.0
- 0.8
- 1.0
- 1.2
- 1.4
- 1.6
- 1.8
1000M
- 1.6
- 1.8
400M
500M
- 2.0
600M 700M 800M900M
400M
500M
600M 700M 800M900M
Freq[Hz]
45
45
40
40
CMRR[dB]
CMRR[dB]
800M
- 1.2
- 1.4
Freq[Hz]
35
30
25
20
600M
DXP18BN5014H
IL[dB]
IL[dB]
DXP18BN5016D
- 2.0
400M
Freq[Hz]
35
30
25
400M
500M
600M 700M 800M900M
20
400M
500M
Freq[Hz]
600M 700M 800M900M
Freq[Hz]
MURATA MFG.CO.,LTD
Reference Only
SpecNo.JEFK243A-0002H-01
11. Specification of Packaging
P5/10
11.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)
0.1
0.20±0.05
0
Direction of feed
(2.75)
1.82±0.05
Sproket Hole
8.0±0.2
3.5±0.05 1.75±0.1
1.5±
0.90±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.6±0.05
11.2 Specification of Taping
(1)Packing quantity(Standard quantity) 5000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Spliced point
The cover tape have no spliced point.
(4) Sprocket Hole
Sprocket hole shall be located on the left hand side toward the direction of feed.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not
continuous. The specified quantity per reel is kept.
11.3 Pull Strength of the Tape Package
Plastic Tape
Cover Tape
11.4 Peeling force of the Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Peeling verosity is 300 mm / min
5N min.
10N min.
165 to 180 degree
F
Cover tape
Plastic tape
11.5 Dimensions of Leader-tape, Trailer and Reel
Leader
Trailer
2.0±0.5
160 min.
190 min.
210 min.
Empty tape
Top tape
Label
φ 13.0±0.2
1
φ 60± 0
φ 21.0±0.8
9± 10
Direction of feed
13±1.4
0
φ 180± 3
MURATA MFG.CO.,LTD
SpecNo.JEFK243A-0002G-01
P6/10
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc
∗1) « Expression of Inspection No. »
□□ OOOO ×××
(1)
(1) Factory Code
(2) Date
(2)
(3)
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS Marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
11.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS Marking (∗2), Quantity, etc
11.8 Specification of Outer Case
Label
H
D
W
12.
Outer Case Dimensions
Standard Reel Quantity in Outer Case
(mm)
(Reel)
W
D
H
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity of an
order.
!
△
Caution
12.1. Mounting Direction
Mount products in right direction.
Wrong direction which is 180 ° rotated from right direction cause serious trouble.
right direction
wrong direction
12.2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life, body
or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1 NC (Non-Contact) Terminal
Don't connect NC terminal with any signal lines/GND lines on the circuit board, unless otherwise, it may affect on
the performance of this part.
Solder the NC terminal on soldering pad, which has no electrical connection with any other lines, to secure the
fixing strength of the part and to prevent displacement of the part during reflow soldering.
13.2 Flux and Solder
Flux
Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of the solder paste should be 100 to 150µm.
MURATA MFG.CO.,LTD
SpecNo.JEFK243A-0002G-01
P7/10
13.3 Standard Land Dimensions (Reflow)
0.20 0.20
0.45
1.30
0.40
Resis
Copper foil pattern
No pattern
0.40
(in mm)
13.4 Assembling
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
13.5 Standard Soldering Condition
(1) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Temp.
(℃)
260℃/10s
245±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30~60s
60s max.
90s±30s
Pre-heating
Heating
Peak temperature
Cycle of reflow
Standard Profile
150~180°C 、90s±30s
above 220°C、30s~60s
245±3°C
2 times
Time(s)
Limit Profile
above 230°C、60s max.
260°C、10s
2 times
(2) Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
Tip temperature / Soldering time : 350°C max / 3(+1,-0)s
Soldering iron output :30W max
Tip diameter : φ3mm
∗Reworking should be limited to 2 times.
Notes: Do not touch the products directly with the soldering iron.
MURATA MFG.CO.,LTD
SpecNo.JEFK243A-0002G-01
P8/10
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Upper limit
Upper limit
Recommendable
Recommendable
t
1/3 T ≦ t ≦ T (T:thickness of electrodes)
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
13.6 Resin coating
The electric characteristics may change and/or it may affect on the product's performance due to high cure-stress
of resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
13.7 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
[Products direction]
Products shall be location the sideways
a
Direction (Length : awarping direction 2.
(warping direction 2)
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
(1) Turn the mounting direction of the component parallel to the board separation surface.
(2) Add slits in the board separation part.
(3) Keep the mounting position of the component away from the board separation surface.
C
Perforation
B
D
A
Slit
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG.CO.,LTD
Stress Level
A > D *1
A > B
A > C
SpecNo.JEFK243A-0002G-01
P9/10
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
During the tightening of the screw. Mount the component in a position as far away from the screw holes
as possible.
Screw Hole
Recommended
Portion of
Perforation
13.8 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are far from the portion
of perforation.
The portion of perforation shall be designed as narrow as possible
and shall be designed so as not to be applied the stress in the case
of P.C.B. separation.
Products shall not be arranged on the line of a series of holes when
there are big holes in P.C.B. (Because the stress concentrate on the
line of holes.)
×
P.C.B.
○
○
Portion of
Perforation
Product
×
○
P.C.B.
×
Product
Hole
< Products Placing >
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
Pick- up nozzle
Product
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
P.C.B.
Support pin
13.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner • Isopropyl alcohol (IPA)
2. Aqueous agent
• PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
13.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
MURATA MFG.CO.,LTD
SpecNo.JEFK243A-0002G-01
P10/10
13.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such
as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.12 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ +40°C
Humidity
: 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration. Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
!
△
Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD