Spec No.: JELF243B_0033F-01
P1/9
CHIP COILS (CHIP INDUCTORS) LQM18PN□□□□FR□ REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQM18PN_FR series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ
M
18
P
N
1R0
N
F
R
Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Other
(L × W)
characteristic
(T)
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range
Storage temperature range
-40°C to +85°C
-55°C to +125°C
Inductance
Customer
Part number
Murata
Part number
Nominal
Tolerance
value
(%)
(μH)
DC
resistance
(Ω)
Self-resonant
Rated current
frequency
(mA)
(MHz min.)
LQM18PNR22NFRL
0.22
±30
0.11±25%
100
1250
LQM18PNR47NFRL
0.47
±30
0.15±25%
100
1100
LQM18PN1R0MFRL
1.0
±20
0.20±25%
100
950
LQM18PN1R5MFRL
1.5
±20
0.23±25%
100
800
LQM18PN2R2MFRL
2.2
±20
0.30±25%
70
750
LQM18PN3R3MFRL
3.3
±20
0.35±25%
60
700
LQM18PN4R7MFRL
4.7
±20
0.44±25%
40
620
4. Testing Conditions
Unless otherwise specified
Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt
Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
MURATA MFG CO., LTD
L
Packaging
L: taping
*B: bulk
Spec No.: JELF243B_0033F-01
P2/9
5. Appearance and Dimensions
Unit mass (typical value): 0.005 g
6. Marking
No marking.
7. Electrical Performance
No.
Item
7.1 Inductance
Specification
Test method
Meet chapter 3 ratings.
Measuring equipment: Keysight 4294A or the equivalent
(1 mA)
Measuring frequency: 1 MHz
7.2 DC resistance Meet chapter 3 ratings.
Measuring equipment: digital multimeter
Measuring circuit:
Measure with the product set to terminal 2 and the switch
pressed (open between a and b). When setting or
removing the product, press the switch to short between a
and b.
7.3 Self-resonant
frequency
Meet chapter 3 ratings.
Measuring equipment: Keysight 4294A or the equivalent
7.4 Rated current
Product temperature rise: 40°C max.
Apply the rated current from chapter 3.
8. Mechanical Performance
No.
Item
8.1 Shear test
Specification
Test method
No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Force application direction:
Applying force: 10 N
Holding time: 5 s±1 s
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
No.
Item
P3/9
Specification
Test method
8.2 Bending test
No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate (100 mm × 40 mm ×
1.0 mm)
Pressurizing speed: 0.5 mm/s
Deflection: 2 mm
Holding time: 30 s
8.3 Vibration
Appearance shall have no significant
mechanical damage.
Oscillation frequency: 10 Hz to 2000 Hz, for approx. 20 min
Total amplitude: total amplitude of 3.0 mm or acceleration
amplitude of 245 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 4 h for
each direction (12 h in total)
8.4 Drop
Appearance shall have no significant
mechanical damage.
The product shall be dropped so that it falls freely onto
concrete or a steel board.
Height: 1 m
Number of falls: 10 times
8.5 Solderability
90% or more of the outer electrode shall
be covered with new solder seamlessly.
Flux: immersed in ethanol solution with a rosin content of
25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
(in mm)
8.6 Resistance to Appearance: No significant mechanical
soldering heat damage shall be observed.
Inductance change rate: within ±30%
Flux: immersed in ethanol solution with a rosin content of
25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room temperature for 24 h±2 h
9. Environmental Performance
The product is soldered on a substrate for test.
No.
Item
Specification
Test method
9.1 Heat
resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±30%
Temperature: 85°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.2 Cold
resistance
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±30%
Temperature: -40°C±2°C
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.3 Humidity
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±30%
Temperature: 70°C±2°C
Humidity: 90% (RH) to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room temperature for 24 h±2 h
9.4 Temperature
cycle
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±30%
Single cycle conditions:
Step 1: -40°C±2°C/30 min±3 min
Step 2: ordinary temperature/10 min to 15 min
Step 3: +85°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 100 cycles
Post-treatment: left at a room temperature for 24 h±2 h
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P4/9
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/plastic tape)
A
1.0±0.1
B
1.8±0.1
t
1.0 max.
t'
0.30±0.05
(in mm)
* The dimensions of the cavity are measured at its bottom.
10.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel
Packing method
The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position
The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint
The plastic tape and the cover tape are seamless.
Number of missing
products
Number of missing products within 0.1% of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Break down force of plastic tape
10 N min.
Break down force of cover tape
5 N min.
10.4 Peeling off force of cover tape
Speed of peeling off
300 mm/min
Peeling off force
165 to 180 degree
0.1 N to 0.7 N (The lower limit is for typical value.)
F
Cover tape
Plastic tape
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P5/9
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
(2) Date
□□
○○○○
First digit: year/last digit of year
(1)
(2)
(3)
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHSY
()
(2) Murata classification number
(1)
(2)
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Label
H
D
W
11.
Dimensions of outer box
(mm)
W
D
H
186
186
93
Standard reel quantity
in outer box (reel)
5
* Above outer box size is typical. It depends on a
quantity of an order.
Caution
Restricted
applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster/crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above
12. Precautions for Use
This product is designed to be mounted by soldering. If you want to use other mounting method, for example, using a
conductive adhesive, please consult us beforehand.
12.1 Land dimensions
The following diagram shows the recommended land dimensions for flow and reflow soldering:
a
Soldering
b
c
Flow
0.8
2.5
0.7
Reflow
0.7
2.0
0.7
(in mm)
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P6/9
12.2 Flux and solder used
Flux
• Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder
• Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
12.3 Soldering conditions (flow, reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C
max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product
quality.
(1) Flow
Temp.
(℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
60s min.
Standard Profile
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C/60 s min.
150°C/60 s min.
Heating
250°C/4 s to 6 s
265°C±3°C/5 s
2 times
2 times
Number of flow cycles
(2) Reflow
Temp.
(℃)
260℃
245℃±3℃
230℃
220℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard profile
Limit profile
Pre-heating
150°C to 180°C/90 s±30 s
150°C to 180°C/90 s±30 s
Heating
Above 220°C/30 s to 60 s
Above 230°C/60 s max.
245°C±3°C
260°C/10 s
2 times
2 times
Peak temperature
Number of reflow cycles
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P7/9
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item
Requirement
Pre-heating
150°C/approx. 1 min
Tip temperature of soldering iron
350°C max.
Power consumption of soldering iron
80 W max.
Tip diameter of soldering iron
Soldering time
ø3 mm max.
3 s (+1 s, -0 s)
Number of reworking operations
2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
a
b
〈 Poor example〉
〈 Good example〉
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D*1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the
board separation surface.
A>C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P8/9
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item
Requirement
Power
20 W/L max.
Time
5 min max.
Frequency
28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period
Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions
• The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the poor
solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation
Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be
used for coating/molding products. So please pay your careful attention when you select resin. In prior to use, please make
the reliability evaluation with the product mounted in your application set.
MURATA MFG CO., LTD
Spec No.: JELF243B_0033F-01
P9/9
12.11 Handling of product
Inductance could change due to the effect of magnetism. Do not use magnetized tweezers, magnets, or other similar tools
when handling the product (instead, use tweezers with resin or ceramic tips).
12.12 Magnetic saturation
A current exceeding the rated current could cause the inductance value to drop due to magnetic saturation.
13.
Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our product
specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG CO., LTD