LQP03TN2N1BZ2D

Reference Only Spec No.JELF243C-9101D-01 P.1/13 CHIP COIL (CHIP INDUCTORS) LQP03TN□□□□Z2D Murata Standard Reference Specification 【AEC-Q200】 1.Scope This reference specification applies to Chip coil (Chip Inductors) LQP03TN_Z2 Series for automotive Electronics based on AEC-Q200 except for Power train and Safety. 2.Part Numbering (ex) LQ P 03 T N 68N J Z Product ID Structure Dimension Applications Category Inductance Tolerance Features (L×W) and Characteristics 2 D Electrode Packaging D:Taping 3.Rating ・Operating Temperature Range. –55°C to +125°C (Ambient temperature: Rated current can be handled in this temperature range.) ・Storage Temperature Range. –55°C to +125°C Customer Part Number Inductance MURATA Part Number (nH) LQP03TN0N6BZ2D LQP03TN0N6CZ2D LQP03TN0N7BZ2D LQP03TN0N7CZ2D LQP03TN0N8BZ2D LQP03TN0N8CZ2D LQP03TN0N9BZ2D LQP03TN0N9CZ2D LQP03TN1N0BZ2D LQP03TN1N0CZ2D LQP03TN1N1BZ2D LQP03TN1N1CZ2D LQP03TN1N2BZ2D LQP03TN1N2CZ2D LQP03TN1N3BZ2D LQP03TN1N3CZ2D LQP03TN1N4BZ2D LQP03TN1N4CZ2D LQP03TN1N5BZ2D LQP03TN1N5CZ2D LQP03TN1N6BZ2D LQP03TN1N6CZ2D LQP03TN1N7BZ2D LQP03TN1N7CZ2D LQP03TN1N8BZ2D LQP03TN1N8CZ2D LQP03TN1N9BZ2D LQP03TN1N9CZ2D LQP03TN2N0BZ2D LQP03TN2N0CZ2D LQP03TN2N1BZ2D LQP03TN2N1CZ2D LQP03TN2N2BZ2D LQP03TN2N2CZ2D LQP03TN2N3BZ2D LQP03TN2N3CZ2D LQP03TN2N4BZ2D LQP03TN2N4CZ2D Tolerance Q (min) 0.6 DC Resistance (Ωmax) 0.07 Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) ESD Rank 1C: 1kV 850 20000 0.7 0.08 0.8 800 18000 0.9 20000 1.0 0.10 1.1 750 17000 1.2 1.3 16000 1.4 1.5 B:±0.1nH C:±0.2nH 19600 17900 14 1C 20000 1.6 0.15 15000 1.7 19100 1.8 17700 600 15100 1.9 12500 14800 2.0 13900 2.1 11000 13400 2.2 12900 2.3 0.20 2.4 MURATA MFG.CO., LTD 10000 12200 500 Spec No.JELF243C-9101D-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP03TN2N5BZ2D LQP03TN2N5CZ2D LQP03TN2N6BZ2D LQP03TN2N6CZ2D LQP03TN2N7BZ2D LQP03TN2N7CZ2D LQP03TN2N8BZ2D LQP03TN2N8CZ2D LQP03TN2N9BZ2D LQP03TN2N9CZ2D LQP03TN3N0BZ2D LQP03TN3N0CZ2D LQP03TN3N1BZ2D LQP03TN3N1CZ2D LQP03TN3N2BZ2D LQP03TN3N2CZ2D LQP03TN3N3BZ2D LQP03TN3N3CZ2D LQP03TN3N4BZ2D LQP03TN3N4CZ2D LQP03TN3N5BZ2D LQP03TN3N5CZ2D LQP03TN3N6BZ2D LQP03TN3N6CZ2D LQP03TN3N7BZ2D LQP03TN3N7CZ2D LQP03TN3N8BZ2D LQP03TN3N8CZ2D LQP03TN3N9BZ2D LQP03TN3N9CZ2D LQP03TN4N0BZ2D LQP03TN4N0CZ2D LQP03TN4N1BZ2D LQP03TN4N1CZ2D LQP03TN4N2BZ2D LQP03TN4N2CZ2D LQP03TN4N3HZ2D LQP03TN4N3JZ2D LQP03TN4N7HZ2D LQP03TN4N7JZ2D LQP03TN5N1HZ2D LQP03TN5N1JZ2D LQP03TN5N6HZ2D LQP03TN5N6JZ2D LQP03TN6N2HZ2D LQP03TN6N2JZ2D LQP03TN6N8HZ2D LQP03TN6N8JZ2D LQP03TN7N5HZ2D LQP03TN7N5JZ2D LQP03TN8N2HZ2D LQP03TN8N2JZ2D LQP03TN9N1HZ2D LQP03TN9N1JZ2D Tolerance Q (min) DC Resistance (Ω max) Self Resonant Frequency (MHz) Min. *Typ. 10000 2.6 0.20 2.7 1C: 1kV 500 11800 9500 2.9 12400 3.0 11900 3.1 11300 8000 3.2 0.25 10600 10900 B:±0.1nH C:±0.2nH 450 9400 3.4 7000 3.5 9600 3.6 9500 6000 3.7 0.30 3.8 8200 8100 14 5700 3.9 400 1C 7900 8600 4.0 8400 4.1 5300 8600 4.2 9800 0.40 4.3 4.7 4400 8800 5.1 4200 8600 350 8000 5.6 4000 H:±3％ J:±5％ 7900 3900 8000 7.5 3700 6700 8.2 3600 6600 3300 5900 6.8 ESD Rank 13300 13000 2.8 6.2 Rated Current (mA) 12200 2.5 3.3 P.2/13 0.60 0.70 9.1 MURATA MFG.CO., LTD 300 250 Spec No.JELF243C-9101D-01 Customer Part Number Reference Only Inductance MURATA Part Number (nH) LQP03TN10NHZ2D LQP03TN10NJZ2D LQP03TN11NHZ2D LQP03TN11NJZ2D LQP03TN12NHZ2D LQP03TN12NJZ2D LQP03TN13NHZ2D LQP03TN13NJZ2D LQP03TN15NHZ2D LQP03TN15NJZ2D LQP03TN16NHZ2D LQP03TN16NJZ2D LQP03TN18NHZ2D LQP03TN18NJZ2D LQP03TN20NHZ2D LQP03TN20NJZ2D LQP03TN22NHZ2D LQP03TN22NJZ2D LQP03TN24NHZ2D LQP03TN24NJZ2D LQP03TN27NHZ2D LQP03TN27NJZ2D LQP03TN30NHZ2D LQP03TN30NJZ2D LQP03TN33NHZ2D LQP03TN33NJZ2D LQP03TN36NHZ2D LQP03TN36NJZ2D LQP03TN39NHZ2D LQP03TN39NJZ2D LQP03TN43NHZ2D LQP03TN43NJZ2D LQP03TN47NHZ2D LQP03TN47NJZ2D LQP03TN51NHZ2D LQP03TN51NJZ2D LQP03TN56NHZ2D LQP03TN56NJZ2D LQP03TN62NHZ2D LQP03TN62NJZ2D LQP03TN68NHZ2D LQP03TN68NJZ2D LQP03TN75NJZ2D LQP03TN75NHZ2D LQP03TN82NHZ2D LQP03TN82NJZ2D LQP03TN91NHZ2D LQP03TN91NJZ2D LQP03TNR10HZ2D LQP03TNR10JZ2D LQP03TNR11HZ2D LQP03TNR11JZ2D LQP03TNR12HZ2D LQP03TNR12JZ2D Tolerance Q (min) DC Resistance (Ω max) 0.70 10 Self Resonant Frequency (MHz) Min. *Typ. 3200 P.3/13 Rated Current (mA) ESD Rank 1C: 1kV 5800 14 11 0.80 12 5400 2900 0.70 13 0.80 4300 2600 15 0.70 3800 16 0.95 3700 0.80 3400 18 12 2.30 3600 22 1.90 3300 150 3200 24 27 2.30 2000 2.95 1700 2900 140 2700 30 33 2600 H:±3％ 2400 J:±5％ 3.00 39 43 200 2200 20 36 250 1C 1500 2200 9 47 120 3.60 1300 3.90 1200 2000 51 56 1800 62 8 68 100 1100 1500 75 1000 1400 900 1300 82 91 8 10 100 80 110 120 12 ＊Typical value is actual performance. MURATA MFG.CO., LTD 800 1100 Spec No.JELF243C-9101D-01 Reference Only P.4/13 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH) 《In case of doubt》 Temperature : 20°C ± 2°C Humidity : 60%(RH) to 70 %(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions (0.6nH to 62nH) (68nH to 120nH) 0.3±0.03 0.3±0.03 ■Unit Mass (Typical value) 0.0002g 0.6±0.03 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 0.15±0.05 6. Marking Polarity Marking :white Coloring side Polarity Marking MURATA MFG.CO., LTD (in mm) Spec No.JELF243C-9101D-01 Reference Only P.5/13 7.Electrical Performance No. 7.1 Item Inductance Specification Inductance shall meet item 3. 7.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: (0.6nH～30nH) 500MHz (33nH～120nH) 300MHz Measuring Condition: Test signal level / about 0dBm Electrical length / 10mm Weight / about 1N to 5N Measuring Fixture: KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Coloring side should be a topside, and should be in the direction of the fixture for position of chip coil. ↑ Polarity Marking 7.3 7.4 7.5 DC Resistance Self Resonant Frequency(S.R.F) Rated Current DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. Measuring Method:See the endnote. Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT N5230A or equivalent The rated current is applied. MURATA MFG.CO., LTD Reference Only Spec No.JELF243C-9101D-01 8.Q200 Requirement 8.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June 1. 2010 AEC-Q200 No 3 Stress Murata Specification / Deviation Test Method High 1000hours at 125 deg C Temperature Set for 24hours at room Exposure temperature, then measured. Meet Table A after testing. Table A Appearance No damage Inductance 0.6nH～30nH (at 500MHz) 33nH～120nH (at 300MHz) Substrate；6-layers FR-4 4 Temperature 1000cycles Meet Table A after testing. Cycling -40 deg C to +125 deg C Substrate；6-layers FR-4 Set for 24hours at room temperature,then measured. 7 8 Biased Humidity Operational Life 1000hours at 85 deg C, 85%RH Meet Table A after testing. unpowered. Substrate；6-layers FR-4 Apply 125 deg C 1000hours Meet Table A after testing. Set for 24hours at room Substrate；6-layers FR-4 temperature, then measured 9 External Visual Visual inspection No abnormalities 10 Physical Dimension Meet ITEM 4 No defects （Style and Dimensions） 12 Resistance to Solvents Per Not Applicable MIL-STD-202 Method 215 13 Mechanical Shock Meet Table A after testing. Per MIL-STD-202 Method 213 Substrate；6-layers FR-4 Condition F: 1500g's(14.7N)/0.5ms/Half sine 14 Vibration 5g's(0.049N) for 20 minutes, Meet Table A after testing. 12cycles each of 3 oritentations Substrate；6-layers FR-4 Test from 10-2000Hz. MURATA MFG.CO., LTD Within ±10% P.6/13 Reference Only Spec No.JELF243C-9101D-01 AEC-Q200 No Stress 15 Resistance Murata Specification / Deviation Test Method No-heating Meet Table A after testing. to Soldering Heat Solder temperature Pre-heating 150C +/-10 deg C, 60s to 90s 260C+/-5 deg C Immersion time 10s 17 ESD ESD Rank: 1C（1KV~2KV） Per AEC-Q200-002 Substrate；6-layers FR-4 18 Solderbility Per J-STD-002 Method b : Not Applicable Pre-heating 150C +/-10 deg C, 60s to 90s 90% of the terminations is to be soldered. 19 Electrical Measured : Inductance No defects 20 Flammability Per UL-94 Not Applicable 21 Board Flex Epoxy-PCB(1.6mm_thickness) Meet Table B after testing. Deflection 2mm(min) Murata deviation request: Holding time 60s Substrate；Substrate；FR-4(0.8mm_thickness) Characterization Holding time 30s Table B Appearance No damage DC resistance Within ±10% Murata Deviation Request: 2N/5s 22 Terminal Strength Per AEC-Q200-006 No defect A force of 17.7N for 60s Substrate；Substrate；6-layers FR-4 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) 4.0±0.1 +0.1 φ1.5 -0 1.75±0.1 3.5±0.05 2.0±0.05 ※A Polarity Marking 8.0±0.2 2.0±0.05 0.35±0.03 Direction of feed ※A 0N6～62N； 0.67±0.03 68N～R12； 0.65±0.03 MURATA MFG.CO., LTD 0.55 max. (in mm) P.7/13 Reference Only Spec No.JELF243C-9101D-01 P.8/13 9.2 Specification of Taping (1) Packing quantity (standard quantity) 15,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Cover tape 5N min 9.4 Peeling off force of cover tape Speed of Peeling off Cover tape 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force F 165°to 180 ゜ Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. 2.0±0.5 Trailer 160 min. Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0 φ 180 -3 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2), Quantity etc ･･･ ∗1) □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ MURATA MFG.CO., LTD Reference Only Spec No.JELF243C-9101D-01 P.9/13 9.8 Specification of Outer Case Outer Case Dimensions (mm) W D H 186 186 93 Label H D W Standard Reel Quantity in Outer Case (Reel) 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property. (1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and / or reliability requirements to the applications listed in the above. 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chip Coil c Land Solder resist a b c 0.2~0.3 0.8~0.9 0.2~0.3 (in mm) a b 11.2 Flux, Solder ・ Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・ Use Sn-3.0Ag-0.5Cu solder. ・ Standard thickness of solder paste :60μm~100μm. 11.3 Reflow soldering conditions ・ Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・ Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO., LTD Spec No.JELF243C-9101D-01 Reference Only P.10/13 ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 5°C/s max 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Cooling rate Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times 5°C/s max 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C,1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. Upper Limit Recommendable t 1/3T≦t≦T T : thickness of product Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a b 〈 Poor example 〉 Products shall be located in the sideways direction (Length:ａ＜b) to the mechanical stress. 〈 Good example 〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. MURATA MFG.CO., LTD Reference Only Spec No.JELF243C-9101D-01 Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Seam b P.11/13 Stress Level A > D *1 A > B A > C C B D A Slit Length:a< b a *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible. 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating When products are coated with resin, please contact us in advance. 11.9 Handling of a substrate (1)There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and contraction. The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other PCB material which has different thermal expansion coefficient from Glass-epoxy. When other PCB materials are considered, please be sure to evaluate by yourself. MURATA MFG.CO., LTD Spec No.JELF243C-9101D-01 Reference Only P.12/13 (2)After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress even from small bending or twisting. When the flexible PCB is considered, please be sure to evaluate by yourself. Bending Twisting Substrate restriction ・Don’t mount on FPC（Flexible printed circuits） ・When components are mounted on substrate of under 6-layers, please contact us in advance. To mount components on FPC or substrate of under 6-layers may cause of cracking issue by stress. 11.10 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD Reference Only Spec No.JELF243C-9101D-01 P.13/13 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 Zm A B C D V2 V1 Test Head Test fixture Zx V1 = I1 A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， V2 Zx= I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.480nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Qx= Lx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD