LQP03TQ2N6B02D

Reference Only Spec No. JELF243C-0024B-01 CHIP COIL (CHIP INDUCTORS) LQP03TQ□□□□02D P.1/12 Reference Specification 1.Scope This reference specification applies to LQP03TQ series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 03 T Q Product ID Structure Dimension Applications Category (L×W) and Characteristics 0N6 W Inductance Tolerance 0 2 Features Electrode D Packaging D:Taping *B:Bulk *Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature. ・Storage Temperature. Customer Part Number –55°C to +125°C –55°C to +125°C MURATA Part Number LQP03TQ0N6W02D LQP03TQ0N6B02D LQP03TQ0N6C02D LQP03TQ0N7W02D LQP03TQ0N7B02D LQP03TQ0N7C02D LQP03TQ0N8W02D LQP03TQ0N8B02D LQP03TQ0N8C02D LQP03TQ0N9W02D LQP03TQ0N9B02D LQP03TQ0N9C02D LQP03TQ1N0W02D LQP03TQ1N0B02D LQP03TQ1N0C02D LQP03TQ1N1W02D LQP03TQ1N1B02D LQP03TQ1N1C02D LQP03TQ1N2W02D LQP03TQ1N2B02D LQP03TQ1N2C02D LQP03TQ1N3W02D LQP03TQ1N3B02D LQP03TQ1N3C02D LQP03TQ1N4W02D LQP03TQ1N4B02D LQP03TQ1N4C02D LQP03TQ1N5W02D LQP03TQ1N5B02D LQP03TQ1N5C02D LQP03TQ1N6B02D LQP03TQ1N6C02D LQP03TQ1N7B02D LQP03TQ1N7C02D LQP03TQ1N8B02D LQP03TQ1N8C02D LQP03TQ1N9B02D LQP03TQ1N9C02D LQP03TQ2N0B02D LQP03TQ2N0C02D LQP03TQ2N1B02D LQP03TQ2N1C02D LQP03TQ2N2B02D LQP03TQ2N2C02D Inductance (nH) Tolerance Q (min) DC Resistance (Ω max) Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) 0.6 20000 0.05 0.7 1000 0.8 18000 0.9 1.0 1.1 >20000 W:±0.05ｎH B:±0.1ｎH C:±0.2ｎH 0.08 800 17000 1.2 17 1.3 700 1.4 16000 1.5 19700 0.10 1.6 15000 19000 1.7 17200 1.8 16900 1.9 B:±0.1ｎH C:±0.2ｎH 16100 12500 2.0 16300 2.1 14300 0.12 2.2 MURATA MFG.CO.,LTD 11000 13000 650 Spec No. JELF243C-0024B-01 Customer Part Number Reference Only MURATA Part Number LQP03TQ2N3B02D LQP03TQ2N3C02D LQP03TQ2N4B02D LQP03TQ2N4C02D LQP03TQ2N5B02D LQP03TQ2N5C02D LQP03TQ2N6B02D LQP03TQ2N6C02D LQP03TQ2N7B02D LQP03TQ2N7C02D LQP03TQ2N8B02D LQP03TQ2N8C02D LQP03TQ2N9B02D LQP03TQ2N9C02D LQP03TQ3N0B02D LQP03TQ3N0C02D LQP03TQ3N1B02D LQP03TQ3N1C02D LQP03TQ3N2B02D LQP03TQ3N2C02D LQP03TQ3N3B02D LQP03TQ3N3C02D LQP03TQ3N4B02D LQP03TQ3N4C02D LQP03TQ3N5B02D LQP03TQ3N5C02D LQP03TQ3N6B02D LQP03TQ3N6C02D LQP03TQ3N7B02D LQP03TQ3N7C02D LQP03TQ3N8B02D LQP03TQ3N8C02D LQP03TQ3N9B02D LQP03TQ3N9C02D LQP03TQ4N0B02D LQP03TQ4N0C02D LQP03TQ4N1B02D LQP03TQ4N1C02D LQP03TQ4N2B02D LQP03TQ4N2C02D LQP03TQ4N3H02D LQP03TQ4N3J02D LQP03TQ4N7H02D LQP03TQ4N7J02D LQP03TQ5N1H02D LQP03TQ5N1J02D LQP03TQ5N6H02D LQP03TQ5N6J02D LQP03TQ6N2H02D LQP03TQ6N2J02D LQP03TQ6N8H02D LQP03TQ6N8J02D LQP03TQ7N5H02D LQP03TQ7N5J02D LQP03TQ8N2H02D LQP03TQ8N2J02D LQP03TQ9N1H02D LQP03TQ9N1J02D LQP03TQ10NH02D LQP03TQ10NJ02D Inductance (nH) Tolerance Q (min) DC Resistance (Ω max) P.2/12 Self Resonant Frequency (MHz) Min. *Typ. Rated Current (mA) 2.3 11000 12600 2.4 0.15 2.5 12300 2.6 550 12100 2.7 10000 2.8 12800 12300 2.9 12400 0.20 3.0 500 12100 3.1 11800 9500 3.2 3.3 0.24 B:±0.1ｎH C:±0.2ｎH 11400 11200 450 3.4 10100 3.5 8000 3.6 9900 0.25 3.7 9800 17 400 3.8 9700 3.9 10500 4.0 4.1 6500 10100 360 4.2 0.35 10000 4.3 9900 4.7 8800 5.1 8400 350 0.39 5.6 8800 6000 6.2 6.8 H:±3% J:±5% 8300 0.55 5400 7.5 7900 300 7600 4800 8.2 7100 0.65 9.1 6600 4500 10 MURATA MFG.CO.,LTD 0.69 6300 250 Spec No. JELF243C-0024B-01 Customer Part Number Reference Only MURATA Part Number LQP03TQ11NH02D LQP03TQ11NJ02D LQP03TQ12NH02D LQP03TQ12NJ02D LQP03TQ13NH02D LQP03TQ13NJ02D LQP03TQ15NH02D LQP03TQ15NJ02D LQP03TQ16NH02D LQP03TQ16NJ02D LQP03TQ18NH02D LQP03TQ18NJ02D LQP03TQ20NH02D LQP03TQ20NJ02D LQP03TQ22NH02D LQP03TQ22NJ02D LQP03TQ24NH02D LQP03TQ24NJ02D LQP03TQ27NH02D LQP03TQ27NJ02D LQP03TQ30NH02D LQP03TQ30NJ02D LQP03TQ33NH02D LQP03TQ33NJ02D LQP03TQ36NH02D LQP03TQ36NJ02D LQP03TQ39NH02D LQP03TQ39NJ02D LQP03TQ43NH02D LQP03TQ43NJ02D LQP03TQ47NH02D LQP03TQ47NJ02D LQP03TQ51NH02D LQP03TQ51NJ02D LQP03TQ56NH02D LQP03TQ56NJ02D LQP03TQ62NH02D LQP03TQ62NJ02D LQP03TQ68NH02D LQP03TQ68NJ02D LQP03TQ75NH02D LQP03TQ75NJ02D LQP03TQ82NH02D LQP03TQ82NJ02D LQP03TQ91NH02D LQP03TQ91NJ02D LQP03TQR10H02D LQP03TQR10J02D LQP03TQR11H02D LQP03TQR11J02D Inductance (nH) Tolerance Q (min) DC Resistance (Ω max) P.3/12 Self Resonant Frequency (MHz) Min. *Typ. 11 Rated Current (mA) 5600 12 17 0.69 3700 13 4900 4800 250 15 0.8 16 5100 3500 1.1 18 20 4800 4500 14 1.2 200 3000 22 4100 24 1.6 2000 3800 27 150 3400 30 2.0 1700 33 36 3200 H:±3% J:±5% 3000 2.5 1500 39 2900 130 11 2800 43 4.0 1300 47 2700 2600 51 6.0 1200 100 56 2500 62 2300 1100 68 2100 7.0 80 75 2000 82 9 1000 91 8.0 1800 1700 100 9.0 110 900 1600 ＊Typical value is actual performance. 4. Testing Conditions 《Unless otherwise specified》 Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH) 《In case of doubt》 Temperature : 20°C ± 2°C Humidity : 60%(RH) to 70 %(RH) Atmospheric Pressure : 86kPa to 106 kPa MURATA MFG.CO.,LTD 70 Reference Only Spec No. JELF243C-0024B-01 P.4/12 5. Appearance and Dimensions 0.6±0.03mm Top view 0.3±0.03mm End view Side view ■ Unit Mass (Typical value) 0.3±0.02mm 0.2±0.03mm 0.20mg Bottom view 0.15±0.03mm 6. Marking Side surface identification marking :Blue Both side surface Blue 7.Electrical Performance No. 7.1 Item Inductance Specification Inductance shall meet item 3. 7.2 Q Q shall meet item 3. Test Method Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: (0.6～30nH)500MHz (33～110nH) 300MHz Measuring Condition: Test signal level / about 0dBm Electrical length / 10mm Weight / about 1N～5N Measuring Fixture: KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Bottom side should be a bottom, and should be in the direction of the fixture for position of chip coil. TOP BOTTOM Measuring Method:See the endnote. MURATA MFG.CO.,LTD Spec No. JELF243C-0024B-01 No. 7.3 7.4 7.5 Item DC Resistance Self Resonant Frequency(S.R.F) Rated Current Reference Only Specification DC Resistance shall meet item 3. S.R.F shall meet item 3. Self temperature rise shall be limited to 25°C max. P.5/12 Test Method Measuring Equipment:Digital multi meter Measuring Equipment: KEYSIGHT N5230A or equivalent The rated current is applied. 8.Mechanical Performance No. 8.1 Item Shear Test Specification Chip coil shall not be damaged after tested as test method. Test Method Substrate:Glass-epoxy substrate Land 0.24 0.3 0.9 (in mm) Force:2N Hold Duration:5 s±1 s Applied Direction: Parallel to PCB Chip coil F Substrate 8.2 Bending Test Substrate:Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force:1mm /s Deflection:1mm Hold Duration:30 s Pressure jig R340 F Deflection 45 8.3 Vibration Appearance:No damage Inductance Change: within ±10% 8.4 Solderability The electrode shall be at least 90% covered with new solder coating. 8.5 Resistance to Soldering Heat Appearance:No damage Inductance Change: within ±10% 45 Product (in mm) Substrate: Glass-epoxy substrate Oscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min Total amplitude 1.5 mm or Acceleration amplitude 196 m/s2 whichever is smaller. Testing Time:A period of 2h in each of 3 mutually perpendicular directions. Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s Flux: Ethanol solution of rosin 25(wt)% (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:260°C±5°C Immersion Time:5s±1s Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO.,LTD Spec No. JELF243C-0024B-01 Reference Only P.6/12 9.Environmental Performance It shall be soldered on the substrate. No. Item Specification 9.1 Heat Resistance Appearance:No damage Inductance Change: within ±10% 9.2 Cold Resistance 9.3 Humidity 9.4 Temperature Cycle Test Method Substrate: Glass-epoxy substrate Temperature:125°C±2°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate Temperature:-55°C±3°C Time:1000 h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000 h(+48h,-0h) Then measured after exposure in the room condition for 24h±2h. Substrate: Glass-epoxy substrate 1 cycle: 1 step:-55°C±2°C / 30min±3 min 2 step:Ordinary temp. / 10~15 min 3 step:125°C±2°C / 30±3 min 4 step: Ordinary temp. / 10~15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 10.Specification of Packaging 10.1 Appearance and Dimensions of paper tape (8mm-wide) +0.1 φ1.5 -0 1.75±0.1 3.5±0.05 4.0±0.1 8.0±0.2 2.0±0.05 （0.67） 2.0±0.05 （0.35） Direction of feed 0.55 max. (in mm) 10.2 Specification of Taping (1) Packing quantity (standard quantity) 15,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. MURATA MFG.CO.,LTD Reference Only Spec No. JELF243C-0024B-01 P.7/12 (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater, and are not continuous. The Specified quantity per reel is kept. 10.3 Pull Strength Cover tape 5N min 10.4 Peeling off force of cover tape Speed of Peeling off 300mm/min 0.1N to 0.6N (minimum value is typical) Peeling off force F 165°to 180 ゜ Cover tape Base tape 10.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160 min. 2.0±0.5 Leader Label 190 min. Empty tape 210 min. Cover tape φ 13.0±0.2 +1 φ 60 -0 φ 21.0±0.8 9.0 +1 -0 Direction of feed 13.0±1.4 (in mm) +0 φ 180 -3 10.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity etc ･･･ □□ OOOO ××× ∗1) (1) Factory Code (2) Date (1) (2) (3) First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 10.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2), Quantity, etc ･･･ 10.8 Specification of Outer Case Label H D Outer Case Dimensions (mm) W D H 186 186 93 Standard Reel Quantity in Outer Case (Reel) 5 W ∗ Above Outer Case size is typical. It depends on a quantity of an order. MURATA MFG.CO.,LTD Reference Only Spec No. JELF243C-0024B-01 11. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (8) Disaster prevention / crime prevention equipment (3) Undersea equipment (4) Power plant control equipment (9) Data-processing equipment (10) Applications of similar complexity and /or reliability (5) Medical equipment requirements to the applications listed in the above 12. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 12.1 Land pattern designing c Chip Coil Land Solder resist a b c 0.3 0.9 0.24 (in mm) ａ ｂ 12.2 Flux, Solder ・ Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・ Use Sn-3.0Ag-0.5Cu solder. ・ Standard thickness of solder paste : 100μm. 12.3 Reflow soldering conditions ・ Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・ Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. MURATA MFG.CO.,LTD P.8/12 Spec No. JELF243C-0024B-01 Reference Only P.9/12 ・Reflow soldering profile Temp. (℃) 260℃ 245℃±3℃ 220℃ 230℃ Limit Profile 180 150 Standard Profile 30s～60s 60s max. 90s±30s Pre-heating Heating Peak temperature Cycle of reflow Time. (s) Standard Profile Limit Profile 150°C～180°C 、90s±30s above 220°C､30s～60s above 230°C､60s max. 245°C±3°C 260°C,10s 2 times 2 times 12.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating Tip temperature Soldering iron output Tip diameter Soldering time Time 150°C,1 min 350°C max. 80W max. φ3mm max. 3(+1,-0)s 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 12.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. 1/3T≦t≦2T T : thickness of product Upper Limit Recommendable Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt. 12.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length:ａ＜b) to the mechanical stress. b 〈 Poor example 〉 〈 Good example 〉 MURATA MFG.CO.,LTD Reference Only Spec No. JELF243C-0024B-01 P.10/12 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures (1) Turn the mounting direction of the component parallel to the board separation surface. (2) Add slits in the board separation part. (3) Keep the mounting position of the component away from the board separation surface. Seam b A Stress Level A > D *1 A > B A > C C B D Slit Length:a< b a *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible. 12.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 12.8 Resin coating When products are coated with resin, please contact us in advance. 12.9 Handling of a substrate (1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress on a chip is different depending on PCB material and structure. When the thermal expansion coefficient greatly differs between the board used for mounting and the chip, it will cause cracking of the chip due to the thermal expansion and contraction. The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other PCB material which has different thermal expansion coefficient from Glass-epoxy. When other PCB materials are considered, please be sure to evaluate by yourself. MURATA MFG.CO.,LTD Spec No. JELF243C-0024B-01 Reference Only P.11/12 (2)After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress even from small bending or twisting. When the flexible PCB is considered, please be sure to evaluate by yourself. Bending Twisting 12.10 Storage and Handing Requirements (1) Storage period Use the products within 12 months after deliverd. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 30% to 70% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 13．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD Reference Only Spec No. JELF243C-0024B-01 (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I2 I1 Zm V1 Test Head A B C D V2 Test fixture Zx V1 = I1 A B C D V2 I2 Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 I1 ， Zx= V2 I2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.480nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Qx= Lx= 2πf ， Re(Zx) Lx :Inductance of chip coil Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO.,LTD P.12/12