Reference Only
SpecNo.JELF243A-0102G-01
P.1/10
CHIP COIL (CHIP INDUCTORS) LQW18AN□□□□80D REFERENCE SPECIFICATION
1. Scope
This Reference specification applies to LQW18AN_80 series, Chip coil (Chip Inductors).
2. Part Numbering
(ex)
LQ
W
18
A
N
2N2
C
8
0
D
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W)
and
D:Taping
Characteristics
∗B:Bulk
∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
3. Rating
・Operating Temperature Range
・Storage Temperature Range.
Customer
Part Number
–55°C to +125°C
–55°C to +125°C
Inductance
MURATA
Part Number
(nH)
LQW18AN2N2C80D
2.2
LQW18AN2N4C80D
2.4
LQW18AN3N0C80D
3.0
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
15000
2400
Tolerance
Q
(min.)
24
0.018
C:±0.2nH
18
0.026
13
0.17
30
0.028
10000
2200
4.3
35
0.036
11600
2100
4.7
25
0.054
10400
1500
4.9
23
0.081
7300
1200
5.6
38
0.040
6650
1900
0.048
7000
1500
3200
670
LQW18AN3N9B80D
LQW18AN3N9C80D
3.9
LQW18AN3N9G80D
LQW18AN4N1B80D
LQW18AN4N1C80D
4.1
LQW18AN4N1G80D
LQW18AN4N2B80D
LQW18AN4N2C80D
4.2
B:±0.1nH
C:±0.2nH
G:±2%
LQW18AN4N2G80D
LQW18AN4N3B80D
LQW18AN4N3C80D
LQW18AN4N3G80D
LQW18AN4N7B80D
LQW18AN4N7C80D
LQW18AN4N7G80D
LQW18AN4N9B80D
LQW18AN4N9C80D
LQW18AN4N9G80D
LQW18AN5N6C80D
LQW18AN5N6G80D
LQW18AN6N0C80D
LQW18AN6N0G80D
LQW18AN6N5C80D
LQW18AN6N5G80D
LQW18AN6N8C80D
LQW18AN6N8G80D
LQW18AN7N2C80D
LQW18AN7N2G80D
LQW18AN7N5C80D
LQW18AN7N5G80D
6
6.5
6.8
C:±0.2nH
G:±2%
40
7.2
38
7.5
35
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
Customer
Part Number
MURATA
Part Number
LQW18AN8N2C80D
LQW18AN8N2G80D
LQW18AN8N4C80D
LQW18AN8N4G80D
LQW18AN8N7C80D
LQW18AN8N7G80D
LQW18AN9N1C80D
LQW18AN9N1G80D
LQW18AN9N5C80D
LQW18AN9N5G80D
LQW18AN9N9C80D
LQW18AN9N9G80D
LQW18AN10NG80D
LQW18AN10NJ80D
LQW18AN11NG80D
LQW18AN11NJ80D
LQW18AN12NG80D
LQW18AN12NJ80D
LQW18AN13NG80D
LQW18AN13NJ80D
LQW18AN15NG80D
LQW18AN15NJ80D
LQW18AN16NG80D
LQW18AN16NJ80D
LQW18AN17NG80D
LQW18AN17NJ80D
LQW18AN18NG80D
LQW18AN18NJ80D
LQW18AN19NG80D
LQW18AN19NJ80D
LQW18AN22NG80D
LQW18AN22NJ80D
LQW18AN23NG80D
LQW18AN23NJ80D
LQW18AN24NG80D
LQW18AN24NJ80D
LQW18AN25NG80D
LQW18AN25NJ80D
LQW18AN27NG80D
LQW18AN27NJ80D
LQW18AN28NG80D
LQW18AN28NJ80D
LQW18AN30NG80D
LQW18AN30NJ80D
LQW18AN31NG80D
LQW18AN31NJ80D
P.2/10
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
0.052
4750
1600
0.064
5000
1500
0.075
4600
1400
0.086
3450
1300
0.098
3600
1200
30
0.12
2880
31
0.11
3150
Inductance
(nH)
Tolerance
Q
(min.)
8.2
8.4
8.7
9.1
C:±0.2nH
G:±2%
38
9.5
9.9
10
11
40
12
37
13
15
38
16
17
18
19
G:±2%
J:±5%
22
23
40
24
25
27
28
1100
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
Customer
Part Number
MURATA
Part Number
LQW18AN33NG80D
LQW18AN33NJ80D
LQW18AN34NG80D
LQW18AN34NJ80D
LQW18AN36NG80D
LQW18AN36NJ80D
LQW18AN37NG80D
LQW18AN37NJ80D
LQW18AN39NG80D
LQW18AN39NJ80D
LQW18AN41NG80D
LQW18AN41NJ80D
LQW18AN43NG80D
LQW18AN43NJ80D
LQW18AN44NG80D
LQW18AN44NJ80D
LQW18AN47NG80D
LQW18AN47NJ80D
LQW18AN48NG80D
LQW18AN48NJ80D
LQW18AN51NG80D
LQW18AN51NJ80D
LQW18AN52NG80D
LQW18AN52NJ80D
LQW18AN56NG80D
LQW18AN56NJ80D
LQW18AN58NG80D
LQW18AN58NJ80D
LQW18AN68NG80D
LQW18AN68NJ80D
LQW18AN69NG80D
LQW18AN69NJ80D
LQW18AN72NG80D
LQW18AN72NJ80D
LQW18AN73NG80D
LQW18AN73NJ80D
LQW18AN75NG80D
LQW18AN75NJ80D
LQW18AN78NG80D
LQW18AN78NJ80D
LQW18AN82NG80D
LQW18AN82NJ80D
LQW18AN83NG80D
LQW18AN83NJ80D
LQW18AN91NG80D
LQW18AN91NJ80D
Inductance
(nH)
Tolerance
Q
(min.)
33
P.3/10
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
0.11
3150
1100
40
34
0.15
1050
3000
36
37
0.20
910
37
39
0.16
3280
1000
0.21
2780
840
32
0.23
2700
830
35
0.27
2750
750
56
38
0.26
2600
770
58
35
0.30
2400
700
37
0.38
2380
630
34
0.47
2330
560
28
0.41
2280
590
34
0.5
2230
550
33
0.54
1900
520
41
40
43
44
47
48
51
52
G:±2%
J:±5%
68
69
72
73
75
78
82
83
91
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
Customer
Part Number
Inductance
MURATA
Part Number
(nH)
LQW18AN94NG80D
LQW18AN94NJ80D
LQW18ANR10G80D
LQW18ANR10J80D
LQW18ANR11G80D
LQW18ANR11J80D
LQW18ANR12G80D
LQW18ANR12J80D
LQW18ANR15G80D
LQW18ANR15J80D
LQW18ANR18G80D
LQW18ANR18J80D
LQW18ANR20G80D
LQW18ANR20J80D
LQW18ANR21G80D
LQW18ANR21J80D
LQW18ANR22G80D
LQW18ANR22J80D
LQW18ANR25G80D
LQW18ANR25J80D
LQW18ANR27G80D
LQW18ANR27J80D
LQW18ANR30G80D
LQW18ANR30J80D
LQW18ANR33G80D
LQW18ANR33J80D
LQW18ANR36G80D
LQW18ANR36J80D
LQW18ANR39G80D
LQW18ANR39J80D
Tolerance
P.4/10
Q
(min.)
DC
Resistance
(Ω max.)
Self Resonant
Frequency
(MHz min.)
Rated
Current
(mA)
34
0.63
1750
490
0.7
1730
0.72
1650
0.87
1580
420
1.65
1380
310
1.74
1350
290
94
100
110
32
120
150
28
180
450
25
200
210
G:±2%
J:±5%
27
1.98
25
2.08
280
220
250
1330
2.28
250
24
270
2.42
1250
260
300
3.12
1200
220
3.84
1100
360
3.98
1050
390
4.23
1100
330
25
190
Current derating (%)
100
50
0
0
85
Temperature
(℃)
.
125
Derating of Rated Current depend on Operating Temperature
4. Testing Conditions
《Unless otherwise specified》
Temperature : Ordinary Temperature / 15°C to 35°C
: Ordinary Humidity / 25%(RH) to 85%(RH)
Humidity
《In case of doubt》
Temperature
Humidity
Atmospheric Pressure
MURATA MFG.CO., LTD
: 20°C±2°C
: 60%(RH) to 70%(RH)
: 86kPa to 106 kPa
Reference Only
SpecNo.JELF243A-0102G-01
P.5/10
5. Appearance and Dimensions
1.65 ± 0.1
■Unit Mass (Typical value)
0.0034g
0.90 ± 0.1
0.2 ± 0.1
0.99 ± 0.1
(in mm)
0.26 ± 0.1
6. Electrical Performance
No.
6.1
Item
Inductance
Specification
Inductance shall meet item 3.
Test Method
Measuring Equipment:KEYSIGHT 4287A or equivalent
Measuring Frequency: 100MHz
250MHz / 2.2nH~ 44nH
200MHz / 47nH~ 69nH
150MHz / 72nH~150nH
100MHz / 180nH~390nH
Measuring Condition:Test signal level / about 10mA
Electrical length / 0.94 cm
Measuring Fixture:KEYSIGHT 16197A
Position coil under test as shown in below and contact coil
with each terminal by adding weight.
6.2
Q
Q shall meet item 3.
1608 Size Guide
Measuring Method:See the endnote.
6.3
DC Resistance
DC Resistance shall meet item 3.
Measuring Equipment:Digital multi meter
6.4
Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3.
Measuring Equipment:KEYSIGHT 5230A or equivalent
6.5
Rated Current
Self temperature rise shall be
limited to 40°C max.
The rated current is applied.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
P.6/10
7. Mechanical Performance
No.
7.1
Item
Shear Test
Specification
Chip coil shall not be damaged
after tested as test method.
Test Method
Substrate:Glass-epoxy substrate
2.2
2.00
Chip Coil
Pattern
Solder resist
Substrate
0.7
1.15
0.7
0.86
Applied Direction:
(in mm)
Chip Coil
F
Force:5N
Hold Duration:5s±1s
7.2
Bending Test
Substrate
Substrate:Glass-epoxy substrate
(100mm×40mm×1.6mm)
Speed of Applying Force:1mm / s
Deflection:2mm
Hold Duration:30s
Pressure jig
R230
F
Deflection
45
45
Product (in mm)
7.3
Vibration
Chip coil shall not be damaged
after tested as test method.
Oscillation Frequency:
10Hz~55Hz~10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2 hours in each of 3 mutually
perpendicular directions.
7.4
Solderability
The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux:Ethanol solution of rosin,25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:240°C±5°C
Immersion Time: 3s±1s
7.5
Resistance to
Soldering Heat
Appearance:No damage
Inductance Change:within ±5%
Flux:Ethanol solution of rosin,25(wt)% Includes
activator equivalent to 0.06(wt)% chlorine.
(immersed for 5s to 10s)
Solder:Sn-3.0Ag-0.5Cu
Pre-Heating:150°C±10°C / 60s to 90s
Solder Temperature:270°C±5°C
Immersion Time:10s±1s
Then measured after exposure in the room
condition for 24h±2h.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
P.7/10
8. Environmental Performance
It shall be soldered on the substrate.
No.
8.1
Item
Heat Resistance
Specification
Test Method
8.2
Cold Resistance
Temperature:-55°C±2°C
Time:1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24h±2h.
8.3
Humidity
Temperature:40°C±2°C
Humidity:90%(RH) to 95%(RH)
Time:1000h (+48h,-0h)
Then measured after exposure in the room condition
for 24h±2h.
8.4
Temperature
Cycle
1 cycle:
1 step:-55°C±2°C / 30min±3 min
2 step:Ordinary temp. / 10min to 15 min
3 step:+125°C±2°C / 30min±3 min
4 step:Ordinary temp. / 10min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24h±2h.
Appearance:No damage
Inductance Change:within ±5%
Q Change:within ±20%
Temperature:125°C±2°C
Time:1000h (+48h,0h)
Then measured after exposure in the room condition
for 24h±2h.
9. Specification of Packaging
9.1 Appearance and Dimensions of paper tape (8mm-wide)
3 .5 ±0 .0 5
1.75±0.1
8 .0 ±0 .2
0.1
φ 1.5± 0
1 .9 ±0 .0 5
4.0±0.1
2.0±0.05
4.0±0.1
1.1±0.05
Direction of feed
1.15±0.05
1.1max
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Top tape
Bottom tape
5N min.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
9.4 Peeling off force of cover tape
Speed of Peeling off
Peeling off force
165 to 180 degree
300mm/min
0.1N to 0.6N
(minimum value is typical)
P.8/10
Top tape
F
Bottom tape
Base tape
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows.
2.0±0.5
Trailer
160 min.
Leader
Label
190 min.
210 min.
Empty tape
Top tape
φ 13.0±0.2
+1
φ 60 -0
φ 21.0±0.8
9.0 +1
-0
Direction of feed
(in mm)
13.0±1.4
+0
φ 180 -3
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ・・・
∗1)
□□ OOOO ×××
(1)
(2)
(3)
(1) Factory Code
(2) Date
First digit
: Year / Last digit of year
Second digit
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D
Third, Fourth digit : Day
(3) Serial No.
∗2) « Expression of RoHS marking »
ROHS – Y (△)
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,
Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions (mm)
Label
H
D
W
10.
W
D
H
Standard Reel Quantity
in Outer Case (Reel)
186
186
93
5
∗ Above Outer Case size is typical. It depends on a quantity
of an order.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Power plant control equipment
(5) Medical equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment
(9) Data-processing equipment
(10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
P.9/10
11. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Chip Coil
c
Land
Solder resist
A
0.86
B
2.00
C
1.15
a
(in mm)
b
11.2 Flux, Solder
・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・Use Sn-3.0Ag-0.5Cu solder.
・Standard thickness of solder paste : 100μm to 150μm.
11.3 Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited
to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
・Reflow soldering profile
Temp.
(℃)
260℃
245℃±3℃
220℃
230℃
Limit Profile
180
150
Standard Profile
30s~60s
60s max.
90s±30s
Time. (s)
Standard Profile
Pre-heating
Heating
Peak temperature
Cycle of reflow
Limit Profile
150°C~180°C 、90s±30s
above 220°C、30s~60s
above 230°C、60s max.
245°C±3°C
260°C,10s
2 times
2 times
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
P.10/10
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating
150°C,1 min
Tip temperature
350°C max.
Soldering iron output
80W max.
Tip diameter
φ3mm max.
Soldering time
3(+1,-0)s
Time
2 times
Note:Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
11.5 Solder Volume
・Solder shall be used not to be exceeded the upper limits as shown below.
・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
Upper Limit
Recommendable(t)
1/3T≦t≦T
T:thickness of product
⇔
T
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
[Products direction]
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
b
〈 Poor example〉
〈 Good example〉
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures
as possible to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface.
A
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from
the board separation surface.
A > C
Seam
b
A
C
B
D
Slit
> D ∗1
∗1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
Length:a< b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
MURATA MFG.CO., LTD
Screw Hole
Recommended
SpecNo.JELF243A-0102G-01
Reference Only
P.11/10
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at
the mounted products and P.C.B.
Power : 20 W / l max.
Frequency : 28kHz to 40kHz
Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on
your board.
11.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched
to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
11.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the bottom of base
tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition.
(There is no problem with the permeation and reflection type.)
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity
: 15% to 85% relative humidity No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
MURATA MFG.CO., LTD
Reference Only
SpecNo.JELF243A-0102G-01
12.
P.12/10
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
I2
I1
A
Zm
V1
C
Test Head
B
V2
D
Test fixture
Zx
V1
I1
=
A B
C D
V2
I2
Product
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
Zm=
V1
I1
,
Zx=
V2
I2
(3) Thus,the relation between Zx and Zm is following;
Zx= α
Zm-β
1-ZmΓ
where, α= D / A =1
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm : measured impedance of short chip
Zssa: residual impedance of short chip (0.771nH)
Yom: measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Lx=
Im(Zx)
,
2πf
Qx =
Im(Zx)
Re(Zx)
Lx : Inductance of chip coil
Qx : Q of chip coil
f : Measuring frequency
MURATA MFG.CO., LTD