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MBRB2545CTT4G

MBRB2545CTT4G

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    TO-252

  • 描述:

    二极管配置:1对共阴极;功率:-;直流反向耐压(Vr):45V;平均整流电流(Io):15A;正向压降(Vf):620mV@15A;反向电流(Ir):200uA@45V;反向恢复时间(trr):-;工...

  • 数据手册
  • 价格&库存
MBRB2545CTT4G 数据手册
MBRB2545CTG, SBRB2545CTG SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package The D2PAK Power Rectifier is a state−of−the−art device that employs the Schottky Barrier principle with a platinum barrier metal. Features • • • • • • • • • • Center−Tap Configuration Guardring for Stress Protection Low Forward Voltage 175°C Operating Junction Temperature Epoxy Meets UL 94 V−0 @ 0.125 in Short Heat Sink Tab Manufactured − Not Sheared Similar in Size to the Industry Standard TO−220 Package AEC−Q101 Qualified and PPAP Capable SBRB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb−Free* • Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 • Weight: 1.7 Grams (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • SCHOTTKY BARRIER RECTIFIER 30 AMPERES, 45 VOLTS D2PAK CASE 418B STYLE 3 1 4 3 Mechanical Characteristics • http://onsemi.com Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) MARKING DIAGRAM AY WW B2545G AKA A Y WW B2545 G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2013 November, 2013 − Rev. 12 1 Publication Order Number: MBRB2545CT/D MBRB2545CTG, SBRB2545CTG MAXIMUM RATINGS (Per Leg) Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 45 V Average Rectified Forward Current (Rated VR, TC = 164°C) Total Device IF(AV) 15 30 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 160°C) IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 1.0 A Storage Temperature Range Tstg −65 to +175 °C Operating Junction Temperature (Note 1) TJ −65 to +175 °C dv/dt 10,000 V/ms Voltage Rate of Change (Rated VR) A 30 A 150 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS (Per Leg) Symbol Characteristic Thermal Resistance, Junction−to−Case Junction−to−Ambient (Note 2) Value Unit °C/W 1.5 50 RqJC RqJA 2. When mounted using minimum recommended pad size on FR−4 board. ELECTRICAL CHARACTERISTICS (Per Diode) Characteristic Symbol Condition Min Typ Max Unit VF Instantaneous Forward Voltage (Note 3) IF = 15 Amp, TJ = 25°C IF = 15 Amp, TJ = 125°C IF = 30 Amp, TJ = 25°C IF = 30 Amp, TJ = 125°C − − − − − 0.50 − 0.65 0.62 0.57 0.82 0.72 V IR Instantaneous Reverse Current (Note 3) VR = 45 Volts, TJ = 25°C VR = 45 Volts, TJ = 125°C − − − 9.0 0.2 25 mA 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. ORDERING INFORMATION Package Shipping† D2PAK 50 Units / Rail SBRB2545CTG D2PAK (Pb−Free) 50 Units / Rail MBRB2545CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel SBRB2545CTT4G D2PAK (Pb−Free) 800 Units / Tape & Reel Device MBRB2545CTG (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 MBRB2545CTG, SBRB2545CTG 200 100 TJ = 125°C 10 150°C 1.0 25°C 0.1 0 0.2 0.4 0.6 40 20 10 4.0 2.0 1.0 0.4 0.2 0.1 0.04 0.02 0.01 0.004 0.002 0.8 1.0 1.2 1.4 1.6 1.8 (RESISTIVE LOAD) 20 (CAPACITIVE LOADS) IPK =p IAV DC 5 10 IPK = 20 IAV 4 0 0 25°C 0 10 20 30 40 Figure 2. Typical Reverse Current, Per Leg 24 8 75°C Figure 1. Typical Forward Voltage, Per Leg TJ = 125°C 12 100°C VR, REVERSE VOLTAGE (VOLTS) SQUARE WAVE 16 125°C VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 32 28 TJ = 150°C IR , REVERSE CURRENT (mA) 100 IF(AV), AVERAGE FORWARD CURRENT (A) PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1000 4 8 12 16 20 24 28 32 IF, AVERAGE FORWARD CURRENT (AMPS) 36 40 26 DC 24 22 20 18 SQUARE 16 14 12 10 8 6 4 2 0 145 150 155 160 165 TC, CASE TEMPERATURE (°C) 170 Figure 4. Current Derating, Case per Leg Figure 3. Typical Forward Power Dissipation http://onsemi.com 3 50 175 MBRB2545CTG, SBRB2545CTG PACKAGE DIMENSIONS D2PAK 3 CASE 418B−04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. C E −B− V W 4 1 2 A S 3 −T− SEATING PLANE K J G D M T B M N R P L L M M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE U L M W H 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE DIM A B C D E F G H J K L M N P R S V MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB2545CTG, SBRB2545CTG ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRB2545CT/D
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