MBRD1035CTLT4G

MBRD1035CTL Series, SBRD81035CTL Series Switch Mode Schottky Power Rectifier DPAK Power Surface Mount Package The MBRD1035CTL employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. http://onsemi.com SCHOTTKY BARRIER RECTIFIER 10 AMPERES 35 VOLTS Features • Highly Stable Oxide Passivated Junction • Guardring for Stress Protection • Matched Dual Die Construction − • • • • • • May be Paralleled for High Current Output High dv/dt Capability Short Heat Sink Tap Manufactured − Not Sheared Very Low Forward Voltage Drop Epoxy Meets UL 94 V−0 @ 0.125 in SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* DPAK CASE 369C 1 4 3 MARKING DIAGRAM YWW B10 35CLG Mechanical Characteristics: • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Rating: ♦ Human Body Model = 3B (> 8 kV) ♦ Machine Model = C (> 400 V) Y WW B1035CL G = Year = Work Week = Device Code = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 10 1 Publication Order Number: MBRD1035CTL/D MBRD1035CTL Series, SBRD81035CTL Series MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 115°C) Per Leg Per Package Symbol Value Unit VRRM VRWM VR 35 V IO A 5.0 10 Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 115°C) Per Leg IFRM Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Per Package IFSM A 10 Storage / Operating Case Temperature Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR, TJ = 25°C) A 50 Tstg, Tc −55 to +150 °C TJ −55 to +150 °C dv/dt 10,000 V/ms Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA. THERMAL CHARACTERISTICS Rating Symbol Thermal Resistance, Junction−to−Case Per Leg RqJC Thermal Resistance, Junction−to−Ambient (Note 2) Per Leg RqJA Value Unit °C/W 3.0 °C/W 137 2. Rating applies when using minimum pad size, FR4 PC Board ELECTRICAL CHARACTERISTICS Rating Symbol Maximum Instantaneous Forward Voltage (Note 3) (See Figure 2) Per Leg (IF = 5 Amps, TJ = 25°C) (IF = 5 Amps, TJ = 100°C) (IF = 10 Amps, TJ = 25°C) (IF = 10 Amps, TJ = 100°C) VF Maximum Instantaneous Reverse Current (Note 3) (See Figure 4) Per Leg (VR = 35 V, TJ = 25°C) (VR = 35 V, TJ = 100°C) (VR = 17.5 V, TJ = 25°C) (VR = 17.5 V, TJ = 100°C) IR Value Unit V 0.47 0.41 0.56 0.55 mA 2.0 30 0.20 5.0 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0% http://onsemi.com 2 MBRD1035CTL Series, SBRD81035CTL Series ORDERING INFORMATION Device Shipping† Package MBRD1035CTLG 75 Units / Rail SBRD81035CTLG* 75 Units / Rail DPAK (Pb−Free) MBRD1035CTLT4G 2,500 Units / Tape & Reel SBRD81035CTLT4G* 2,500 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. I F, INSTANTANEOUS FORWARD CURRENT (AMPS) I F, INSTANTANEOUS FORWARD CURRENT (AMPS) TYPICAL CHARACTERISTICS 100 TJ = 125°C 10 TJ = 100°C TJ = 25°C TJ = - 40°C 1.0 0.1 0.10 0.30 0.50 0.70 0.90 1.10 100 TJ = 125°C 10 TJ = 25°C 1.0 TJ = 100°C 0.1 0.10 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Per Leg I R , MAXIMUM REVERSE CURRENT (AMPS) I R , REVERSE CURRENT (AMPS) 0.50 0.70 0.90 1.10 Figure 2. Maximum Forward Voltage Per Leg 1E+0 100E-3 1E+0 100E-3 TJ = 125°C 10E-3 1E-3 TJ = 100°C 100E-6 TJ = 25°C 0 10 20 VR, REVERSE VOLTAGE (VOLTS) TJ = 125°C 10E-3 TJ = 100°C 1E-3 100E-6 10E-6 1E-6 0.30 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 30 35 TJ = 25°C 10E-6 1E-6 0 10 20 VR, REVERSE VOLTAGE (VOLTS) 30 Figure 4. Maximum Reverse Current Per Leg Figure 3. Typical Reverse Current Per Leg http://onsemi.com 3 35 PFO , AVERAGE POWER DISSIPATION (WATTS) I O , AVERAGE FORWARD CURRENT (AMPS) MBRD1035CTL Series, SBRD81035CTL Series 8.0 dc 7.0 SQUARE WAVE (50% DUTY CYCLE) 6.0 5.0 Ipk/Io = p 4.0 Ipk/Io = 5 3.0 Ipk/Io = 10 2.0 Ipk/Io = 20 1.0 freq = 20 kHz 0 0 20 40 60 80 120 100 4.0 SQUARE WAVE (50% DUTY CYCLE) 3.5 3.0 Ipk/Io = p 2.5 Ipk/Io = 5 2.0 Ipk/Io = 10 1.5 Ipk/Io = 20 1.0 0.5 0 0 140 1.0 1000 C, CAPACITANCE (pF) TJ = 25°C 100 10 10 15 3.0 4.0 5.0 6.0 7.0 8.0 Figure 6. Forward Power Dissipation Per Leg TJ , DERATED OPERATING TEMPERATURE ( ° C) Figure 5. Current Derating Per Leg 5 2.0 IO, AVERAGE FORWARD CURRENT (AMPS) TL, LEAD TEMPERATURE (°C) 0 dc 20 125 RqJA = 2.43°C/W 115 RqJA = 25°C/W 105 RqJA = 48°C/W 95 RqJA = 67.5°C/W 85 RqJA = 84°C/W 75 65 0 25 5 10 15 20 25 30 35 VR, DC REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 8. Typical Operating Temperature Derating Per Leg * Figure 7. Capacitance Per Leg * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. http://onsemi.com 4 r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) MBRD1035CTL Series, SBRD81035CTL Series 1.0 50%(DUTY CYCLE) 20% 10% 0.1 5.0% 2.0% 1.0% SINGLE PULSE 0.01 0.00001 Rtjl(t) = Rtjl • r(t) 0.0001 0.001 0.01 0.1 10 1.0 100 1000 t, TIME (s) r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 9. Thermal Response Junction to Case (Per Leg) 1.0E+00 50% (DUTY CYCLE) 20% 1.0E-01 1.0E-02 10% 5.0% 2.0% 1.0% 1.0E-03 SINGLE PULSE 1.0E-04 0.00001 0.0001 Rtjl(t) = Rtjl • r(t) 0.001 0.01 0.1 1.0 10 t, TIME (s) Figure 10. Thermal Response Junction to Ambient (Per Leg) http://onsemi.com 5 100 1000 10000 MBRD1035CTL Series, SBRD81035CTL Series PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C A A E b3 c2 B 4 L3 Z D 1 2 H DETAIL A 3 L4 b2 e c b 0.005 (0.13) M C H L2 GAUGE PLANE C L SEATING PLANE A1 L1 DETAIL A ROTATED 905 CW DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 3.00 0.118 1.60 0.063 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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