PRF18BF471QB1RB

c PRF18/21_471Q Series No. 1 2 Item Resistance Value at 25°C Adhesive Strength Rating Value Metheod of Examination Within the specified range After applying maximum operating voltage for 3 mins. and leaving for 2 hours in 25°C, measured by applying voltage less than DC1.5V. (by a direct current less than 10mA) There is no sign of exfoliation on electrode. Reference standard: IEC 60068-2-21 (2006) · Soldered PTC to PCB (**) · Force: 5.0N · Test time: 10 sec. 3 Vibration · Appearance: No defects or abnormalities · Resistance (R25) change: Less than ±20% (*) Reference standard: IEC 60068-2-6 (2007) · Soldered PTC to PCB (**) · Frequency range: 10 to 55Hz · Amplitude: 1.5mm · Sweep rate: 1 octave/min. · Direction: X-Y-Z (3 direction) · 24 cycles in each axis 4 Solderability Wetting of soldering area: U95% Reference standard: IEC 60068-2-58 (2004) · Solder: Sn-3.0Ag-0.5Cu · Solder temp.: 245±5°C · Immersion time: 3±0.3s · Appearance: No defects or abnormalities · Resistance (R25) change: Less than ±20% (*) Reference standard: IEC 60068-2-58 (2004) [ Solder bath method ] · Solder: Sn-3.0Ag-0.5Cu · Preheat: 150±5°C, 90 to 120s · Solder temp.: 260±5°C · Immersion time: 10±1s 5 Resistance to Soldering Heat 6 High Temperature Storage Reference standard: IEC 60068-2-2 (2007) · Soldered PTC to PCB (**) · +150±2°C · 1000+48/-0 hrs. 7 Low Temperature Storage Reference standard: IEC 60068-2-1 (2007) · Soldered PTC to PCB (**) · -20±3°C · 1000+48/-0 hrs 8 Damp Heat, Steady State Reference standard: IEC 60068-2-67 (1995) · Soldered PTC to PCB (**) · +40±2°C, 90±5%RH · 500+24/-0 hrs · Appearance: No defects or abnormalities · Resistance (R25) change: Less than ±20% (*) 9 Thermal Shock Reference standard: IEC 60068-2-14 (2009) [ Test Na ] · Soldered PTC to PCB (**) · Transport time: