AN30180AAPR

Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA http://www.semicon.panasonic.co.jp/en/ 1.2 A Synchronous DC-DC Step Down Regulator (VIN = 2.5 V to 5.5 V, VOUT = 1.20 V to 3.30 V) FEATURES           DESCRIPTION Wide output voltage range : 1.20 V to 3.30 V Input voltage range : 2.5 V to 5.5 V Maximum Output Current : 1.2 A Load transient response is fast Output current limit control of 1.8 A to prevent Excessive current flows High efficiency over a wide load current area by DCM (discontinuous conductive mode) operation at light loads, CCM (continuous conductive mode) operation in heavy loads those two modes can be automatically switched Switching frequency of 2.6 MHz during CCM. 100 % duty operation when input voltage goes down to output voltage. Built-in Under Voltage Lockout (UVLO), Thermal Shut Down (TSD), Over Current Protection (OCP), Short Circuit Protection (SCP) 9 pin Wafer level chip size package (WLCSP) Size : 1.46mm  1.46 mm (0.5 mm pitch) AN30180AA is a synchronous DC-DC Step Down Regulator and employs the hysteretic control system. By this system, when load current charges suddenly, it responds at high speed and minimizes the changes of output voltage. Since it is possible to use capacitors with small capacitance and it is unnecessary to add external parts for system phase compensation, this IC realizes downsizing of set and reducing in the number of external parts. Output voltage is adjustable by control pin. Maximum current is 1.2 A. APPLICATIONS High Current Distributed Power Systems such as power amplifier in cellular phone, camera etc. EFFICIENCY CURVE SIMPLIFIED APPLICATION 100 VIN CNT1 90 CNT2 PVIN FB VOUT AVIN 4.7 µF AN30180AA LX LO 4.7 µF Ｅ ｆｆｉｃｉｅｎｃｙ [%] 80 4.7 µF 70 60 50 40 30 VIN=2.5V VIN=3.7V VIN=5.5V 20 EN AGND PGND 10 0 1 Note : The application circuit is an example. The operation of the mass production set is not guaranteed. Sufficient evaluation and verification is required in the design of the mass production set. The Customer is fully responsible for the incorporation of the above illustrated application circuit in the design of the equipment. 10 Load Current [mA] 100 1000 Condition : VIN = 2.5 V, 3.7 V, 5.5 V, VOUT = 1.20 V COUT = 4.7µF , LOUT = 1.0 µH Page 1 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA ORDERING INFORMATION Order Number Feature Package Output Supply AN30180AA-PR Maximum Output Current : 1.2 A 9 pin WLCSP Emboss Taping ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Notes Supply voltage VIN 6.0 V *1 Operating free-air temperature Topr – 30 to + 85 C *2 Operating junction temperature Tj – 40 to + 150 C *2 Storage temperature Tstg – 55 to + 150 C *2 Input Voltage Range VFB, VEN, VCTL1, VCTL2 – 0.3 to (VIN + 0.3) V *1 *3 VLX – 0.3 to (VIN + 0.3) V *1 *3 HBM 2 kV Output Voltage Range ESD Notes : This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating. This rating is the maximum rating and device operating at this range is not guaranteed as it is higher than our stated recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. VIN is voltage for AVIN, PVIN. VIN = AVIN = PVIN. Do not apply external currents and voltages to any pin not specifically mentioned. *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25 C. *3 : (VIN + 0.3) V must not exceed 6 V. Page 2 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA POWER DISSIPATION RATING PACKAGE JA PD(Ta=25C) PD(Ta=85C) Notes 9 pin Wafer level chip size package (WLCSP Type) 436 C /W 0.286 W 0.148 W *1 Note : For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not exceed the allowable value. *1:Glass Epoxy Substrate(4 Layers) [Glass-Epoxy: 50 X 50 X 0.8t(mm)] Die Pad Exposed , Soldered. CAUTION Although this has limited built-in ESD protection circuit, but permanent damage may occur on it. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates RECOMMENDED OPERATING CONDITIONS Parameter Supply voltage range Input Voltage Range Output Voltage Range Symbol Min. Typ. Max. Unit Notes VIN 2.5 3.7 5.5 V *1 *2 VFB – 0.3 — VIN + 0.3 V *3 VEN – 0.3 — VIN + 0.3 V *3 VCNT1 – 0.3 — VIN + 0.3 V *3 VCNT2 – 0.3 — VIN + 0.3 V *3 VLX – 0.3 — VIN + 0.3 V *3 Note : Do not apply external currents and voltages to any pin not specifically mentioned. Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND Vin is voltage for AVIN, PVIN. VIN = AVIN = PVIN *1 : Please set the rising time of power input pin to the following range. In addition, please input the voltage with the rising time which has margin enough in consideration of the variation in external parts. *2 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *3 : (VIN + 0.3) V must not be exceeded 6 V. 0V 100 µs < Tr < 1.5 ms (Tr is the rise time from 0 V to the setup voltage of VIN.) Page 3 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA ELECTRICAL CHARACTERISTICS COUT = 4.7 µF, LOUT = 1.0 µH, VOUT Setting = 1.20 V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 C  2 C unless otherwise noted. Parameter Symbol Conditions Limits Min Typ Max Unit Notes Current Consumption Current Consumption IINQ IOUT = 0 A, VOUT = 1.20 V — 40 80 µA — OFF Current Consumption ISTB EN = "L" — 0 1 µA — DC-DC Characteristics Output Voltage Setting 1 VOUT1 CNT1 = "L", CNT2 = "L", IOUT = 600 mA 1.164 1.200 1.236 V — Output Voltage Setting 2 VOUT2 CNT1 = "H", CNT2 = "L", IOUT = 600 mA 1.310 1.350 1.390 V — Output Voltage Setting 3 VOUT3 CNT1 = "L" , CNT2 = "H", IOUT = 600 mA 1.790 1.850 1.910 V — Output Voltage Setting 4 VOUT4 CNT1 = "H" , CNT2 = "H", IOUT = 600 mA 3.200 3.300 3.400 V — Line Regulation REGIN VIN = 2.5 V to 5.5 V, VOUT = 1.20 V, IOUT = 600 mA — 0.25 0.75 %/V — Load Regulation REGLD VOUT = 1.20 V, IOUT = 10 µA to 1.2 A — 3.3 5.8 % — Pch-MOS ON Resistance RONP — — 0.2 0.4  — Nch-MOS ON Resistance RONN — — 0.2 0.4  — SW Frequency FSW IOUT = 600mA (CCM) 2.0 2.6 3.2 MHz — Rising Time TSTU Load resistance = 12 , Settling time to reach 90 % of setting voltage from EN rising edge — — 120 µs — Output discharge resistance RDIS EN = "L" — 10 20  — Page 4 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA ELECTRICAL CHARACTERISTICS (Continued) COUT = 4.7 µF, LOUT = 1.0 µH, VOUT Setting = 1.20 V, VIN = AVIN = PVIN = 3.7 V, Ta = 25 C  2 C unless otherwise noted. Parameter Symbol Conditions EN Control Voltage L VENTL EN Control Voltage H VENTH Limits Unit Notes 0.3 V — — — V — –1 0 1 µA — Min Typ Max — — — — 1.5 VIN = VEN = 5.5 V Logic Pin Characteristics EN Leak Current IENL CNT1 Control Voltage L VCNT1 L — — — 0.3 V — CNT1 Control Voltage H VCNT1 H — VIN – 0.3 — — V — CNT1 Leak Current ICNT1L VIN = VCNT1 = 5.5 V –1 0 1 µA — CNT2 Control Voltage L VCNT2 L — — — 0.3 V — CNT2 Control Voltage H VCNT2 H — VIN – 0.3 — — V — CNT2 Leak Current ICNT2L VIN = VCNT2 = 5.5 V –1 0 1 µA — 2.3 2.4 2.5 V — 25 75 125 mV — Under Voltage Lock out (UVLO) UVLO Detection Voltage VUON UVLO Hysteresis Voltage VUHY VIN rising to Start Operation — Page 5 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA ELECTRICAL CHARACTERISTICS (Continued) COUT = 4.7 µF, LOUT = 1.0 µH, VOUT Setting = 1.20 V, VIN = AVIN = PVIN = 3.7 V, Ta = 25 C  2 C unless otherwise noted. Parameter Symbol Conditions Reference values Min Typ Max Unit Notes DC-DC Characteristics Output current limit ILMT at VOUT drops from 1.20 V to 1.08 V, CNT1 = "L", CNT2 = "L" — 1.8 — A *1 LX leak current ILXL VIN = 5.5 V, Shutdown, VLX = 0 V or 5.5 V — 0 — µA *1 Efficiency 1 EF1 VOUT = 1.35 V, IOUT = 200 mA — 82 — % *1 Output ripple voltage 1 VRPL1 VOUT = 1.20 V, IOUT = 600 mA — 5 — mV [p-p] *1 Output ripple voltage 2 VRPL2 VOUT = 1.20 V, IOUT = 10 mA — 20 — mV [p-p] *1 Load transient response 1 VLSU COUT = 4.7 µF, VOUT = 1.20 V, IOUT = 10 µA to 400 mA ,  t = 1 µs — 25 — mV *1 Load transient response 2 VLSD COUT = 4.7 µF, VOUT = 1.20 V, IOUT = 400 mA to 10 µA,  t = 1 µs — 50 — mV *1 Stabilization time when increased load current TLSU VOUT = 1.20 V, IOUT = 10 µA to 400 mA,  t = 1 µs — 5 — µs *1 Note : *1 : Typical design value Page 6 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA PIN CONFIGURATION Top View A1 A2 A3 B1 B2 B3 C1 C2 C3 PIN FUNCTION Pin No. Pin name Type Description A1 AVIN Power supply A2 FB Input A3 AGND Ground B1 PVIN Power supply B2 EN Input ON / OFF Control pin B3 CNT2 Input Output voltage control 2 pin C1 LX Output LX Terminal Output C2 PGND Ground Power Ground C3 CNT1 Input Power supply pin Feed Back voltage pin Ground pin Power supply pin for internal Power MOS Output voltage control 1 pin Note : Detailed pin descriptions are provided in the OPERATION and APPLICATION INFORMATION section. Page 7 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA FUNCTIONAL BLOCK DIAGRAM PVIN AVIN EN B1 A1 B2 ENC ON / OFF 1.24 V BGR UVLO VREG FB CNT1 CNT2 2.4 V OSP OCP A2 C3 DAC Control Logic B3 Timer C1 Driver LX Generator A3 AGND C2 PGND Note : This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. Page 8 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA TYPICAL CHARACTERISTICS CURVES 1. Output ripple voltage VIN = 3.7 V, VOUT = 1.20 V, COUT = 4.7 µF, LOUT = 1.0 µH IOUT = 600 mA IOUT = 1200 mA LX LX VOUT VOUT 2. Load transient response VIN = 3.7 V, VOUT = 1.20 V , COUT = 4.7 µF , LOUT = 1.0 µH IOUT = 10 µA to 400 mA,  t = 1 µs LX VOUT IOUT IOUT = 400 mA to 10 µA,  t = 1 µs LX VOUT IOUT Page 9 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA TYPICAL CHARACTERISTICS CURVES (Continued) 3. Efficiency VIN = 2.5 V, 3.7 V, 5.5 V, VOUT = 1.20 V, COUT = 4.7 µF, LOUT = 1.0 µH 100 90 80 Ｅｆｆｉｃｉｅｎｃｙ [%] 70 60 50 40 30 VIN=2.5V VIN=3.7V VIN=5.5V 20 10 0 1 10 Load Current [mA] 100 1000 4. Load regulation VIN = 2.5 V, 3.7 V, 5.5 V, VOUT = 1.20 V, COUT = 4.7 µF, LOUT = 1.0 µH 1.4 VIN=2.5V 1.35 VIN=3.7V VIN=5.5V Output Voltage [V] 1.3 1.25 1.2 1.15 1.1 1.05 1 0 200 400 600 Load Current [mA] 800 1000 1200 Page 10 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA OPERATION 1. Pin Setting Pin No. B2 Pin Voltage Description ON / OFF Control For DC-DC Low High OFF ON Remarks Pin No. C3 B3 Pin name CNT1 CNT2 Low Low 1.20 V High Low 1.35 V Low High 1.85 V High High 3.30 V Pin Voltage (*1) Output Voltage *1 : If CNT1 , CNT2 is set to open、DCDC converter does not operate normally. Page 11 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA OPERATION (Continued) 2. Power ON / OFF sequence 3. Protection Output Over-Current Protection (OCP) function and Short-Circuit Protection (OSP) function VIN EN BGR Ground short protection hysteresis UVLO 25 ms DCDC_ON SS Output Voltage [V] (1) The Over-Current Protection is activated at about 1.8 A (Typ). During the OCP, the output voltage continues to drop at the specified current. (2) The Short-Circuit Protection function is implemented when the output voltage decreases and the VFB pin reaches to about 70 % of the output voltage setting. (3) The OSP operates intermittently at 2ms-ON, 16ms-OFF intervals. Over Current Protection (Typ : 1.8 A) 1.3 to 2.3 A (1) (2) (3) Intermittent operation area (Ground short protection detection about 70 % of VOUT) Pendency characteristics VOUT about 150 mA (1)(2) (3) (4) Figure : OCP and OSP Operation (5) (1) When the EN pin is set to "High" after the VIN settles, the BGR start-up. (2) When the BGR exceeds its threshold value, the UVLO is released and the SS(SOFT START) sequence is enabled. During soft start the current limit of DC-DC Step Down Regulator is set to be lower than Normal current limit for preventing rush current. Internal circuit power supply is turned on and wait for the time determined by internal timer. (3) DCDC_ON is turned on then DC-DC Step Down Regulator is enabled. VOUT is risen up to reaches the set voltage. (4) After a Soft start timer current limit is set to be Normal current limit. (5) When the EN pin is set to "Low", the BGR and UVLO stop operation. The VOUT pin voltage starts to drop by output discharge resister and load resistance. Output current [A] IOUT (1) DCDC_ON SS OSP VOUT (2) (2) 2 ms 2 ms 16 ms 16 ms (3) Page 12 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA APPLICATIONS INFORMATION 1. Application circuit VIN CNT1 CNT2 PVIN CIN1 FB VOUT AVIN CIN2 AN30180AA LX LOUT COUT EN AGND PGND 2. Recommended component Reference Designator QTY Value Manufacturer Part Number Note CIN1 1 4.7 µF Murata GRM21BB31E475KA75B — CIN2 1 4.7 µF Murata GRM21BB31E475KA75B — COUT 1 4.7 µF Murata GRM21BB31E475KA75B — LOUT 1 1.0 µH FDK MIPSZ2012D1R0 — 3. Evaluation board layout AN30180AA Figure Top Layer with silk screen (Top View) with Evaluation board Figure Bottom Layer with silk screen (Bottom View) with Evaluation board Notes : This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. Page 13 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA PACKAGE INFORMATION (Reference Data) Outline Drawing Unit:mm Package Code : UBGA009-W-1515AEL Body Material : Br/Sb Free Epoxy Resin Reroute Material : Cu Bump : SnAgCu Page 14 of 15 Established : 2012-12-06 Revised : 2013-10-01 Doc No. TA4-EA-06146 Revision. 4 Product Standards AN30180AA IMPORTANT NOTICE 1. When using the IC for new models, verify the safety including the long-term reliability for each product. 2. When the application system is designed by using this IC, please confirm the notes in this book. Please read the notes to descriptions and the usage notes in the book. 3. This IC is intended to be used for general electronic equipment. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automotive, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required Our company shall not be held responsible for any damage incurred as a result of or in connection with the IC being used for any special application, unless our company agrees to the use of such special application. However, for the IC which we designate as products for automotive use, it is possible to be used for automotive. 4. This IC is neither designed nor intended for use in automotive applications or environments unless the IC is designated by our company to be used in automotive applications. Our company shall not be held responsible for any damage incurred by customers or any third party as a result of or in connection with the IC being used in automotive application, unless our company agrees to such application in this book. 5. Please use this IC in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage incurred as a result of our IC being used by our customers, not complying with the applicable laws and regulations. 6. Pay attention to the direction of the IC. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might be damaged. 7. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 8. Perform visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as solder-bridge between the pins of the IC. Also, perform full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the IC during transportation. 9. Take notice in the use of this IC that it might be damaged when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short). Safety measures such as installation of fuses are recommended because the extent of the above-mentioned damage will depend on the current capability of the power supply. 10. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the IC might be damaged before the thermal protection circuit could operate. 11. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the IC might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 12. Product which has specified ASO (Area of Safe Operation) should be operated in ASO 13. Verify the risks which might be caused by the malfunctions of external components. 14. Due to the unshielded structure of this IC, functions and characteristics of the IC cannot be guaranteed under the exposure of light. During normal operation or even under testing condition, please ensure that the IC is not exposed to light. 15. Please ensure that your design does not have metal shield parts touching the chip surface as the surface potential is GND voltage. Page 15 of 15 Established : 2012-12-06 Revised : 2013-10-01 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202