AXG7300J7A

For board-to-FPC To Be Discontinued Last time buy: September 30, 2019 A35US High Current Connectors With Power Terminal 4. Power terminal type means power line is ensured without having to use signal line. Contributes to space savings Power terminals Specification: 3 A in two locations New m 2m 2. 2. Socket 1. 8m 2m m m 1. Socket 8m m Header Header Example; Charging current: Max. 3.0 A (0.3 A/pin, Pitch: 0.35 mm) Product without power terminals RoHS compliant 20 pins signal terminals used With power terminal 3.5mm 3 A power terminals 20 pins signal terminals can be reduced. –3.5mm FEATURES 1. 0.6 mm Mated Height with 2.2 mm width. 2. Supports 3A power terminals 3. “ ” structure provides a slim and low-profile design resistant to various environmental conditions. APPLICATIONS Multiple connection of power signal between USB and battery in portable terminals such as smartphones and tablet PCs ORDERING INFORMATION AXG 0 J 7: Socket 8: Header Number of pins (2 digits) Mated height / 0: 0.6 mm Functions J: 3A type Power terminal Surface treatment (Contact portion / Terminal portion) 7: Base: Ni plating, Surface: Au plating (for Ni barrier available) 4: Base: Ni plating, Surface: Au plating –1– ACCTB78E 201809-T To Be Discontinued Last time buy: September 30, 2019 High current connectors A35US with power terminal (0.35mm pitch) PRODUCT TYPES Number of pins Mated height 0.6mm Part number Packing 10 Socket AXG7100J7 Header AXG8100J4 12 16 20 24 30 34 40 44 50 60 70 AXG7120J7 AXG7160J7 AXG7200J7 AXG7240J7 AXG7300J7 AXG7340J7 AXG7400J7 AXG7440J7 AXG7500J7 AXG7600J7 AXG7700J7 AXG8120J4 AXG8160J4 AXG8200J4 AXG8240J4 AXG8300J4 AXG8340J4 AXG8400J4 AXG8440J4 AXG8500J4 AXG8600J4 AXG8700J4 Inner carton (1-reel) Outer carton 10,000 pieces 20,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units For samples, please contact our sales office. 2. Please contact us for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Rated voltage Specifications 3.0A/pin contact (power terminal) 0.30A/pin contact (signal terminal): Max. 5 A at total pin contacts 60V AC/DC Dielectric strength 150V AC for 1 min. Rated current Electrical characteristics Insulation resistance Contact resistance Mechanical characteristics Composite insertion force Composite removal force Contact holding force (Socket signal terminal, Header power terminal) Ambient temperature Storage temperature Conditions No short-circuiting or damage at a detection current of 1 mA when the specified voltage is applied for one minute. Using 250V DC megger (applied for 1 min.) Min. 1,000MΩ (initial) Max. 30mΩ (power terminal) Max. 90mΩ (signal terminal) 1.300N/pin contacts × pin contacts 0.165N/pin contacts × pin contacts Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. Min. 0.20N/pin contacts –55°C to +85°C No icing or condensation. –55°C to +85°C (product only) –40°C to +50°C (emboss packing) No icing or condensation. Conformed to MIL-STD-202F, method 107G Thermal shock resistance (header and socket mated) Environmental characteristics Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) H2S resistance (header and socket mated) Lifetime characteristics Insertion and removal life Order Temperature (°C) 1 –55 −30 2 3 85 +30 4 –55 −30 5 cycles, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 120 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 24 hours, insulation resistance min. 100MΩ, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) 48 hours, contact resistance max. 30mΩ (power terminal) max. 90mΩ (signal terminal) Time (minutes) 30 Max. 5 30 Max. 5 Conformed to IEC60068-2-78 Bath temperature 40°C±2°C, humidity 90% to 95% R.H. Conformed to IEC60068-2-11 Bath temperature 35°C±2°C, saltwater concentration 5%±1% 30 times Soldering heat resistance The initial specification must be satisfied electrically and mechanically Unit weight 60 pin contacts: Socket 0.02g Header 0.01g Bath temperature 40°C±2°C, gas concentration 3 ppm ±1 ppm, humidity 75% to 80% R.H. Repeated insertion and removal speed of max. 200 times/ hours Infrared reflow soldering: Peak temperature: 260°C or less (on the surface of the PC board around the connector terminals) Soldering iron: 300°C within 5 sec. 350°C within 3 sec. 2. Material and surface treatment Part name Molded portion Contact and Post Material LCP resin (UL94V-0) Copper alloy Surface treatment — Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Power terminals: Sockets: Base: Ni plating, Surface: Au plating (except the terminal tips) Headers: Base: Ni plating, Surface: Au plating –2– ACCTB78E 201809-T To Be Discontinued Last time buy: September 30, 2019 High current connectors A35US with power terminal (0.35mm pitch) DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ Socket (Mated height: 0.6 mm) Terminal coplanarity A B±0.1 0.35±0.05 0.12±0.03 0.59 2.20 Dimension table (mm) Power terminal Signal terminal (0.55) 2.20 Y (Note) 0.08 (Contact and Power terminal) 1.96 0.60 (Suction face) CAD Data 0.66 Z (Note) 0.30±0.03 C±0.1 Number of pins/ dimension 10 4.25 1.40 3.45 12 16 20 24 30 34 40 44 50 60 70 4.60 5.30 6.00 6.70 7.75 8.45 9.50 10.20 11.25 13.00 14.75 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 10.15 11.90 3.80 4.50 5.20 5.90 6.95 7.65 8.70 9.40 10.45 12.20 13.95 B C A B C General tolerance: ±0.2 Note: Since power terminals are built into the body, the Y and Z parts are connected electrically. Header (Mated height: 0.6 mm) Terminal coplanarity A B±0.1 0.35±0.05 0.12±0.03 0.46 0.08 (Post and Power terminal) 1.42 1.80 0.80 (Suction face) CAD Data 0.08±0.03 C±0.1 0.48 0.32 1.28 (Power terminal) Signal terminal Power terminal Dimension table (mm) Number of pins/ dimension 10 3.55 1.40 3.17 12 16 20 24 30 34 40 44 50 60 70 3.90 4.60 5.30 6.00 7.05 7.75 8.80 9.50 10.55 12.30 14.05 1.75 2.45 3.15 3.85 4.90 5.60 6.65 7.35 8.40 10.15 11.90 3.52 4.22 4.92 5.62 6.67 7.37 8.42 9.12 10.17 11.92 13.67 A General tolerance: ±0.2 Header 0.60±0.1 Socket and Header are mated Socket –3– ACCTB78E 201809-T To Be Discontinued Last time buy: September 30, 2019 High current connectors A35US with power terminal (0.35mm pitch) EMBOSSED TAPE DIMENSIONS (Unit: mm) • Specifications for taping (In accordance with JIS C 0806-3:1999. However, not applied to the mounting-hole pitch of some connectors.) • Specifications for the plastic reel (In accordance with EIAJ ET-7200B.) Tape I (A +0.3 −0.1 ) (C±1) Label 380 dia. Top cover tape (4.0) Leading direction after packaging (B) (1.75) Embossed carrier tape (2.0) Embossed mounting-hole 4.0 Taping reel .1 +0 0 5 1. a. di • Dimension table (Unit: mm) Socket Header Number of pins Max. 30 Type of taping Tape I A 16.0 B 7.5 C 17.4 Quantity per reel 10,000 34 to 70 Tape I 24.0 11.5 25.4 10,000 Number of pins Max. 34 40 to 70 Type of taping Tape I Tape I A 16.0 24.0 B 7.5 11.5 C 17.4 25.4 Quantity per reel 10,000 10,000 • Connector orientation with respect to embossed tape feeding direction Type Common for A35US with power terminal Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. –4– ACCTB78E 201809-T To Be Discontinued Last time buy: September 30, 2019 High current connectors A35US with power terminal (0.35mm pitch) NOTES 12 0.60±0.03 1.325±0.03 : Insulatin area (0.50) 0.90±0.03 1.20±0.03 2.20±0.03 (0.39) 0.70±0.03 0.35±0.03 0.20±0.03 : Insulatin area 0.26±0.03 1.045±0.03 0.60±0.01 1.325±0.01 1.42±0.01 (0.39) 0.35±0.01 0.18±0.01 (0.39) 15 0. C 8× 0.35±0.01 0.18±0.01 1.48±0.01 Metal mask thickness: When 100μm (Signal terminal opening ratio: 70%) (Power terminal opening ratio: 77%) 0.70±0.01 Recommended metal mask pattern Metal mask thickness: When 100μm (Terminal opening ratio: 70%) (Metal-part opening ratio: 46%) (0.39) 1.82±0.01 2.60±0.01 Recommended metal mask pattern 0.20±0.01 0.885±0.01 Please refer to the latest product specifications when designing your product. –5– ACCTB78E 201809-T 2.20±0.01 ×C 0. 15 0.35±0.03 0.20±0.03 1.48±0.03 Recommended PC board pattern (TOP VIEW) (0.50) 0.20±0.03 1.60±0.03 2.60±0.03 • Header (Mated height: 0.6 mm) Recommended PC board pattern (TOP VIEW) 2.50±0.03 1.04±0.03 (0.73) • Socket (Mated height: 0.6 mm) 2.50±0.01 1.80±0.01 (0.35) 1. Design of PC board patterns Conduct the recommended foot pattern design, in order to preserve the mechanical strength of terminal solder areas. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Notes on Using Narrow pitch Connectors/High Current Connectors For board-to-board/board-to-FPC Notes on Using Narrow pitch Connectors/ High Current Connectors About safety remarks Observe the following safety remarks to prevent accidents and injuries. 3) Panasonic Corporation is consistently striving to improve 1) Do not use these connectors beyond the specification sheets. quality and reliability. However, the fact remains that electrical The usage outside of specified rated current, dielectric strength, components and devices generally cause failures at a given and environmental conditions and so on may cause circuitry statistical probability. Furthermore, their durability varies with damage via abnormal heating, smoke, and fire. use environments or use conditions. In this respect, please 2) In order to avoid accidents, your thorough specification review check for actual electrical components and devices under actual is appreciated. Please contact our sales office if your usage is conditions before use. Continued usage in a state of degraded out of the specifications. Otherwise, Panasonic Corporation condition may cause the deteriorated insulation, thus result in cannot guarantee the quality and reliability. abnormal heat, smoke or firing. Please carry out safety design and periodic maintenance including redundancy design, design for fire spread prevention, and design for malfunction prevention so that no accidents resulting in injury or death, fire accidents, or social damage will be caused as a result of failure of the products or ending life of the products. Regarding the design of devices and PC board patterns 1) When using the board to board connectors, do not connect a pair of board with multiple connectors. Otherwise, misaligned connector positions may cause mating failure or product breakage. 2) With mounting equipment, there may be up to a ±0.2 to 0.3 mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) PC board Control the thicknesses of the cover lay and adhesive to prevent poor soldering. This connector has no stand-off. Therefore, minimize the thickness of the cover lay, etc. so as to prevent the occurrence of poor soldering. 6) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws 7) When mounting connectors on a FPC • When the connector soldered to FPC is mated or unmated, solder detachment may occur by the force to the terminals. Connector handling is recommended in the condition when the reinforcing plate is attached to the backside of FPC where the connector is mounted. The external dimension of the reinforcing plate is recommended to be larger than the dimension of “Recommended PC board pattern” (extended dimension of one side is approximately 0.5 to 1.0 mm). The materials and thickness of the reinforcing plate are glass epoxy or polyimide (thickness 0.2 to 0.3 mm) or SUS (thickness 0.1 to 0.2 mm). • As this connector has temporary locking structure, the connector mating may be separated by the dropping impact depend on the size, weight or bending force of the FPC. Please consider the measures at usage to prevent the mating separation. 8) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Screw ↓ ↓ Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. –6– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the chucking force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. 6) In case of dry condition, please note the occurrence of static electricity. The product may be adhered to the embossed carrier tape or the cover tape in dry condition. Recommended humidity is from 40 to 60%RH and please remove static electricity by ionizer in manufacturing process. Regarding soldering Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (Please refer to the specification for detail because the temperature setting differs by products.) 2) As for cream solder printing, screen printing is recommended. 3) When setting the screen opening area and PC board foot pattern area, refer the recommended PC board pattern and window size of metal mask on the specification sheet, and make sure that the size of board pattern and metal mask at the base of the terminals are not increased. 4) Please pay attentions not to provide too much solder. It makes miss mating because of interference at soldering portion when mating. Terminal Paste solder PC board foot pattern 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) The condition of solder or flux rise and wettability varies depending on the type of solder and flux. Solder and flux characteristics should be taken into consideration and also set the reflow temperature and oxygen level. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. Table A Product name Soldering iron temperature SMD type connectors all products 300°C within 5 sec. 350°C within 3 sec. 180℃ 150℃ Peak temperature Preheating 220℃ 200℃ 25 sec. 60 to 120 sec. 70 sec. Upper limited (Solder heat resistance) Lower limited (Solder wettability) Time For products other than the ones above, please refer to the latest product specifications. 9) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector before mounting. 10) Please contact our sales office when using a screen-printing thickness other than that recommended. 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) These connector is low profile type. If too much solder is supplied for hand soldering, It makes miss mating because of interference at soldering portion. Please pay attentions. S iro old n eri Apply the solder wire here Temperature Peak temperature 260℃ 230℃ ng 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. 7) Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed. 8) Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact our sales office before using a temperature profile other than that described below (e.g. lead-free solder) Small angle as possible up to 45 degrees Terminal PC board Pattern –7– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Solder reworking 1) Finish reworking in one operation. 2) In case of soldering rework of bridges. Do not use supplementary solder flux. Doing so may cause contact problems by flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. Handling single components 1) Make sure not to drop or allow parts to fall from work bench. 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. Precautions for mating This product is designed with ease of handling. However, in order to prevent the deformation or damage of contacts and molding, take care and do not mate the connectors as shown right. Press-fitting while the mating Strongly pressed and inlets of the socket and twisted header are not matched. Tilted mating Cleaning flux from PC board There is no need to clean this product. If cleaning it, pay attention to the following points to prevent the negative effect to the product. 1) Keep the cleaning solvent clean and prevent the connector contacts from contamination. 2) Some cleaning solvents are strong and they may dissolve the molded part and characters, so pure water passed liquid solvent is recommended. Handling the PC board Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components already set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. Other Notes 1) Do not remove or insert the electrified connector (in the state of carrying current or applying voltage). 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Product failures due to condensation are not covered by warranty. –8– ACCTB48E 201803-T Notes on Using Narrow pitch Connectors/High Current Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50-piece units in the condition given right. Consult a sale representative for ordering sample units. Condition when delivered from manufacturing Embossed tape amount required for the mounting Required number of products for sample production Reel Delivery can also be made on a reel by customer request. (Unit 50 pcs.) Please refer to the latest product specifications when designing your product. –9– ACCTB48E 201803-T