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DMC502010R

DMC502010R

  • 厂商:

    NAIS(松下)

  • 封装:

    SMD5

  • 描述:

    TRANSISTOR NPN 50V SMINI5-F3-B

  • 数据手册
  • 价格&库存
DMC502010R 数据手册
DMC50201 Silicon NPN epitaxial planar type Unit: mm For general amplification DMC20201 in SMini5 type package  Features  High forward current transfer ratio hFE with excellent linearity  Low collector-emitter saturation voltage VCE(sat)  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  Marking Symbol: A6  Basic Part Number Dual DSC2001 (Common base)  Packaging DMC502010R Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25°C Parameter Tr1 Tr2 Overall Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 60 V Collector-emitter voltage (Base open) VCEO 50 V Emitter-base voltage (Collector open) VEBO 7 V Collector current IC 100 mA Peak collector current ICP 200 mA Total power dissipation PT 150 mW Junction temperature Tj 150 °C Operating ambient temperature Topr –40 to +85 °C Storage temperature Tstg –55 to +150 °C 4: Collector (Tr2) 5: Collector (Tr1) 1: Base (Tr1) 2: Emitter (Common) 3: Base (Tr2) Panasonic JEITA Code SMini5-F3-B SC-113CB SOT-353 (C1) 5 (C2) 4 Tr1 1 (E1) Tr2 2 (B) 3 (E2)  Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 µA, IE = 0 60 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Emitter-base voltage (Collector open) VEBO IE = 10 µA, IC = 0 7 V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = 10 V, IB = 0 100 µA Forward current transfer ratio hFE VCE = 10 V, IC = 2 mA 210 460  hFE (Small/Large) VCE = 10 V, IC = 2 mA 0.50 hFE ratio *1 Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) VCE(sat) fT Cob 0.99  IC = 100 mA, IB = 10 mA 0.13 0.3 V VCE = 10 V, IC = 2 mA 150 MHz VCB = 10 V, IE = 0, f = 1 MHz 1.5 pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Ratio between 2 elements Publication date: December 2013 Ver. CED 1 DMC50201 DMC50201_IC-VCE DMC50201_PT-Ta PT  Ta DMC50201_hFE-IC IC  VCE 250 hFE  IC 120 600 VCE = 10 V 150 100 50 IB = 250 µA 200 µA 60 150 µA 40 100 µA 20 0 40 80 120 160 0 200 Ambient temperature Ta (°C) 50 µA 0 2 4 10 VCE = 10 V Collector current IC (mA) 1 0.1 Ta = 85°C 25°C Ta = 85°C 80 10 100 −40°C 60 40 0 0 0.2 0.4 0.6 0.8 1.0 Base-emitter voltage VBE (V) Collector current IC (mA) 1 10 100 Collector current IC (mA) Cob  VCB 25°C 1 0 0.1 DMC50201_Cob-VCB 20 −40°C 0.01 0.1 100 12 120 100 −40°C 200 IC  VBE IC / IB = 10 25°C 300 DMC50201_IC-VBE VCE(sat)  IC Collector-emitter saturation voltage VCE(sat) (V) 8 Ta = 85°C 400 Collector-emitter voltage VCE (V) DMC50201_VCEsat-IC 10 6 500 1.2 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 80 Forward current transfer ratio hFE 100 200 Collector current IC (mA) Total power dissipation PT (mW) Ta = 25°C 4.0 3.0 2.0 1.0 0 1 10 100 Collector-base voltage VCB (V) DMC50201_fT-IC fT  IC Transition frequency fT (MHz) 250 VCE = 10 V Ta = 25°C 200 150 100 50 0 0.1 1 10 100 Collector current IC (mA) Ver. CED 2 DMC50201 SMini5-F3-B Unit: mm  Land Pattern (Reference) (Unit: mm) Ver. CED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most upto-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination, please understand that customers will bear the burden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618
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