MA4X159AGL

This product complies with the RoHS Directive (EU 2002/95/EC). Switching Diodes MA4X159AG Silicon epitaxial planar type For switching circuits ■ Package ■ Features M Di ain sc te on na tin nc ue e/ d • Code Mini4-G3 • Pin Name • Two isolated elements contained in one package, allowing highdensity mounting • Short reverse recovery time trr • Small terminal capacitance Ct di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. 1: Cathode 1 2: Cathode 2 3: Anode 2 4: Anode 1 ■ Absolute Maximum Ratings Ta = 25°C Parameter Symbol Reverse voltage VR Maximum peak reverse voltage Forward current VRM Single IF Double IFM V ■ Marking Symbol: M1B 80 V 100 mA 225 Double ■ Internal Connection mA (A2) 3 (A1) 4 2 (C2) 1 (C1) 170 Single Non-repetitive peak forward surge current * Unit 80 75 Single Peak forward current Rating IFSM 500 Double mA 375 Junction temperature Tj Storage temperature Tstg °C −55 to +150 °C ue Note) *: t = 1 s 150 Parameter Forward voltage ce /D isc on tin ■ Electrical Characteristics Ta = 25°C ± 3°C Symbol VF VR an Reverse voltage IR en Reverse current Ct Reverse recovery time * trr Ma int Terminal capacitance Conditions Min IF = 100 mA IR = 100 µA Typ Max Unit 0.95 1.20 V 100 nA 2.0 pF 3 ns 80 V VR = 75 V VR = 0 V, f = 1 MHz 0.9 IF = 10 mA, VR = 6 V Irr = 0.1 IR, RL = 100 Ω Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Absolute frequency of input and output is 100 MHz. 3. *: trr measurement circuit Bias Application Unit (N-50BU) Input Pulse tp tr 10% A VR Pulse Generator (PG-10N) Rs = 50 Ω Publication date: March 2009 Wave Form Analyzer (SAS-8130) Ri = 50 Ω SKF00099AED 90% tp = 2 µs tr = 0.35 ns δ = 0.05 Output Pulse t IF trr t Irr = 0.1 IR IF = 10 mA VR = 6 V RL = 100 Ω 1 This product complies with the RoHS Directive (EU 2002/95/EC). MA4X159AG IR  VR 102 10 10 1.0 Ta = 125°C 1 Ta = 75°C 10 −1 IF = 100 mA 0.8 10 mA 0.6 M Di ain sc te on na tin nc ue e/ d Ta = 125°C VF  T a 1.2 Forward voltage VF (V) 102 Reverse current IR (µA) Forward current IF (mA) IF  VF 103 75°C 25°C −20°C 10 −1 0.2 0.4 0.6 0.8 1.0 1.2 Forward voltage VF (V) IR  T a 40 60 80 VR = 40 V 10 −1 10 −2 −40 0 40 80 120 160 an en int −40 0 10 −1 10 20 30 40 50 Reverse voltage VR (V) SKF00099AED 80 120 160 IF(surge)  tW 103 f = 1 MHz Ta = 25°C 0 40 Ambient temperature Ta (°C) 1 ce /D isc on tin Ambient temperature Ta (°C) Ma 120 Ct  VR VR = 80 V 1 100 Forward surge current IF(surge) (A) Reverse current IR (µA) 20 10 10 2 0 0 Reverse voltage VR (V) 102 10 −3 10 −3 Terminal capacitance Ct (pF) 0 0.1 mA 0.2 ue 10 −2 Ta = 25°C 10 −2 3 mA 1 mA 0.4 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. 1 60 Ta = 25°C IF(surge) tW Non repetitive 102 10 1 10 −1 10 −1 1 Pulse width tW (ms) 10 8° +0.25 −0.05 (0.95) (0.95) 3 4 2 1 (0.20) 0.65 −0.05 +0.10 0.40 −0.05 +0.10 SKF00099AED +0.3 −0.1 +0.2 −0.1 Mini4-G3 1.9 ±0.1 ±0.2 +0.2 −0.3 di p Pl lan nclu ea e se pla m d m des htt0 to v0.1isit 1.1 ne ain ain fo(0.65) 1.50 d d te te llow p:/ fo n d n in /w l1.1 i ww lowi isco scon ance anc g fo 2.8 .se ng ntin tin ty e ty ur6° mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm 0.4 . /en at i o / n. ue ce /D isc on tin an en int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). MA4X159AG Unit: mm 2.90 −0.05 +0.20 0.13 −0.02 +0.05 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es ne ain ain foll htt visit d d te te ow p:/ fo d /w llo is isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i / on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20080805