NN32251A-EVB-0

Evaluation Board User’s Guide NN32251A http://www.semicon.panasonic.co.jp/en/ INTEGRATED WIRELESS POWER SUPPLY TRANSMITTER, Qi (WIRELESS POWER CONSORTIUM) COMPLIANT - Evaluation Board User’s Guide (A11 type) FEATURES DESCRIPTION  Integrated wireless power transmitter controller  WPC Ver. 1.1 ready  MCU embedded  Half-bridge gate driver ： 4ch (full-bridge gate driver ： 2ch also configurable)  Single-coil (Type A11) supported  Expanded free positioning using multi-coils up to 4 coils (Type A6)  Highly accurate voltage and current monitor for inverters  Output controlled by frequency or duty, defined in Qi. ASK demodulation for both current and voltage signals (Qi compliant)  Input voltage range : VADP, VINV : 4.6 to 19.5V  Supports Under Voltage Lockout , Thermal Shutdown, Over Current Detection  Short-circuit protection at inverter output  Temperature Detecting Circuit ： 3ch  LED indicator ： 2ch  package ： 64 pins HQFP (size : 12mm  12mm) NN32251A is a wireless power system controller IC which is compliant with Qi version 1.1 of the System Description Wireless Power Transfer, Volume 1 for Low Power, defined by Wireless Power Consortium. NN32251A is a controller IC of a power transmitter (Tx) which can supply power to any Qi-compliant wireless chargers. APPLICATIONS ・WPC-compliant wireless charger IMPORTANT NN32251A is designed to be used based on the circuits and external components described in this document . Therefore, Panasonic cannot support any inquiries of modified solution. Wireless Power System Wireless Power VIN OUT Cp Cs Cd TX Coil Co RX Coil Rectifier NN32251A Tx Inverter VRECT IOUT Charger + AN32258A Control IC Receiver (Rx) Transmitter (Tx) Communication Page 1 of 7 L2 A11 C71 22n Q8 37 C50 C29 C28 (0.1uF*4) C18 C52 D3 48 46 45 47 44 43 36 40 58 IC1 1 16 NN32251A 32 54 TEST 61 C8 1uF 21 LED2 59 22 LED1 24 18 19 23 25 26 50 27 52 28 GNDP1 56 CFB1 29 CFB2 57 42 30 LDO41V TH3A R72 0LDO33V TH2 R11 R16 TH2A R71 0LDO33V R8 TH1 R13 R18 TH1 TH1A LDO18V VFIL2 C7 1000pF VFIL1 C6 2200pF CSOUT CFIL2 CFIL1 CSIN2 TH2B C9 1uF R12 TH3B R7 R14 R6 TH1B 17 CMODIN C5 68000pF VREF LDO41V D1 C10 4.7uF 64 LDO41V R10 560 LDO41V C3 C4 3300pF 1000pF D2 R9 560 TH3 20 Current Sense Resistor SCDET4 PD4L PD4H SCDET3 PD3L PD3H SCDET2 PD2L 39 R42 2 PD2H 35 PD1 38 L PD1H SCDET1 C56 1000p R43 20 C72 Q7 C55 22n Q6 C54 1000p R41 20 41 34 L1A L2A R40 2 C53 55 33 VINV LG2 53 PLLFIL Q5 C73 C74 0.1uF 0.1uF C16 0.01uF C11 1uF LDO41V GNDA3 PWR TYP SMBC 3 SCL R50 R51 LDO41V 0 SDA R31 1k LDO33V R32 1k LDO33V GNDMC MODE 63 2 SMBD 62 4 LDO41V R62 0 SELLED1 LDO41V R61 R60 0 R59 R57 0 LDO41V LDO41V R55 LDO41V R33 0 R56 0 LDO41V R34 R54 0 R58 SELLED2 NCO1 51 6 7 NCO2 8 9 10 LDO41V LDO41V R53 R49 0 SELFOD1 11 SELFOD2 FWMD R46 R48 R47 0 TEST4 12 13 R30 100k LDO33V FWMD 14 TEST2 ENB 15 60 1. EVB Circuit Diagram HG2 51 49 VFB LG1 VADP C24 C42 10uF 10uF LDO33V C14 C13 C12 3300pF 1000pF 3900pF VFIL3 C15 10uF C23 10uF VADP Power Supply (5.0V) R52 0 VFIL4 HG1 L10 LDO41V1 R44 100k FGND Evaluation Board User’s Guide NN32251A EVB (for Qi Type A11) Information R73 0LDO33V TH3 C62 R15 TH2 C61 R17 C60 R19 GNDMOD VMODIN C20 2200pF CSIN1 GNDP2 31 GNDA1 R4 25m R2 1k R3 10k C19 0.01uF Page 2 of 7 Evaluation Board User’s Guide NN32251A EVB (for Qi Type A11) Information (Continued) 2. Bill of Materials Size Parts No. Name Manufacture Value IC IC1 - - 12.0 x 12.0 1.2 L2 NN32251A CEBO-RA2D22A Panasonic Coil CHEMTRONICS - - - - 1 1 C18,C28, C29,C50 C4532C0G2E104J320KN TDK 0.1uF 250V 4.5 x 3.2 3.2 3 C3, C14 GRM188B11E332KA01 MURATA 3300pF 25V 1.6 x 0.8 0.8 2 GRM188B11E102KA01 MURATA 1000pF 25V 1.6 x 0.8 0.8 5 GRM188B11E222KA01 MURATA 2200pF 25V 1.6 x 0.8 0.8 1 C12 GRM188B11E392KA01 MURATA 3900pF 25V 1.6 x 0.8 0.8 1 C5 GRM188B11E683KA01 MURATA 68000pF 25V 1.6 x 0.8 0.8 1 C16 GRM188B11H103KA01 MURATA 0.01uF 50V 1.6 x 0.8 0.8 1 C8, C9, C11 GRM188B31E105KA75 MURATA 1uF 25V 1.6 x 0.8 0.8 3 C19 GRM188R72A103KA01 MURATA 0.01uF 100V 1.6 x 0.8 0.8 1 C20 GRM188R72D222KW07D MURATA 2200pF 200V 1.6 x 0.8 0.8 1 C15,C23, C24,C42 UMK325AB7106MM-T TAIYO YUDEN 10uF 50V 3.2 x 2.5 2.5 4 C4, C7, C13, C54, C56 C6 Capacitor Resistor Rating (JIS or PKG) T(max) Qty mm Category C10 GRM21BB31E475KA75 MURATA 4.7uF 25V 2.1 x1.25 1.25 1 C71, C72 GRM319R71H223JA01 MURATA 22nF 50V 3.2 x 1.6 0.95 2 C73, C74 GRM188R71H104KA93 MURATA 0.1uF 50V 1.6 x 0.8 0.8 2 R2, R31, R32 ERJ3EKF1001V Panasonic 1K 1％ 1.6 x 0.8 0.55 3 R3 ERJ3EKF1002V Panasonic 10K 1％ 1.6 x 0.8 0.55 1 R4 ERJ8BWFR025 Panasonic 25m 1％ 3.2 x 1.6 0.75 1 R9,R10 ERJ3EKF5600U Panasonic 560 1％ 1.6 ｘ 0.8 0.55 2 R30, R44 ERJ3EKF1003V Panasonic 100K 1％ 1.6 x 0.8 0.55 2 R40, R42 ERJ3GEYJ2R0V Panasonic 2 5% 1.6 x 0.8 0.55 2 R41, R43 ERJ3GEYJ200V Panasonic 20 5% 1.6 x 0.8 0.55 2 R33,R47, R49,R51, R52,R54, R56,R57, R60,R62, R71,R72, R73 ERJ3GEY0R00V Panasonic 0 - 1.6 x 0.8 0.55 13 Pch-MOSFET Q5,Q7 SIA445EDJ Vishay Siliconix 2.05 x 2.05 0.8 2 Nch-MOSFET Q6,Q8 SIA400EDJ Vishay Siliconix 2.05 x 2.05 0.8 2 LED D1 LNJ337W83RA Panasonic green - 1.6 x 0.8 0.25 1 LED D2 LNJ237W82RA Panasonic red - 1.6 x 0.8 0.25 1 Diode D3 DA22F21 Panasonic - - 3.5 X 1.6 0.8 1 Page 3 of 7 Evaluation Board User’s Guide NN32251A EVB (for Qi Type A11) Information (Continued) 3. EVB Layout 3-1. Evaluation Board EVB Photo (Top) EVB Top Assembly EVB Photo (Bottom) EVB Bottom Assembly 3-2. Specification of EVB Category Specification EVB size 60.0 mm × 60.0 mm Thickness 0.80 mm Layer 4 layers Note : The circuit and layout are designed for this evaluation board only. Thorough verification and evaluation must be done for the final product at your own risk. Page 4 of 7 Evaluation Board User’s Guide NN32251A EVB (for Qi Type A11) Information (Continued) 4. The Whole Picture 5V Input GND Page 5 of 7 Evaluation Board User’s Guide NN32251A EVB (for Qi Type A11) Information (Continued) 5. LED Display - Combination of LED display can be adjusted by pins SELLED1(No.4) and SELLED2(No.6) as the next table shows. Both pins are connected to GND on this board. System Status Pin Name (Number) LED Pin GND GND LDO41V LDO41V GND LDO41V LDO41V Ping ID & Configuration Power Transfer Full Charge Error Temperature Error Charge Full Charge Error Charge SELLED2 SELLED1 (No.6) (No.4) GND Selection Standby LED1 OFF ON OFF Blink LED2 OFF OFF ON OFF LED1 OFF OFF OFF ON LED2 OFF Blink ON OFF LED1 ON OFF OFF ON LED2 ON Blink ON OFF LED1 OFF OFF OFF ON LED2 OFF ON OFF OFF Page 6 of 7 Evaluation Board User’s Guide NN32251A IMPORTANT NOTICE 1. When using the IC for new models, verify the safety including the long-term reliability for each product. 2. When the application system is designed by using this IC, please confirm the notes in this book. Please read the notes to descriptions and the usage notes in the book. 3. This IC is intended to be used for general electronic equipment. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automotive, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required Our company shall not be held responsible for any damage incurred as a result of or in connection with the IC being used for any special application, unless our company agrees to the use of such special application. However, for the IC which we designate as products for automotive use, it is possible to be used for automotive. 4. This IC is neither designed nor intended for use in automotive applications or environments unless the IC is designated by our company to be used in automotive applications. Our company shall not be held responsible for any damage incurred by customers or any third party as a result of or in connection with the IC being used in automotive application, unless our company agrees to such application in this book. 5. Please use this IC in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage incurred as a result of our IC being used by our customers, not complying with the applicable laws and regulations. 6. Pay attention to the direction of the IC. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might be damaged. 7. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 8. Perform visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as solder-bridge between the pins of the IC. Also, perform full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the IC during transportation. 9. Take notice in the use of this IC that it might be damaged when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short). Safety measures such as installation of fuses are recommended because the extent of the above-mentioned damage will depend on the current capability of the power supply. 10. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the IC might be damaged before the thermal protection circuit could operate. 11. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the IC might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 12. Verify the risks which might be caused by the malfunctions of external components. Page 7 of 7 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202