N16L163WC2CZ1

NanoAmp Solutions, Inc. 670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035 ph: 408-935-7777, FAX: 408-935-7770 www.nanoamp.com N16L163WC2C Advance Information 16Mb Ultra-Low Power Asynchronous CMOS SRAM 1024K × 16 bit Overview The N16L163WC2C is an integrated memory device containing a 8Mbit Static Random Access Memory organized as 1,048,576 words by 16 bits. The device is designed and fabricated using NanoAmp’s advanced CMOS technology to provide both high-speed performance and ultra-low power. The device operates with two chip enable (CE1 and CE2) controls and output enable (OE) to allow for easy memory expansion. Byte controls (UB and LB) allow the upper and lower bytes to be accessed independently and can also be used to deselect the device. The N16L163WC2C is optimal for various applications where low-power is critical such as battery backup and hand-held devices. The device can operate over a very wide temperature range of -40oC to +85oC and is available in JEDEC standard packages compatible with other standard 1024Kb x 16 SRAMs Features • Single Wide Power Supply Range 2.2 to 3.6 Volts • Very low standby current 2.5µA at 3.0V (Typical) • Very low operating current 2.0mA at 3.0V and 1µs(Typical) • Simple memory control Dual Chip Enables (CE1 and CE2) Byte control for independent byte operation Output Enable (OE) for memory expansion • Low voltage data retention Vcc = 1.5V • Very fast output enable access time 25ns OE access time • Automatic power down to standby mode • TTL compatible three-state output driver • Ultra Low Power Sort Available Product Family Part Number Package Type Operating Temperature Power Speed Supply (Vcc) Standby Current Operating Current (ISB), (Icc), Typical Typical 2.5 µA 2 mA @ 1MHz N16L163WC2CT1 N16L163WC2CZ1 48 TSOP I Pb-Free VFBGA Pb-Free -40oC to +85oC 2.2V - 3.6V 55ns Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 1 N16L163WC2C NanoAmp Solutions, Inc. Pin Configuration 1 A B C D E F G H LB I/O8 I/O9 VSS VCC Advance Information 2 OE UB I/O10 I/O11 3 A0 A3 A5 A17 4 A1 A4 A6 A7 A16 A15 A13 A10 5 A2 CE1 I/O1 I/O3 I/O4 I/O5 WE A11 6 CE2 I/O0 I/O2 VCC VSS I/O6 I/O7 DNU I/O12 DNU A14 A12 A9 I/O14 I/O13 I/O15 A18 A19 A8 48 Pin VFBGA (top) 8 x 10 mm A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE2 DNU UB LB A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48-Pin TSOP-I 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 Vcc* Vss I/O15 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 Vcc I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE Vss CE1 A0 Note: Pin#47 on the TSOP-I Package must be tied to Vcc. Pin Descriptions Pin Name A0-A19 WE CE1, CE2 OE LB UB I/O0-I/O15 VCC VSS NC DNU Pin Function Address Inputs Write Enable Input Chip Enable Input Output Enable Input Lower Byte Enable Input Upper Byte Enable Input Data Inputs/Outputs Power Ground Not Connected Do Not Use Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 2 N16L163WC2C NanoAmp Solutions, Inc. Functional Block Diagram Address Inputs A0 - A3 Word Address Decode Logic Advance Information Address Inputs A4 - A19 Page Address Decode Logic 1024K x 16 bit RAM Array Input/ Output Mux and Buffers Word Mux I/O0 - I/O7 I/O8 - I/O15 CE1 CE2 WE OE UB LB Control Logic Functional Description CE1 H X X L L L CE2 X L X H H H WE X X X L H H OE X X X X3 L H UB X X H L1 L1 L1 LB X X H L1 L1 L1 I/O0 - I/O151 High Z High Z High Z Data In Data Out High Z MODE Standby2 Standby2 Standby2 Write3 Read Active POWER Standby Standby Standby Active Active Active 1. When UB and LB are in select mode (low), I/O0 - I/O15 are affected as shown. When LB only is in the select mode only I/O0 - I/O7 are affected as shown. When UB is in the select mode only I/O8 - I/O15 are affected as shown. 2. When the device is in standby mode, control inputs (WE, OE, UB, and LB), address inputs and data input/outputs are internally isolated from any external influence and disabled from exerting any influence externally. 3. When WE is invoked, the OE input is internally disabled and has no effect on the circuit. Capacitance1 Item Input Capacitance I/O Capacitance Symbol CIN CI/O Test Condition VIN = 0V, f = 1 MHz, TA = 25oC VIN = 0V, f = 1 MHz, TA = 25oC Min Max 8 10 Unit pF pF 1. These parameters are verified in device characterization and are not 100% tested Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 3 N16L163WC2C NanoAmp Solutions, Inc. Absolute Maximum Ratings Item Voltage on any pin relative to VSS Voltage on VCC Supply Relative to VSS Power Dissipation Storage Temperature Operating Temperature Soldering Temperature and Time Symbol VIN,OUT VCC PD TSTG TA TSOLDER Rating –0.3 to VCC+0.3 –0.3 to 4.5 500 –65 to 150 -40 to +85 260oC, 10sec Unit V V mW oC oC o Advance Information C Stresses greater than those listed above may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Operating Characteristics (Over Specified Temperature Range) Item Supply Voltage Data Retention Voltage Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Input Leakage Current Output Leakage Current Read/Write Operating Supply Current @ 1 µs Cycle Time2 Read/Write Operating Supply Current @ fmax Maximum Standby Current Symbol VCC VDR VIH VIL VOH VOL ILI ILO ICC1 ICC2 Chip Disabled Vcc = 2.2V to 2.7V Vcc = 2.7V to 3.6V Vcc = 2.2V to 2.7V Vcc = 2.7V to 3.6V IOH = -0.1mA, Vcc = 2.2V IOH = -1.0mA, Vcc = 2.7V IOL = 0.1mA, Vcc = 2.2V IOL = 0.1mA, Vcc = 2.7V VIN = 0 to VCC OE = VIH or Chip Disabled VCC=3.6 V, VIN=VIH or VIL Chip Enabled, IOUT = 0 VCC=3.6 V, VIN=VIH or VIL Chip Enabled, IOUT = 0 VIN = VCC or 0V Chip Disabled tA= 85oC, VCC = 3.6 V Vcc = 1.5V, VIN = VCC or 0 Chip Disabled, tA= 85 C o Test Conditions Min. 2.2 1.5 1.8 2.2 -0.3 -0.3 2.0 2.4 Typ1 3.0 Max 3.6 VCC+0.3 VCC+0.3 0.6 0.8 Unit V V V V V 0.4 0.4 -1 -1 2 -L -L 2 15 15 2.5 -L 2.5 1 1 4.0 4.0 30 30 30 22 15 -L 10 V µA µA mA mA µA ISB1 Maximum Data Retention Current IDR µA 1. Typical values are measured at Vcc=Vcc Typ., TA=25°C and not 100% tested. 2. This parameter is specified with the outputs disabled to avoid external loading effects. The user must add current required to drive output capacitance expected in the actual system. Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 4 N16L163WC2C NanoAmp Solutions, Inc. Timing Test Conditions Item Input Pulse Level Input Rise and Fall Time Input and Output Timing Reference Levels Output Load Operating Temperature 0.1VCC to 0.9 VCC 1V/ns 0.5 VCC CL = 50pF -40 to +85 oC Advance Information Timing Item Read Cycle Time Address Access Time (Random Access) Chip Enable to Valid Output Output Enable to Valid Output Byte Select to Valid Output Chip Enable to Low-Z output Output Enable to Low-Z Output Byte Select to Low-Z Output Chip Disable to High-Z Output Output Disable to High-Z Output Byte Select Disable to High-Z Output Output Hold from Address Change Write Cycle Time Chip Enable to End of Write Address Valid to End of Write Byte Select to End of Write Write Pulse Width Address Setup Time Write Recovery Time Write to High-Z Output Data to Write Time Overlap Data Hold from Write Time End Write to Low-Z Output Note: 1. Full Device AC operation requires linear Vcc ramp from 0 to Vcc(min) ≥ 500us. 2. Full Device operation requires linear Vcc ramp from VDR to Vcc(min) ≥ 100 us or stable at Vcc(min) ≥ 100us. 3. Address valid prior to or coincident with CE1, LB, UB transition LOW and CE2 transition HIGH. Symbol tRC tAA tCO tOE tLB, tUB tLZ tOLZ tLBZ, tUBZ tHZ tOHZ tLBHZ, tUBHZ tOH tWC tCW tAW tLBW, tUBW tWP tAS tWR tWHZ tDW tDH tOW 55 Min 55 55 55 25 55 10 5 10 20 20 20 10 55 40 40 40 40 0 0 20 25 0 10 Max Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 5 N16L163WC2C NanoAmp Solutions, Inc. Timing of Read Cycle (CE1 = OE = VIL, WE = CE2 = VIH) tRC Address tAA, tOH Advance Information Data Out Previous Data Valid Data Valid Timing Waveform of Read Cycle (WE=VIH) tRC Address tAA, tHZ CE1 tCO CE2 tLZ tOE OE tOLZ tLB, tUB LB, UB tLBLZ, tUBLZ Data Out High-Z tLBHZ, tUBHZ Data Valid tOHZ Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 6 N16L163WC2C NanoAmp Solutions, Inc. Timing Waveform of Write Cycle (WE control) tWC Address tAW CE1 tCW CE2 tLBW, tUBW LB, UB tAS WE tDW High-Z Data In tWHZ Data Out High-Z tDH tWP tWR Advance Information Data Valid tOW Timing Waveform of Write Cycle (CE1 Control) tWC Address tAW CE1 (for CE2 Control, use inverted signal) LB, UB tWP WE tDW Data In tLZ Data Out tWHZ tDH tCW tAS tLBW, tUBW tWR Data Valid High-Z Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 7 N16L163WC2C NanoAmp Solutions, Inc. Data Retention Characteristics Parameter VDR ICCDR tCDR tR Description Vcc for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time Vcc = 1.5V, CE ≥ Vcc - 0.2V, VIN ≥ Vcc - 0.2V or VIN ≤ 0.2V -L 0 tRC Condition Min 1.5 15 10 Typ Max Unit V µA ns ns Advance Information Data Retention Waveform Data Retention Mode Vcc Vcc(min) tCDR CE1 or LB/UB or CE2 VDR ≥ 1.5V Vcc(min) tR Note: Full device operation requires linear Vcc ramp from VDR to Vcc(min) > 100 µs Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 8 N16L163WC2C NanoAmp Solutions, Inc. 48 TSOP-I Package (Z48A) 20.0mm 18.4mm Advance Information 12.0mm 0.50mm REF 0.27 0.17 SEE DETAIL B DETAIL B 1.20mm 0.95mm 1.05mm 0o-5o 0.05 0.15 0.50 0.70 mm REF Note: 1. All dimensions in millimeters. Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 9 N16L163WC2C NanoAmp Solutions, Inc. VFBGA Package A1 BALL PAD CORNER (3) D 0.23±0.05 1.00 MAX 1. 0.30±0.05 DIA. E 2. SEATING PLANE - Z 0.15 Z 0.05 TOP VIEW SIDE VIEW 1. DIMENSION IS MEASURED AT THE A1 BALL PAD MAXIMUM SOLDER BALL DIAMETER. CORNER PARALLEL TO PRIMARY Z. 2. PRIMARY DATUM Z AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 3. A1 BALL PAD CORNER I.D. TO BE MARKED BY INK. K TYP J TYP e Z Advance Information SD e SE BOTTOM VIEW Dimensions (mm) e = 0.75 D 8±0.10 E SD 10±0.10 0.375 SE 0.375 J 2.125 K 2.375 BALL MATRIX TYPE FULL Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 10 N16L163WC2C NanoAmp Solutions, Inc. Ordering Information Advance Information N16L163WC2CX-XX X L L = Ultra Low Power Sort Temperature I = Industrial, -40°C to 85°C 55 = 55ns Performance Package Type Z1 = 48-ball VFBGA Pb-Free Package T1 = 48-Pin TSOP-I Pb-Free Package Revision History Revision A B C Date Oct 6. 2004 Nov 10. 2004 Jan 14. 2005 Change Description Initial Advance Release General Update General Update © 2001 - 2002 Nanoamp Solutions, Inc. All rights reserved. NanoAmp Solutions, Inc. ("NanoAmp") reserves the right to change or modify the information contained in this data sheet and the products described therein, without prior notice. NanoAmp does not convey any license under its patent rights nor the rights of others. Charts, drawings and schedules contained in this data sheet are provided for illustration purposes only and they vary depending upon specific applications. NanoAmp makes no warranty or guarantee regarding suitability of these products for any particular purpose, nor does NanoAmp assume any liability arising out of the application or use of any product or circuit described herein. NanoAmp does not authorize use of its products as critical components in any application in which the failure of the NanoAmp product may be expected to result in significant injury or death, including life support systems and critical medical instruments. Stock No. 23383-C The specifications of this device are subject to change without notice. For latest documentation see http://www.nanoamp.com. 11