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PS7214-1A-A

PS7214-1A-A

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    PS7214-1A-A - 4-PIN SOP, 1.0 Ω LOW ON-STATE RESISTANCE 1-ch Optical Coupled MOS FET - NEC

  • 数据手册
  • 价格&库存
PS7214-1A-A 数据手册
DATA SHEET Solid State Relay OCMOS FET PS7214-1A 4-PIN SOP, 1.0 Ω LOW ON-STATE RESISTANCE −NEPOC 1-ch Optical Coupled MOS FET Series− DESCRIPTION The PS7214-1A is a low on-state resistance solid state relay containing a GaAs LED on the input side and MOS FETs on the output side. It is suitable for PLC, etc. because of its large continuous load current and low on-state resistance. FEATURES • Low on-state resistance (Ron = 1.0 Ω TYP.) • Large continuous load current (IL = 400 mA) • 1 channel type (1 a output) • Designed for AC/DC switching line changer • Small and thin package (4-pin SOP, Height = 2.1 mm) • High isolation voltage (BV = 1 500 Vr.m.s.) • Low offset voltage • Ordering number of taping product : PS7214-1A-E3, E4: 900 pcs/reel : PS7214-1A-F3, F4: 3 500 pcs/reel • Pb-Free product • Safety standards • UL approved: File No. E72422 • BSI approved: No. 8241/8242 APPLICATIONS • Measurement equipment • FA equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10298EJ02V0DS (2nd edition) Date Published August 2006 NS CP(K) Printed in Japan The mark shows major revised points. 1999, 2006 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. PS7214-1A PACKAGE DIMENSIONS (Unit: mm) 4.0±0.5 TOP VIEW 4 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 1 2 7.0±0.3 4.4 2.05+0.08 –0.05 0.15+0.10 –0.05 0.05+0.08 –0.05 2.54 0.40+0.10 –0.05 0.25 M 0.5±0.3 MARKING EXAMPLE (LASER MARKING) 14-A N601 No.1 pin Mark N 6 01 Type Number Assembly Lot *1 Week Assembled Year Assembled (Last 1 Digit) Rank Code *1 Bar : Pb-Free Remark Applicable type numbers are underlined below PS7214-1A 2 Data Sheet PN10298EJ02V0DS PS7214-1A ORDERING INFORMATION Part Number Order Number Solder Plating Specification PS7214-1A PS7214-1A-E3 PS7214-1A-E4 PS7214-1A-F3 PS7214-1A-F4 PS7214-1A-A PS7214-1A-E3-A PS7214-1A-E4-A PS7214-1A-F3-A PS7214-1A-F4-A Embossed Tape 3 500 pcs/reel Pb-Free Magazine case 100 pcs Embossed Tape 900 pcs/reel Packing Style Safety Standard Approval Standard products (UL, BSI approved) Application Part Number *1 PS7214-1A *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current Pulse Load Current *2 *1 Symbol IF VR PD IFP VL IL ILP Ratings 50 5.0 50 1 100 400 0.8 Unit mA V mW A V mA A (AC/DC Connection) Power Dissipation Isolation Voltage *3 PD BV PT TA Tstg 300 1 500 350 −40 to +85 −40 to +100 mW Vr.m.s. mW °C °C Total Power Dissipation Operating Ambient Temperature Storage Temperature *1 PW = 100 µs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. Data Sheet PN10298EJ02V0DS 3 PS7214-1A RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 Unit mA V ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED On-state Current On-state Resistance Turn-on Time Turn-off Time *1, 2 *1, 2 Symbol VF IR ILoff Cout IFon Ron ton toff RI-O CI-O IF = 10 mA VR = 5 V VD = 100 V Conditions MIN. TYP. 1.2 MAX. 1.4 5.0 1.0 Unit V µA µA pF VD = 0 V, f = 1 MHz IL = 400 mA IF = 10 mA, IL = 400 mA, t ≤ 10 ms IF = 10 mA, VO = 5 V, RL = 500 Ω, PW ≥ 10 ms VI-O = 1.0 kVDC V = 0 V, f = 1 MHz 10 9 120 2.0 1.0 1.3 0.1 1.2 2.0 1.0 mA Ω ms Isolation Resistance Isolation Capacitance Ω 0.5 pF *1 Test Circuit for Switching Time IF Pulse Input VL Input 50 % 0 VO = 5 V Input monitor Rin RL VO monitor Output 90 % 10 % ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. 4 Data Sheet PN10298EJ02V0DS PS7214-1A TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 100 Maximum Forward Current IF (mA) Maximum Load Current IL (mA) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 600 80 400 60 40 200 20 0 –25 0 25 50 75 85 100 0 –25 0 25 50 75 85 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE 1.8 Output Capacitance Cout (pF) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 200 f = 1 MHz Forward Voltage VF (V) 1.6 1.4 IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA 150 100 1.2 1.0 50 0.8 –25 0 25 50 75 100 0 10 20 30 40 50 60 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE 10–6 Off-state Leakage Current ILoff (A) LOAD CURRENT vs. LOAD VOLTAGE 600 IF = 10 mA, IL = 400 mA Load Current IL (mA) VD = 100 V 10–7 10–8 400 200 10–9 –10 –0.8 –0.4 0 –200 –400 –600 0.4 0.8 10 10–11 0 20 40 60 80 Ambient Temperature TA (˚C) Load Voltage VL (V) Remark The graphs indicate nominal characteristics. Data Sheet PN10298EJ02V0DS 5 PS7214-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE 3.0 Normalized On-state Resistance Ron ON-STATE RESISTANCE DISTRIBUTION 30 n = 50 pcs, IF = 10 mA, IL = 400 mA, t 10 ms 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, IL = 400 mA Number (pcs) 25 20 15 10 5 0 0 25 50 75 100 0.8 1.0 1.2 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT 6.0 5.0 Turn-on Time ton (ms) TURN-OFF TIME vs. FORWARD CURRENT 0.30 VO = 5 V, RL = 500 Ω VO = 5 V, RL = 500 Ω Turn-off Time toff (ms) 0.25 0.20 0.15 0.10 0.05 4.0 3.0 2.0 1.0 0 5 10 15 20 25 30 0 5 10 15 20 25 30 Forward Current IF (mA) Forward Current IF (mA) TURN-ON TIME DISTRIBUTION 30 25 Number (pcs) TURN-OFF TIME DISTRIBUTION 30 25 Number (pcs) n = 50 pcs, IF = 10 mA, VO = 5 V, RL = 500 Ω n = 50 pcs, IF = 10 mA, VO = 5 V, RL = 500 Ω 20 15 10 5 0 20 15 10 5 0 1.3 1.5 0.08 0.12 Turn-on Time ton (ms) Turn-off Time toff (ms) Remark The graphs indicate nominal characteristics. 6 Data Sheet PN10298EJ02V0DS PS7214-1A NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE 3.0 Normalized Turn-on Time ton Normalized Turn-off Time toff 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V, RL = 500 Ω 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V, RL = 500 Ω 0 25 50 75 100 0 25 50 75 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet PN10298EJ02V0DS 7 PS7214-1A TAPING SPECIFICATIONS (in millimeters) Outline and Dimensions (Tape) 2.0±0.05 4.0±0.1 1.75±0.1 1.5+0.1 –0 2.9 MAX. 5.5±0.05 12.0±0.2 1.55±0.1 8.0±0.1 7.4±0.1 4.6±0.1 2.4±0.1 0.3 Tape Direction PS7214-1A-E3 PS7214-1A-E4 Outline and Dimensions (Reel) 2.0±0.5 2.0±0.5 φ13.0±0.2 φ 180+0 –1.5 φ 21.0±0.8 R 1.0 φ 60 +1 –0 13.5±1.0 17.5±1.0 Packing: 900 pcs/reel 11.9 to 15.4 Outer edge of flange 8 Data Sheet PN10298EJ02V0DS PS7214-1A Outline and Dimensions (Tape) 2.0±0.05 4.0±0.1 1.75±0.1 1.5+0.1 –0 2.9 MAX. 5.5±0.05 12.0±0.2 1.55±0.1 8.0±0.1 7.4±0.1 4.6±0.1 2.4±0.1 0.3 Tape Direction PS7214-1A-F3 PS7214-1A-F4 Outline and Dimensions (Reel) 2.0±0.5 φ 330±2.0 2.0±0.5 φ13.0±0.2 φ 100±1.0 R 1.0 φ 21.0±0.8 φ 13.0±0.2 13.5±1.0 17.5±1.0 Packing: 3 500 pcs/reel 11.9 to 15.4 Outer edge of flange Data Sheet PN10298EJ02V0DS 9 PS7214-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220°C • Time to preheat temperature from 120 to 180°C • Number of reflows • Flux 260°C or below (package surface temperature) 10 seconds or less 60 seconds or less 120±30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (˚C) (heating) to 10 s 260˚C MAX. 220˚C to 60 s 180˚C 120˚C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature • Time • Preheating conditions • Number of times • Flux 260°C or below (molten solder temperature) 10 seconds or less 120°C or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) • Time (each pins) • Flux 350°C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet PN10298EJ02V0DS PS7214-1A USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Data Sheet PN10298EJ02V0DS 11 PS7214-1A • T he information in this document is current as of August, 2006. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PN10298EJ02V0DS PS7214-1A Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604
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