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PS9302L-V-E3

PS9302L-V-E3

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    PS9302L-V-E3 - 2.5 A OUTPUT CURRENT, HIGH CMR IGBT GATE DRIVE 8-PIN SDIP PHOTOCOUPLER - NEC

  • 数据手册
  • 价格&库存
PS9302L-V-E3 数据手册
DATA SHEET PHOTOCOUPLER PS9302L 2.5 A OUTPUT CURRENT, HIGH CMR IGBT GATE DRIVE 8-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9302L is an optically coupled isolator containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9302L is designed specifically for high common mode transient immunity (CMR), high output current and high switching speed. −NEPOC Series− FEATURES • Large peak output current (2.5 A MAX., 2.0 A MIN.) • High speed switching (tPLH, tPHL = 0.5 μs MAX.) • Long creepage distance (8 mm MIN.) • UVLO (Under Voltage Lock Out) protection with hysteresis • High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.) • Pb-Free product • Safety standards • UL approved: No. E72422 • CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) • DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40019182 (Option) 1 2 3 4 SHIELD PIN CONNECTION (Top View) 8 7 6 5 • Ordering number of tape product: PS9302L-E3: 2 000 pcs/reel 1. Anode 2. Cathode 3. Cathode 4. NC 5. VEE 6. VEE 7. VO 8. VCC APPLICATIONS • IGBT, Power MOS FET Gate Driver • Industrial inverter • IH (Induction Heating) The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PN10744EJ02V0DS (2nd edition) Date Published August 2009 NS Printed in Japan The mark shows major revised points. 2009 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. PS9302L PACKAGE DIMENSIONS (UNIT: mm) 5.85±0.25 8 5 9.7±0.3 1 (0.82) 4 (7.62) 6.8±0.25 3.7±0.25 3.5±0.2 1.27 0.84±0.25 0.4±0.1 0.25 M 2 Data Sheet PN10744EJ02V0DS 0.25±0.15 0.2±0.15 PS9302L FUNCTIONAL DIAGRAM 1 (Tr. 1) 8 2 7 3 (Tr. 2) 6 5 SHIELD Input H L LED ON OFF Tr. 1 ON OFF Tr. 2 OFF ON Output H L MARKING EXAMPLE No. 1 pin Mark 9302 N931 Type Number Assembly Lot N 9 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) PS9302L 7 mm 8 mm 0.4 mm Data Sheet PN10744EJ02V0DS 3 PS9302L ORDERING INFORMATION Part Number Order Number Solder Plating Specification PS9302L PS9302L-E3 PS9302L-V PS9302L-V-E3 PS9302L-AX PS9302L-E3-AX PS9302L-V-AX PS9302L-V-E3-AX Pb-Free (Ni/Pd/Au) 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Packing Style Safety Standard Approval Standard products (UL, CSA approved) DIN EN60747-5-2 (VDE0884 Part2) Approved (Option) Application Part Number PS9302L *1 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Diode Forward Current Peak Transient Forward Current (Pulse Width < 1 μs) Reverse Voltage Power Dissipation Detector *1 Symbol IF IF (TRAN) Ratings 25 1.0 Unit mA A VR PD IOH (PEAK) 5 45 2.5 V mW A High Level Peak Output Current *2 Low Level Peak Output Current *2 IOL (PEAK) 2.5 A Supply Voltage Output Voltage Power Dissipation Isolation Voltage *4 *3 (VCC - VEE) VO PC BV 0 to 35 0 to VCC 250 5 000 50 −40 to +100 −55 to +125 V V mW Vr.m.s. kHz °C °C Operating Frequency *5 f TA Tstg Operating Ambient Temperature Storage Temperature *1 Reduced to 1.6 mW/°C at TA = 85°C or more. *2 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% *3 Reduced to 6.0 mW/°C at TA = 80°C or more. *4 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output. Pins 1-4 shorted together, 5-8 shorted together. *5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs) 4 Data Sheet PN10744EJ02V0DS PS9302L RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Forward Voltage (OFF) Operating Ambient Temperature Symbol (VCC - VEE) IF (ON) VF (OFF) TA MIN. 15 7 −2 −40 10 TYP. MAX. 30 16 0.8 100 Unit V mA V °C ELECTRICAL CHARACTERISTICS (TA = −40 to +100°C, VCC = 15 to 30 V, IF (ON) = 7 to 16 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Detector High Level Output Current Symbol VF IR Ct IOH Conditions IF = 10 mA, TA = 25°C VR = 3 V, TA = 25°C f = 1 MHz, VF = 0 V, TA = 25°C VO = (VCC − 4 V) *2 MIN. 1.2 TYP. *1 MAX. 1.9 10 Unit V 1.56 μA pF A 30 0.5 2.0 VO = (VCC − 15 V) Low Level Output Current IOL *3 2.0 0.5 2.0 VCC − 3.5 VCC − 2.5 0.1 2.0 2.0 11.0 9.5 12.0 11.0 1.0 2.0 5.0 VCC − 1.5 0.5 3.5 3.0 13.5 12.0 V mA V V mA mA V 2.0 A VO = (VEE + 2.5 V) VO = (VEE + 15 V) *2 *3 High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current UVLO Threshold VOH VOL ICCH ICCL VUVLO+ VUVLO− IO = −100 mA IO = 100 mA *4 VO = open, IF = 10 mA VO = open, VF = 0 to +0.8 V VO > 5 V, IF = 10 mA UVLO Hysteresis Coupled Threshold Input Current (L → H) Threshold Input Voltage (H → L) UVLOHYS VO > 5 V, IF = 10 mA IFLH IO = 0 mA, VO > 5 V VFHL IO = 0 mA, VO < 5 V 0.8 V *1 Typical values at TA = 25°C. *2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%. *3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2% *4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle = 20%). Data Sheet PN10744EJ02V0DS 5 PS9302L SWITCHING CHARACTERISTICS (TA = −40 to +100°C, VCC = 15 to 30 V, IF (ON) = 7 to 16 mA, VF (OFF) = −2 to 0.8 V, VEE = GND, unless otherwise specified) Parameter Propagation Delay Time (L → H) Propagation Delay Time (H → L) Pulse Width Distortion (PWD) Propagation Delay Time (Difference Between Any Two Products) Rise Time Fall Time UVLO (Turn On Delay) UVLO (Turn Off Delay) Common Mode Transient Immunity at High Level Output *3 Symbol tPLH tPHL |tPHL−tPLH| tPHL−tPLH Conditions Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty Cycle = 50% , IF = 10 mA *2 MIN. 0.1 0.1 TYP. 0.3 0.3 *1 MAX. 0.5 0.5 0.3 Unit μs μs μs μs μs μs μs μs kV/μs kV/μs −0.35 0.35 tr tf tUVLO ON VO > 5 V, IF = 10 mA 0.1 0.1 0.8 0.6 25 tUVLO OFF VO < 5 V, IF = 10 mA |CMH| TA = 25°C, IF = 10 mA, VCC = 30 V, VO (MIN.) = 26 V, VCM = 1.5k V |CML| TA = 25°C, IF = 0 mA, VCC = 30 V, VO (MAX.) = 1 V, VCM = 1.5k V 25 Common Mode Transient Immunity at Low Level Output *3 *1 Typical values at TA = 25°C. *2 This load condition is equivalent to the IGBT load at 1 200 V/75 A. *3 Connect pin 4 to the LED common. 6 Data Sheet PN10744EJ02V0DS PS9302L TEST CIRCUIT Fig. 1 IOH Test Circuit Fig. 2 IOL Test Circuit 1 2 IF = 7 to 16 mA 4 SHIELD 8 7 6 0.1 μF IOH 5 VCC = 15 to 30 V 4V 1 2 3 4 SHIELD 8 7 6 5 0.1 μF IOL VCC = 15 to 30 V 2.5 V 3 Fig. 3 VOH Test Circuit Fig. 4 VOL Test Circuit 1 2 3 IF = 7 to 16 mA 4 SHIELD 8 7 6 5 0.1 μF VOH VCC = 100 mA 15 to 30 V 1 2 3 4 SHIELD 8 7 6 5 0.1 μF 100 mA VOL VCC = 15 to 30 V Fig. 5 IFLH Test Circuit Fig. 6 UVLO Test Circuit 1 IF 2 3 4 SHIELD 8 7 6 0.1 μF 5 VO > 5 V VCC = 15 to 30 V IF = 10 mA 1 2 3 4 SHIELD 8 7 6 5 VO > 5 V 0.1 μF VCC Data Sheet PN10744EJ02V0DS 7 PS9302L Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms IF = 7 to 16 mA 1 8 7 6 0.1 μF 5 SHIELD 500 Ω 2 3 10 kHz 50% DUTY CYCLE 4 IF VO 10 Ω 10 nF VCC = 15 to 30 V tr tf 90% 50% 10% VOUT tPLH tPHL Fig. 8 CMR Test Circuit and Wave Forms IF 1 A B 2 3 4 SHIELD 8 7 6 5 VO 0.1 μF VCC = 30 V VCM VCM δV = Δt δt 0V VO (Switch A: IF = 10 mA) VO (Switch B: IF = 0 mA) Δt VOH 26 V 1V VOL VCM = 1.5 kV 8 Data Sheet PN10744EJ02V0DS PS9302L TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE 60 300 DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE Detector Power Dissipation PC (mW) Diode Power Dissipation PD (mW) 50 40 30 20 10 250 200 150 100 50 0 20 40 60 80 100 120 0 20 40 60 80 100 120 Ambient Temperature TA (°C) Ambient Temperature TA (°C) FORWARD CURRENT vs. FORWARD VOLTAGE 100 3.0 THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Threshold Input Current IFLH (mA) VCC = 30 V, VEE = GND, VO > 5 V 2.5 Forward Current IF (mA) 10 TA = +100°C +85°C +50°C +25°C 0°C –40°C 1.0 2.0 0.1 1.5 0.01 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1.0 –40 –20 0 20 40 60 80 100 Forward Voltage VF (V) Ambient Temperature TA (°C) OUTPUT VOLTAGE vs. FORWARD CURRENT 35 30 HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT –1 High Level Output Voltage – Supply Voltage VOH – VCC (V) Output Voltage VO (V) –2 VCC = 30 V, VEE = GND, IF = 10 mA 25 20 15 10 5 0 1 2 3 4 5 –3 –4 –5 –6 0 0.5 1 1.5 2 2.5 Forward Current IF (mA) High Level Output Current IOH (A) Remark The graphs indicate nominal characteristics. Data Sheet PN10744EJ02V0DS 9 PS9302L PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 5 Low Level Output Voltage VOL (V) 4 VCC = 30 V, VEE = GND, IF = 0 mA 500 400 VCC = 30 V, VEE = GND, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPLH 3 2 TA = +100°C +25°C –40°C 300 tPHL 200 1 100 PWD 0 7 8 9 10 11 12 13 14 15 16 17 18 Forward Current IF (mA) 0 0.5 1 1.5 2 2.5 Low Level Output Current IOL (A) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE 500 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPLH 300 tPHL 200 500 400 VEE = GND, IF = 10 mA, Rg = 10 Ω, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPLH tPHL 400 300 200 100 PWD 0 15 20 25 30 100 PWD 0 –40 –20 0 20 40 60 80 100 Supply Voltage VCC (V) Ambient Temperature TA (°C) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE 500 High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) SUPPLY CURRENT vs. AMBIENT TEMPERATURE 3.5 VCC = 30 V, VEE = GND, VO = OPEN ICCH (IF = 10 mA) 2.5 400 VCC = 30 V, VEE = GND, IF = 10 mA, Rg = 10 Ω, f = 10 kHz, Duty cycle = 50% tPLH tPHL 3 300 200 2 ICCL (IF = 0 mA) 1.5 100 PWD 0 20 40 60 80 100 120 1 –40 –20 0 20 40 60 80 100 Load Capacitance Cg (nF) Ambient Temperature TA (°C) Remark The graphs indicate nominal characteristics. 10 Data Sheet PN10744EJ02V0DS PS9302L SUPPLY CURRENT vs. AMBIENT TEMPERATURE 3.5 High Level Supply Current ICCH (mA), Low Level Supply Current ICCL (mA) High Level Output Voltage – Supply Voltage VOH – VCC (V) HIGH LEVEL OUTPUT VOLTAGE – SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE 0 VCC = 30 V, VEE = GND, IF = 10 mA, IO = –100 mA VEE = GND, VO = OPEN 3 –1 2.5 ICCH (IF = 10 mA) 2 ICCL (IF = 0 mA) 1.5 –2 –3 1 15 20 25 30 –4 –40 –20 0 20 40 60 80 100 Supply Voltage VCC (V) Ambient Temperature TA (°C) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE 0.25 Low Level Output Voltage VOL (V) High Level Output Current IOH (A) HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 3 VCC = 30 V, VEE = GND, IF = 10 mA, VO = 26 V VCC = 30 V, VEE = GND, IF = 0 mA, IO = 100 mA 0.2 2.5 0.15 2 0.1 1.5 0.05 0 –40 –20 0 20 40 60 80 100 1 –40 –20 0 20 40 60 80 100 Ambient Temperature TA (°C) Ambient Temperature TA (°C) LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 4 Low Level Output Current IOL (A) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion (PWD) tPHL – tPLH (ns) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD RESISTANCE 500 VCC = 30 V, VEE = GND, IF = 10 mA, Cg = 10 nF, f = 10 kHz, Duty cycle = 50% tPLH 300 tPHL 200 VCC = 30 V, VEE = GND, IF = 0 mA, VO = 2.5 V 400 3 2 100 PWD 0 0 10 20 30 40 50 60 1 –40 –20 0 20 40 60 80 100 Ambient Temperature TA (°C) Load Resistance Rg (Ω) Remark The graphs indicate nominal characteristics. Data Sheet PN10744EJ02V0DS 11 PS9302L OUTPUT VOLTAGE vs. SUPPLY VOLTAGE 14 12 Output Voltage VO (V) 10 8 UVLOHYS 6 4 2 0 5 VUVLO– (11.0 V) VUVLO+ (12.0 V) 10 15 20 Supply Voltage VCC – VEE (V) Remark The graph indicates nominal characteristics. 12 Data Sheet PN10744EJ02V0DS PS9302L TAPING SPECIFICATIONS (UNIT: mm) Outline and Dimensions (Tape) 2.0±0.1 4.0±0.1 1.5 +0.1 –0 1.75±0.1 4.5 MAX. 7.5±0.1 1.5 +0.1 –0 8.0±0.1 6.35±0.1 16.0±0.3 10.2±0.1 0.35 Tape Direction PS9302L-E3 Outline and Dimensions (Reel) 4.05±0.1 2.0±0.5 330±2.0 2.0±0.5 13.0±0.2 R 1.0 21.0±0.8 17.5±1.0 21.5±1.0 100±1.0 Packing: 2 000 pcs/reel 15.9 to 19.4 Outer edge of flange Data Sheet PN10744EJ02V0DS 13 PS9302L RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) D A Part Number PS9302L Lead Bending lead bending type (Gull-wing) for surface mount A 8.2 B 1.27 B C 0.8 C D 2.2 14 Data Sheet PN10744EJ02V0DS PS9302L NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature • Time of peak reflow temperature • Time of temperature higher than 220°C • Time to preheat temperature from 120 to 180°C • Number of reflows • Flux 260°C or below (package surface temperature) 10 seconds or less 60 seconds or less 120±30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (°C) (heating) to 10 s 260°C MAX. 220°C to 60 s 180°C 120°C 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature • Time • Preheating conditions • Number of times • Flux 260°C or below (molten solder temperature) 10 seconds or less 120°C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by soldering iron • Peak temperature (lead part temperature) • Time (each pins) • Flux 350°C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead. (b) Please be sure that the temperature of the package would not be heated over 100°C. Data Sheet PN10744EJ02V0DS 15 PS9302L (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) In older to avoid malfunctions and characteristics degradation, IGBT collector or emitter traces should not be closed to the LED input. (3) Pin 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. *1 NC: Non-Connection (No Connection) 3. Make sure the rise/fall time of the forward current is 0.5 μs or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less. 5. Avoid storage at a high temperature and high humidity. 16 Data Sheet PN10744EJ02V0DS PS9302L SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.5 × UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 × UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) Material group (DIN EN 60664-1 VDE0110 Part 1) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25°C VIO = 500 V dc at TA MAX. at least 100°C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi Ris MIN. 10 9 Symbol Spec. 55/100/21 Unit UIORM Upr 1 130 1 695 Vpeak Vpeak Upr 2 119 Vpeak UTR 8 000 2 Vpeak CTI 175 III a Tstg TA –55 to +125 –40 to +100 °C °C Ω Ω Ris MIN. Ris MIN. 10 10 12 11 Tsi Isi Psi 175 400 700 °C mA mW Ω Data Sheet PN10744EJ02V0DS 17 PS9302L • T he information in this document is current as of August, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E 18 Data Sheet PN10744EJ02V0DS PS9302L This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. Caution GaAs Products
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