UPC8001GR

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8001 IF AMPLIFIER IC WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES The µPC8001 is a 3-volt IF amplifier IC with an on-chip mixer developed for digital cellular phones. The µPC8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 kHz, a high-speed and high-precision linear RSSI (received signal strength indicator ), and a second mixer with an input frequency of 80 to 150 MHz. The µPC8001 features a low 3 mA (TYP.) and 2.2 µA (TYP.) current consumption at normal operation and power-OFF, respectively. Its high-speed charge/discharge circuit enables fast power-ON/OFF switching. The µPC8001 boasts an extremely small size packaged in a 14-pin plastic shrink SOP, and low external capacitances of less than 0.01 µF, in addition to an on-chip RSSI output resistor, and is most suitable for high-density mounting. FEATURES • Low-voltage operation…3 V ± 10% • Low power consumption…(VCC = 3 V) Mixer During operation At power-OFF 2.1 mA (TYP.) 0 µA (TYP.) IF amp. + RSSI 0.95 mA (TYP.) 2.2 µA (TYP.) • High limiting sensitivity…–91 dBm (TYP.) • High-precision RSSI linearity…± 0.5 dB (TYP.) (VIF IN = –86 to –6 dBm) • High-speed RSSI response time RSSI output rise time RSSI output fall time 77µs (TYP.) 113 µs (TYP.) • High-speed power-ON/OFF switching time Rise time at power-ON Fall time at power-OFF 174 µs (TYP.) 3 µs (TYP.) • External capacitors of less than 0.01 µF • On-chip RSSI output resistor (34 kΩ) • Ultra-compact package…14-pin plastic shrink SOP The information in this document is subject to change without notice. Document No. IC-3426 (O.D.No. IC-8949) Date Published February 1995 P Printed in Japan The mark 5 shows revised points. © © 1994, 1995 1992 µPC8001 ORDERING INFORMATION Part number Package 14-pin plastic shrink SOP (225 mil) 14-pin plastic shrink SOP (225 mil) µPC8001GR µPC8001GR-E1 Embossed carrier taping (Pin 1 located toward tape unwind direction) 14-pin plastic shrink SOP (225 mil) µPC8001GR-E2 Embossed carrier taping (Pin 1 located toward tape wind direction) 2 µPC8001 BLOCK DIAGRAM Antenna 1 st L-osc 1.5 GHz or 900 MHz RF Amp 1 st Mixer 130 MHz BPF 455 kHz BPF Note RM 1.4 kΩ 2 nd L-osc 129.545 MHz CIF CFL3 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 0.01 µ F 11 13 9 8 4 6 14 IF IN FIL3 FIL2 OSC IN MIX IN2 MIX IN1 MIX OUT COS CM2 CM1 CM0 CFL2 CFL1 0.01 µ F 7 FIL1 2 nd Mixer IF Amp 1 IF OUT RSSI RSSI OUT 3 CRS 1000 pF 12 VCC1 2 PD 5 10 VCC2 GND Note Input/output impedance of 455 kHz BPF: 1.5 k Ω 3 µPC8001 CONTENTS 1. PIN CONFIGURATION AND PIN FUNCTIONS ............................................................................... 5 2. I/O EQUIVALENT CIRCUIT ............................................................................................................... 7 3. ELECTRICAL SPECIFICATIONS ........................................................................................................ 8 4. CHARACTERISTIC CURVES ........................................................................................................... 14 5. TEST CIRCUIT EXAMPLE ............................................................................................................... 18 6. PACKAGE DRAWINGS .................................................................................................................... 19 7. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 20 4 µPC8001 1. (1) • PIN CONFIGURATION AND PIN FUNCTIONS PIN CONFIGURATION (Top View) 14-pin plastic shrink SOP (225 mil) IF OUT PD RSSI OUT FIL3 VCC2 IF IN FIL1 1 2 3 4 5 6 7 14 13 12 11 10 9 8 MIX IN1 MIX IN2 VCC1 OSC IN GND MIX OUT FIL2 µ PC8001GR FIL1-FIL3 GND IF IN IF OUT MIX OUT OSC IN PD RSSI OUT V CC1 , V CC2 : Filter : Ground : Intermediate Frequency Input : Intermediate Frequency Output : Mixer Output : Oscillator Input : Power Down : Received Signal Strength Indicator Output : Power Supply MIX IN1, MIX IN2 : Mixer Input 5 µPC8001 (2) PIN FUNCTIONS Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Pin Name IF OUT PD PSSI OUT FIL3 VCC2 IF IN FIL1 FIL2 MIX OUT GND OSC IN VCC1 MIX IN2 MIX IN1 I/O O I O — — I — — O — I — I I IF amplifier output Power-ON/OFF control signal input High level: Power-ON; Low level: Power-OFF RSSI output Connect capacitor for filter. IF amplifier and RSSI power pin IF amplifier input Connect capacitor for filter. Connect capacitor for filter. Mixer output Ground pin Oscillator input Mixer power pin Connect capacitor for filter. Mixer input Function 6 µPC8001 2. I/O EQUIVALENT CIRCUIT Mixer input 5 kΩ IF amplifier output 5 kΩ 75 µA 1 14 13 Oscillator input 5 kΩ RSSI output V CC2 34 kΩ 5 kΩ 3 500 Ω 11 IF amplifier input Power-ON/OFF input 300 kΩ 6 4 150 kΩ 2 8 50 kΩ 1.5 kΩ 7 Mixer output 9 400 µA 7 µPC8001 3. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25°C) Parameter Supply voltage Total power dissipation Operating ambient temperature Storage temperature Symbol VCC PT TA Tstg Conditions Rating 7 300 –30 to +85 –40 to +125 Unit V mW °C °C Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. Recommended Operating Conditions (TA = 25°C) Parameter Supply voltage Mixer input level IF amplifier input level Oscillator input level IF amplifier input frequency Mixer input frequency Mixer output frequency Symbol VCC VMIX IN VIF IN VOSC IN fIF IN fMIX IN fMIX OUT See Figure 3-1. 50 Ω termination LC matching Conditions MIN. 2.7 –100 –113Note2 –86 –30 400 80 400 –15 455 130 455 TYP. 3.0 MAX. 3.3 –20 Unit V dBmNote1 –33Note2 dBmNote1 –6 –5 500 150 500 dBmNote1 dBmNote1 kHz MHz kHz Notes 1. Assuming a conversion value of 50 Ω, 0 dBm = 0.2236 Vrms. 2. Depends on board wiring pattern, use as reference value. 8 µPC8001 ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC1 = VCC2 = 3 V, fMIX IN = 130 MHz, fOSC IN = 129.545 MHz, fIF IN = 455 kHz, CRS = 1000pF, COS = CM1 = CM2 = CM0 = CIF = CFL1 = CFL2 = CFL3 = 0.01µF, 0 dBm = 0.2236 Vrms) (1) Mixer Parameter Supply current Symbol ICC1 No signal VMIN IN = –50dBm Conversion gain CG VOSC IN = –15 dBm See Figure 3-1. Third order intercept –1dB compression output level Cut-off frequency Noise figure Local isolation Mixer input impedance Local input impedance Output resistance Power-ON rise time Note2 Conditions MIN. TYP. 2.1 MAX. 3.0 23 Unit mA 50Ω termination LC matching 15 33 –13 –5 200 20 Note 1 dB IC3 VOMIX fC NF ISL ZIM ZIL ROM tONM See Figure 3-2. VOSC IN=–15dBm See Figure 3-3. –3 dB point See Figure 3-6. –8 0 470 10 Note 1 dBm dBm MHz dB dB Ω Ω 180 600 Ω 20 26 48-j383 80-j425 60 VON = 3 V Rise time of PD signal : 10 ns 120 33 µs Power-OFF fall time Note3 tOFM ILM VOF = 0 V Fall time of PD signal : 10 ns 3 0 200 10 µs µA Power-OFF supply current VOF = 0 V Notes 1. Depends on board wiring pattern, use as reference value. 2. Time until DC voltage of mixer output reaches ± 10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. (2) Power-ON/OFF Parameter Symbol VON VOF ION Conditions Power-ON over VON and under VCC Power-OFF over GND and under VOF VON = 3 V 0.6 MIN. TYP. 1.2 1.2 48 75 MAX. 2.4 Unit V V Power-ON input voltage Power-OFF input voltage Power-ON input current µA 9 µPC8001 (3) IF Amplifier/RSSI Parameter Supply current IF amplifier output amplitude Limiting sensitivity IF amplifier input impedance IF amplifier phase variation Symbol ICC2 VO LS ZIN ∆φ LRS VIF IN =–86 to –6 dBm See Figure 4-6 Note1. VIF IN = –86 to –6 dBm Recursive calculation with VIF IN = –60 to –6 dBm Recursive calculation with VIF IN = –60 to –6 dBm Recursive calculation with VIF IN = –60 to –6 dBm See Figure 3-4. VIF IN = –86 dBm VIF IN = –46 dBm VIF IN = –6 dBm VIF IN = –86 to –6 dBm, TA = –30 to +85 °C VIF IN = –6 dBm See Figure 3-5. VIF IN = –6 dBm See Figure 3-5. VIF IN = –6 dBm VOF = 0 V VON = 3 V, VIF IN = –86 dBm PD signal rise time: 10 ns VOF = 0 V PD signal fall time: 10 ns VIF IN = –20 dBm Rise Fall RSSI output resistance R OR Note4 Note5 Conditions No signal VIF IN = –20 dBm –3dB point, see Figure 4-5. MIN. TYP. 0.95 MAX. 1.3 1.8 –86 1.8 Unit mA Vp-p dBm kΩ deg 1.2 1.5 –91 1.2 1.5 11 ± 0.5 5 RSSI linearity ±2 dB RSSI slope SLRS 22.3 24.4 30.1 mV/dB 5 RSSI intercept ICRS –135 –118 –104 dBm RSSI output voltage1 VR1 VR2 VR3 ST 0.50 1.60 2.70 0.79 1.79 2.75 1 0.98 1.90 2.82 V V V dB 5 RSSI output voltage 2 RSSI output voltage 3 RSSI output temperature stability 5 5 5 RSSI rise time trRS 77 300 µs µs mVp-p RSSI fall time RSSI output ripple Power-OFF supply current Power-ON rise time Note2 tfRS VRRS ILI tONI 113 3 2.2 174 300 12 10 600 µA µs µs Power-OFF fall time Note3 IF amplifier output slew rate tOFI SRO 3 3.4 3.8 27 34 200 V/µs 41 kΩ 5 Notes 1. Use the network analyzer at RBW = 3 Hz. 2. Time until RSSI output reaches ± 10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. 4. Rise: 10% to 90% 5. Fall: 90% to 10% 10 µPC8001 Figure 3-1. Mixer Input (a) 50Ω T ermination (b) LC Matching VMIX IN 0.01µ F VMIX IN 14 MIX IN1 5 pF Note 0.01µ F 14 MIX IN1 Note 50Ω 107 nH Note The values L and C are affected by the parasitic capacitance and inductance of the board. Therefore, adjust L and C so that the impedance at the MIX IN pin from the signal source equals 50Ω. Remark The signal source impedance is 50Ω. Figure 3-2. Third Order Intercept MIX IN1 14 MIX OUT 9 0.01µ F 0.01µ F 1.5 kΩ 50 Ω 16.7 Ω Measure 455 kHz component level with spectrum analyzer fOSC IN = 129.545 MHz OSC IN 11 VOSC IN = –15 dBm 0.01µ F 50 Ω 16.7 Ω 16.7 Ω f = 130 MHz f1 f2 VMIX OUT [dBm] 6 dB/OCT f1 = 130.1 MHz f2 = 130.2 MHz f1 = 130.1 MHz, f2 = 130.2 MHz 18 dB/OCT VMIX IN [dBm] Third order intercept Remark Signal source impedance is 50Ω. 11 µPC8001 Figure 3-3. –1 dB Compression Output Level Figure 3-4. RSSI Intercept 1 dB VOMIX V MIX IN [dBm] RSSI intercept RSSI output VORS [V] VMIX OUT [dBm] IF input level VIF IN [dBm] Figure 3-5. RSSI Response Time IF output 90% RSSI output 10% t rRS t fRS 12 µPC8001 Figure 3-6. Noise Figure Measurement 28 V SW 5 pF 0.01µF 14 MIX IN1 Noise source HP346B 107 nH 0.01µF 11 50 Ω OSC IN 47 dB Spectrum analyzer RF Amp HP8447F 3 kΩ 0.01µF 9 MIX OUT The noise figure is calculated as follows: NF = ENR – 10 log (Y – 1) NF (dB): Noise figure ENR (dB): ENR of noise source Y: Y = 10 N 2 –N 1 10 N 1 ( dBm): Spectrum analyzer indication value at SW OFF. N 2 ( dBm): Spectrum analyzer indication value at SW ON. Remark This measurement measures DSB. To measure SSB, add 3 dB to NF above. 13 µPC8001 4. CHARACTERISTIC CURVES Figure 4-1. 4 Mixer Supply Current vs. Supply Voltage 3 Supply current ICC1 [mA] 2 1 Recommended operating range 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC1 [V] Figure 4-2. Mixer Output Level vs. Mixer Input Level (fMIX IN= 130 MHz, fOSC IN = 129.545 MHz, fMIX OUT = 455 kHz, VOSC IN = –15 dBm) +20 +10 0 Mixer output level VMIX OUT [dBm] –10 –20 –30 –40 –50 –60 –70 –80 –80 –70 –60 –50 –40 –30 –20 –10 0 Mixer input level VMIX IN [dBm] 14 µPC8001 Figure 4-3. Mixer Conversion Gain vs. Mixer Input Frequency (VMIX IN= –30 dBm, VOSC IN = –15 dBm, fOSC IN = fMIX IN – fMIX OUT, fMIX OUT = 455 kHz) 30 Mixer conversion gain CG [dB] 20 3 dB 10 10 100 200 500 700 1000 Mixer input frequency fMIX IN [MHz] Figure 4-4. IF Amplifier/RSSI Supply Current vs. Supply Voltage 2.0 1.8 1.6 Supply current ICC2 [mA] 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC2 [V] Recommended operating range 15 µPC8001 Figure 4-5. +30 IF Amplifier Output Level vs. IF Amplifier Input Level +20 IF amplifier output level VIF OUT [dBm] +10 3dB 0 –10 –20 –30 Limitting sensitivity (–91 dBm) –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 IF amplifier input level VIF IN [dBm] Figure 4-6. 250 IF Amplifier Output Phase vs. IF Amplifier Input Level [deg] ∆ φ = 11 deg TYP. 240 IF amplifier output phase φ IF OUT 230 –90 –86 –80 –70 –60 –50 –40 –30 –20 –10 –6 0 IF amplifier input level VIF IN [dBm] 16 µPC8001 Figure 4-7. RSSI Output Voltage vs. IF Amplifier Input Level 5 (The temperature characteristics curves) 3.0 2.5 2.0 RSSI output voltage VORS [V] 1.5 1.0 0.5 0 –120 –110 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 0 IF amplifier input level VIF IN [dBm] Remarks 1. TA = –30 °C TA = +25 °C TA = +85 °C 2. The three temperature characteristic curves are virtually identical. 17 µPC8001 5 5. TEST CIRCUIT EXAMPLE 50 Ω 0.01µF 1µF 1000 + pF 3V 50 Ω 1.5 kΩ 0.01µ F 0.01µ F 13 MIX IN2 12 VCC1 11 OSC IN 10 GND 9 MIX OUT 8 FIL2 0.01µ F 0.01µ F 14 MIX IN1 µ PC8001GR IF OUT 1 0.01µ F PD 2 RSSI OUT 3 FIL3 4 V CC2 IF IN 6 0.01µ F FIL1 7 5 0.01µ F 50 kΩ Note + 1000 1µF pF 3V 50 Ω 3V 10 pF 1000 pF 0.01µ F Note The value of the capacitance connected to the IF OUT pin (No. 1) includes the capacitances of PCB wiring patterns and the tester. Remark In three cases of Mixer Input, Third Order Intercept and Noise Figure Measurement, refer to Figures 3-1, 3-2, and 3-6. 18 µPC8001 6. PACKAGE DRAWINGS 14 PIN PLASTIC SHRINK SOP (225 mil) 14 8 detail of lead end 1 A 7 H I 5˚±5˚ F G J C D MM B K L E N P14GM-65-225B-2 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N MILLIMETERS 5.40 MAX. 0.75 MAX. 0.65 (T.P.) 0.30 +0.10 –0.05 0.125 ± 0.075 1.8 MAX. 1.44 6.2 ± 0.3 4.4 0.9 0.15 +0.10 –0.05 0.5 ± 0.2 0.10 0.10 INCHES 0.213 MAX. 0 .030 MAX. 0.026 (T.P.) 0.012+0.004 –0.003 0.005 ± 0.003 0.071MAX. 0.057 0.244 ± 0.012 0.173 0.035 0.006+0.004 –0.002 0.020 –0.009 0.004 0.004 +0.008 19 µPC8001 7. RECOMMENDED SOLDERING CONDITIONS The following conditions must be met for soldering conditions of the µ PC8001. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207). Please consolt with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. Types of Surface Mount Device µ PC8001GR: 14-pin plastic shrink SOP (225 mil) Soldedering process Infrared ray reflow Soldering conditions Peak temperature of package surface: 235 ˚C or below, Reflow time: 30 seconds or below (210 ˚C or higher), Number of reflow processes: MAX. 2 [Remark] (1) Please start the second reflow process after the temperature, raised by the first reflow process, returns to normal. (2) Please avoid removing the residual flux with water after the first reflow process. Partial heating method Terminal temperature: 300 ˚C or below, Time: 3 seconds or below (Per one side of the device). ——— Symbol IR35-107-2 20 µPC8001 Precautions Against Static Electricity Caution When handling the device, be careful to protect it from static electricity. exposure to a strong static electricity charge may destroy internal transistor junctions. During transportation and storage, place the device in the conductive tray or case originally provided by NEC for shipping, or conductive shock absorbing material, metal case, etc. During assembly, be sure to ground the device. Be careful not to place the device on a plastic board and do not touch the device's pins. 21 µPC8001 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 22