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NHD-320240WG

NHD-320240WG

  • 厂商:

    NEWHAVEN

  • 封装:

  • 描述:

    NHD-320240WG - Liquid Crystal Display Graphic Module - Newhaven Display International, Inc.

  • 数据手册
  • 价格&库存
NHD-320240WG 数据手册
User’s Guide LCM NHD320240WGC OTFHVZ#010-80: NHD-320240WG-COTFH-VZ#-010-80 (Liquid Crystal Display Graphic Module) RoHS Compliant Newhaven Display 320 x 240 Dots W= Version Line G= Display Type- Graphic Model Serial Number White LED B/L FSTN (+) Transflective, 6:00 View, Wide Temperature (-20 ~ +70c) With built in Negative Voltage, Rohs Backlight A(+5V)=PIN19, K=PIN20, Intel 8080 interface mode For product support, contact Newhaven Display International 2511 Technology Drive, #101 Elgin, IL 60124 Tel: (847) 844-8795 Fax: (847) 844-8796 April 17, 2008 RECORDS OF REVISION VERSION DATE REVISED PAGE NO. DOC. FIRST ISSUE SUMMARY 0 2006.06.23 First issue Contents 1.Module classification information 2.Precautions in Use of LCM 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Description 8.Contour Drawing & Block Diagram 9. Display Control Instruction 10.Reliability 11. Backlight Information 12.Inspection specification 13.Material List of Components for RoHs 第 3 頁,共 20 頁 3 1.Module Classification Information NHD 320240 W G - C0 T F H – VZ#-010-80 9 Brand:Newhaven Display Display Font:320 * 240 Dots Factory Line: W Display Type:H→Character Type, G→Graphic Type, C→ Color, X→Tab Type Model / Serial number: C0 Backlight Type: With RA8835 Controller T→White LED A→LED, Amber R→LED, Red O→LED, Orange G→LED, Green T→FSTN Negative Y→STN Positive, Yellow Green M→STN Negative, Blue F→FSTN Positive H→Transflective, W.T,6:00 K→Transflective, W.T,12:00 C→Transmissive, N.T,6:00 F→Transmissive, N.T,12:00 I→Transmissive, W. T, 6:00 L→Transmissive, W.T,12:00 N→Without backlight B→EL, Blue green D→EL, Green W→EL, White F→CCFL, White Y→LED, Yellow Green LCD Mode: B→TN Positive, Gray N→TN Negative, G→STN Positive, Gray LCD Polarize Type/ A→Reflective, N.T, 6:00 Temperature range/ D→Reflective, N.T, 12:00 View direction G→Reflective, W. T, 6:00 J→Reflective, W. T, 12:00 B→Transflective, N.T,6:00 E→Transflective, N.T.12:00 9 Special Code #: RoHS ; V: Built in Negative voltage Z: NT7086 Driver Control RA8835 -010: Backlight A(+5V)=PIN19, K=PIN20 -80: Intel 8080 Interface mode Newhaven Display International, LLC NHD-320240WG-C0TFH-VZ#-010-80 2.Precautions in Use of LCD Module (1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD Module. (3)Don’t disassemble the LCM. (4)Don’t operate it above the absolute maximum rating. (5)Don’t drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment. 3.General Specification ITEM Number of dots Outline dimension View area Active area Dot size Dot pitch LCD type View direction Backlight STANDARD VALUE 320x240 148.02 (W)x 120.24(H)x 15.6max(T) 120.14(W)x 92.14(H) 115.18(W)x 86.38(H) 0.34(W)x 0.34(H) 0.36(W)x 0.36(H) FSTN Positive , Transflective 6 o’clock LED , White UNIT dots mm mm mm mm mm 第 5 頁,共 20 頁 4.Absolute Maximum Ratings ITEM Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD SYMBOL TOP TST VI VDD VDD-VEE MIN. -20 -30 0 0 0 TYP. - - - - - MAX. +70 +80 Vdd 6.5 32 UNIT ℃ ℃ V V V 5.Electrical Characteristics ITEM Logic Voltage Supply Voltage For LCD Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current VDD-VO SYMBOL VDD-VSS CONDITION - Ta=-20℃ Ta=25℃ Ta=70℃ VIH VIL VOH VOL IDD - - - - - MIN. 4.5 - - 23.0 0.5VDD 0 2.4 - 95.0 TYP. 5.0 - 23.8 - - - - - 100.0 MAX. 5.5 25.0 - - VDD 0.2VDD - 0.4 110.0 UNIT V V V V V V V V mA 第 6 頁,共 20 頁 6.Optical Characteristics ITEM View Angle Contrast Ratio Response Time T fall SYMBAL CONDITION MIN (V)θ (H)φ CR T rise CR≧2 CR≧2 - - - 30 -45 - - - TYP - - 5 200 150 MAX 60 45 - 300 200 UNIT deg. deg. - ms ms 6.1 Definitions ■View Angles Z ( Visual angle direction ) ■Contrast Ratio Brightness at selected state ( BS ) Brightness at non-selected state ( Bns ) Selected state CR = Brightness (%) Non-selected state X φ Bs Bns ■Response time Nonselected Condition Brightness 100 % θ Y Operating voltage for LCD driving Selected Condition Nonselected Condition 90 % 10 % tr Rise Time 第 7 頁,共 20 頁 td Decay Time ( fall time tf ) 7.Interface Description JM (left) short , for 8080 MPU family Pin No. 1 2 3 4 5 6 7~14 15 16 17 18 19 20 Symbol VSS VDD VO /RD /WR A0 DB0~DB7 CS RES VEE FGND A K Level 0V 5.0V Ground Power supply for Logic Description (Variable) Driving voltage for LCD H/L H/L H/L H/L H/L H/L -25V Active Low=Read data /WR signal input to select the write mode Active Low = Write data R/W=L, A0=H: Command Write R/W=H, A0=H: Status Read Data bus Chip select ,Active L Controller reset signal, Active L Negative voltage output (Optional) Frame Ground 5.0V 0V Backlight supply Backlight ground A0=L: Data Write A0=L: Data Read 第 8 頁,共 20 頁 8.Contour Drawing & Block diagram 4.02 4.44 13.74 16.62 13.97 16.45 139.98 136.2 120.14(V A ) 115.18(A A ) 15.6M A X 10.5 X H -3P EQ 120.24 0.5 92.14(VA) 86.38(AA) 105.4 112.2 320*240 D ots 190.0±5.0 20 19 2 1 2.54 5.0 4- 3 .5PTH 4- 6 .0PA D 148.02 22.86 (P2.54*9) 21.06 20- 1 .0PTH 20- 1 .8PA D L ED B /L 1.6 0.5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 V ss V dd Vo RD WR A0 DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS R ES V ee FG N D A K 4.02 7.11 T he non-specified tolerance of dim ension is ±0.3 m m . 0.36 0.34 0.36 0.34 D O T SIZE SC A L E 10/1 RD WR A0 DB0~DB7 CS RES CL1 M FLM Driver Com1~80 RA8835 Controller 32K SRAM Power ON Reset * Bias and Power Circuit Vdd Vo Com81~160 Driver MPU 320X240 DOT Com161~240 Seg1~80 Seg81~160 Seg161~240 Seg241~320 Driver VR 20K Driver Driver Driver Driver Vee Internal contrast adjustment. N.V. Generator CL2 DB0~DB3 Frame PAD FGND *:6800 family or 8080family interface selectable. 第 9 頁,共 20 頁 9.Display Control Instruction PLEASE TO CONSUL RA8835 SPEC 第 10 頁,共 20 頁 10.RELIABILITY Content of Reliability Test (wide temperature, -20℃~70℃) Environmental Test Test Item High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress (Voltage & Current) and the thermal stress to the element for a long time. Content of Test Endurance test applying the high storage temperature for a long Test Condition 80℃ 200hrs -30℃ 200hrs 70℃ 200hrs Note 2 1,2 —— Endurance test applying the electric stress under low temperature -20℃ for a long time. The module should be allowed to stand at 60℃,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20℃ 25℃ 70℃ -20℃/70℃ 10 cycles 30min 5min 1 cycle Total fixed amplitude : 15mm Endurance test applying the vibration during transportation and using. Vibration Frequency : 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5kΩ 30min 200hrs 60℃,90%RH 96hrs 1 1,2 Thermal shock resistance —— Vibration test 3 Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time —— Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container. 第 11 頁,共 20 頁 11. Backlight Information Specification PARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life Time Color SYMBOL MIN ILED 130 TYP 160 5.0 - 280 - 50K - - MAX 200 5.1 8 UNIT mA V V TEST CONDITION VatPIN19=5.0V - - V(PIN19) 4.8 VR IV λp - White - 260 - - CD/M2 ILED=160mA nm Hr. ILED=160mA ILED=160mA Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum). LED B\L Drive Method 1.Drive from 19,20 R 19 B/L 20 第 12 頁,共 20 頁 12. Inspection specification NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL 01 Electrical Testing 0.65 02 Black or white 2.1 White and black spots on display ≦0.25mm, no more than three spots on LCD 2.5 white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing Φ=( x + y ) / 2 SIZE Φ≦0.10 0.10<Φ≦0.20 black 0.20<Φ≦0.25 white 0.25<Φ 03 LCD spots, spots, contamination 3.2 Line type : (As following drawing) (non-display) Length Width --W≦0.02 L≦3.0 0.02<W≦0.03 L≦2.5 0.03<W≦0.05 --0.05<W If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Acceptable Q TY Accept no dense 2 1 0 2.5 Acceptable Q TY Accept no dense 2.5 2 As round type Acceptable Q TY Accept no dense 3 2 0 3 2.5 Φ≦0.20 0.20<Φ≦0.50 0.50<Φ≦1.00 1.00<Φ Total Q TY 04 Polarizer bubbles 第 13 頁,共 20 頁 NO 05 Item Scratches Criterion Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length k: Seal width y: Chip width t: Glass thickness z: Chip thickness a: LCD side length AQL L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels: z: Chip thickness Chipped 06 glass Z≦1/2t 1/2t<z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a 2.5 ☉If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack: z: Chip thickness Z≦1/2t 1/2t<z≦2t y: Chip width Not over viewing area Not exceed 1/3k x: Chip length x≦1/8a x≦1/8a ☉If there are 2 or more chips, x is the total length of each chip. 第 14 頁,共 20 頁 NO Item Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad : AQL y: Chip width x: Chip length y≦0.5mm x≦1/8a 6.2.2 Non-conductive portion: z: Chip thickness 0 < z≦t 06 Glass crack 2.5 y: Chip width x: Chip length z: Chip thickness y≦ L x≦1/8a 0 < z≦t ☉If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. ☉If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y≦1/3L x: length x≦a 第 15 頁,共 20 頁 NO 07 Item Cracked glass Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn't light or color wrong. AQL 2.5 0.65 2.5 0.65 08 Backlight elements 09 Bezel 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB X 2.5 0.65 2.5 2.5 0.65 2.5 10 PCB、COB 2.5 0.65 0.65 2.5 2.5 11 Soldering X * Y
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