NESW064AT

No. STSE-CC7190A SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NESW064AT NICHIA CORPORATION -0- Nichia STSE-CC7190A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature Symbol IF IFP IR PD Topr Tstg Tj Tsld Absolute Maximum Rating 30 100 85 105 -40 ~ +110 -40 ~ +110 125 Reflow Soldering : 260°C Hand Soldering : 350°C (Ta=25°C) Unit mA mA mA mW °C °C °C for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Thermal Characteristics Item Symbol Rja Heat resistance Rjs Typ. 360 180 (Ta=25°C) Unit °C/W °C/W Rja = Heat resistance from Dice to Ambient temperature (Ta) Rjs = Heat resistance from Dice to Solder temperature of Cathode Side (Ts) Using Nichia standard circuit board FR4, t=1.6mm, Copper foil, t=35µm (3) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=20[mA] IF=30[mA] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (3.1) (2000) (1500) 0.31 0.32 (Ta=25°C) Max. Unit 3.5 V mcd mcd - (4) Ranking Item Luminous Intensity Rank V Rank U Rank T Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Min. 1440 1000 720 (Ta=25°C) Max. Unit 2000 mcd 1440 mcd 1000 mcd Luminous Intensity Measurement allowance is ± 10%. Color Ranks x y 0.280 0.248 Rank a0 0.264 0.283 0.267 0.305 0.296 0.276 -1- x y 0.287 0.295 (IF=20mA,Ta=25°C) Rank b1 0.283 0.330 0.330 0.305 0.360 0.339 Nichia STSE-CC7190A Rank b2 0.287 0.330 0.295 0.339 Rank c0 0.330 0.361 0.360 0.385 x y 0.296 0.276 0.330 0.318 x y 0.330 0.318 0.356 0.351 Color Coordinates Measurement allowance is ± 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2. INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Package : Material as follows ; Encapsulating Resin : Electrodes : Heat-Resistant Polymer Silicone Resin (with Diffused + Phosphor) Ag Plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC7190A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Tsld=215 ± 5°C, 3sec. (using flux, Lead Solder) -40°C ~ 110°C 1min. (10sec.) 1min. (Pre treatment 30°C,70%,168hrs.) -40°C ~ 25°C ~ 110°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=110°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=30mA Ta=85°C, IF=25mA 60°C, RH=90%, IF=20mA Ta=-40°C, IF=20mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25°C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 75cm R=1.5kΩ, C=100pF Test Voltage=2kV Note 2 times Number of Damaged 0/22 1 time over 95% 100 cycles 0/22 0/100 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1 time 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22 Vibration 48min. 0/10 Drop Electrostatic Discharge JEITA ED-4701 300 304 3 times 3 times Negative/Positive 0/10 0/22 (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Item Forward Voltage Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol VF IV IV Test Conditions IF=20mA IF=20mA IF=20mA Min. L.S.L.**) L.S.L.**) 0.7 0.5 Max. U.S.L.*) 1.1 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level These test items are judged by the criteria of Luminous Intensity Condition 2. -3- Nichia STSE-CC7190A 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrodes and leadframes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC7190A (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 260°C Max. 240°C Max. 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 120sec.Max. 240°C Max. 10sec. Max. 1~ 5°C / sec. 1~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 120sec.Max. 260°C Max. 10sec. Max. 2.5 ~ 5°C / sec. [Recommended soldering pad design] Use the following conditions shown in the figure. 9.5 4 1.5 1.5 4 2.6 4 (Unit : mm) : Solder resist · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -5- Nichia STSE-CC7190A (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others · NESW064A complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CC7190A ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 550 560 0.6 570 500 0.5 580 590 0.4 600 y b1 0.3 490 c0 b2 610 620 630 a0 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x Color Coordinates Measurement allowance is ± 0.01. -7- Forward Voltage vs. Forward Current 200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25°C Relative Luminosity (a.u.) Forward Current vs. Relative Luminosity Allowable Forward Current IFP (mA) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25°C Duty Ratio vs. Allowable Forward Current 200 Ta=25°C 100 50 30 20 10 1 1 2.0 2.5 3.0 3.5 4.0 4.5 Forward Voltage VF (V) 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Forward Voltage 4.6 Relative Luminosity (a.u.) Forward Voltage VF (V) 4.2 3.8 3.4 3.0 2.6 2.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) IFP=60mA IFP=20mA IFP=5mA Ambient Temperature vs. Relative Luminosity 2.0 IFP=20mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 40 30 20 10 0 Ts=Solder Temperature (Cathode Side) Ta=Ambient Temperature Target Average Lifetime (Time to 70% Lumen Maintenance Level) Conditions IF=25mA , Ta=25°C IF=25mA , Ta=85°C -8- Average Lifetime 50,000 Operating hours 10,000 Operating hours 0.5 0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) 0 20 40 60 80 100 120 Temperature T (°C) (NOTE 1) Using Nichia standard circuit board FR4, t=1.6mm, Copper foil, t=35µm (NOTE 2) Average lifetime shown for reference only. Nichia STSE-CC7190A Model NESW064A NICHIA CORPORATION Title No. CHARACTERISTICS 070802769771 Forward Current vs. Chromaticity Coordinate Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength λ (nm) 750 Ta=25°C IF=20mA 0.35 Ta=25°C 0.34 0.33 1mA 5mA 20mA 50mA 100mA y 0.32 0.31 0.30 0.29 0.30 0.31 0.32 0.33 0.34 x Ambient Temperature vs. Chromaticity Coordinate 0.35 IFP=20mA 0.34 0.33 -40°C 0°C 25°C 110°C 50°C Directivity 1.0 Relative Luminosity (a.u.) 0° Ta=25°C IFP=20mA 10° 20° 30° 40° 50° y -90.32 0.31 0.5 60° 70° 80° 0.30 0.29 0.30 0.31 0.32 0.33 0.34 0 90° x 60° 30° Radiation Angle 0° 0.5 90° 1.0 Nichia STSE-CC7190A Model NESW064A NICHIA CORPORATION Title No. CHARACTERISTICS 070802769781 Internal Circuit A Protection device (2.4) 0.8 ± 0.3 Anode K 2.8 (0.4) -10- 0.8 ± 0.3 Cathode mark (C 0.6) 3.5 ± 0.3 (2.4) (1.9) 3.2 Cathode MATERIALS ITEM Heat-Resistant Polymer Silicone Resin ENCAPSULATING RESIN (with Diffused + Phosphor) ELECTRODES Ag Plating Copper Alloy NxSW064x has a protection device built in as a protection circuit against static electricity. Nichia STSE-CC7190A 2 ± 0.3 (0.45) (1.05) 2.2 Model (0.8) PACKAGE NxSW064x Unit mm 15/1 Scale Allow ±0.2 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 070802651592 1.75±0.1 Taping part φ 1.5+0.1 -0 4±0.1 2±0.05 0.25±0.05 Reel part φ 180+0 -3 11.4±1 9±0.3 3.5±0.05 Cathode mark 8+0.3 - 0.1 3.65±0.1 (2.75) φ 13 ±0.2 4±0.1 φ 2.85±0.1 2.15±0.1 1+0.25 -0 Label XXXX LED TYPE NxSx064xT LOT XXXXXXQTY pcs RoHS Reel End of tape No LEDs LEDs mounting part No LEDs φ 60+1 -0 φ2 1 ±0.8 -11Embossed carrier tape Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Pull direction Top cover tape Reel Lead Min.400mm Nichia STSE-CC7190A 2,000pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NxSx064xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 070914769932 Nichia STSE-CC7190A The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal TYPE LOT QTY NICHIA XXXX LED NxSx064xT xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NxSx064xT PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 2,000 MAX. Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 14,000 MAX. 30,000 MAX. 60,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NxSx064xT NICHIA CORPORATION Title No. PACKING 070802651612 -12-