SM8150AB

SM8150A PMIC with White LED Driver 1. OVERVIEW The SM8150A is a charge pump type white LED driver, with 2-system programmable LDOs (Low Dropout Regulator), and step-down DC/DC converter power management IC. The white LED driver provides constantcurrent drive for 1 to 6 backlight white LED connected in parallel and 1 torch/strobe white LED. The charge pump automatically selects between ×1 mode, ×1.5 boost mode, and ×2 boost mode in response to battery voltage, LED drive current, and VFLED (LED forward bias voltage drop) conditions in order to extend battery drive life. The SM8150A operating mode settings are accessed using an I2C*1 interface, allowing LED drive current, LDO voltage, output ON/OFF, and other settings to be controlled from a microcontroller. *1. I2C-BUS is a registered trademark of NXP B. V. 2. FEATURES I 3. TYPICAL APPLICATION CIRCUIT 1µF 1µF I I I I I I I I I I I I Optimum specifications for clamshell cellular phone with camera • LCD backlight: Main-4ch/Sub-2ch (max 25mA/ch) • Camera flash: 1ch (max 300mA) Power saving design by automatic mode selection of charge pump • Power at ×1.5 mode is reduced by 25% from ×2 mode • Power at ×1 mode is reduced by 50% from ×2 mode, 33% from ×1.5 mode I2C interface best match for cellular phone chipset Selecting current value (torch/strobe) of flash LED by SBN pin Shutdown synchronized to microcontroller supply by VEN pin 1 system of step-down DC/DC converter built-in • Output: 1.2 to 3.0V@ max 500mA 2 systems of programmable LDO built-in • Output: 1.5/1.8/2.5/2.6/2.8/3.0/3.1/3.3V@ max 300mA Various protection circuits built-in • Startup soft start circuit built-in • Overtemperature thermal shutdown (TSD) circuit built-in • Supply undervoltage lockout (UVLO) circuit built-in Supply voltage range (VIN1 to VIN3): 2.7 to 4.6V Logic operating voltage range (VEN) : 1.8 to 4.6V White LED Driver • Charge-pump frequency: 1.0MHz (typ) • Charge-pump maximum output current: 450mA • Backlight LED current: 25 ± 1.5mA/ch (max) • Backlight LED relative accuracy: ± 3% • Flash LED current: 300 ± 20mA (max) DC/DC converter • DC/DC converter output voltage: 1.2 to 3.0V (typ) • DC/DC converter output current: 500mA (max) • DC/DC converter operating frequency: 2.0MHz (typ) • DC/DC converter voltage accuracy: ± 2% LDO • LDO output voltage: 1.5 to 3.3V (VIN = 3.6V) • LDO output current: 300mA (max) • LDO dropout voltage: 0.1V (typ) • LDO voltage accuracy: ± 2% Package: 28-pin QFN 3.6V C1P 4.7µF VIN1 PGND1 VIN2 PGND2 DIN2 2.2µF VIN3 DIN3 DIN4 DIN5 DIN6 Logic supply 0.1µF VEN DIN1 C1M C2P C2M VOUT 2.2µF 2.2µF SM8150A DIN7 I2 C SCL SDA LDOUT1 2.2µF 2.2µF LDO1 output LDOUT2 LDO2 output Strobe ON/OFF SBN FB 8pF 100kΩ 200kΩ DCOUT (1.8V) 0.1µF VREF GND1 GND2 LX 2.2µH 2.2µF 4. APPLICATIONS I I Cellular phone Mobile equipment 5. ORDERING INFORMATION Device SM8150AB Package 28-pin QFN SEIKO NPC CORPORATION —1 SM8150A 6. PINOUT (Top view) LDOUT1 VIN3 LDOUT2 FB PGND2 LX VIN2 VREF GND2 DIN7 DIN6 DIN5 GND1 DIN4 21 22 15 14 28 1 7 8 SDA SCL SBN VEN VIN1 C1M PGND1 7. PIN DESCRIPTION Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Name DIN3 DIN2 DIN1 VOUT C1P C2P C2M PGND1 C1M VIN1 VEN SBN SCL SDA VIN2 LX PGND2 FB LDOUT2 VIN3 LDOUT1 VREF GND2 DIN7 DIN6 DIN5 GND1 DIN4 I/O O O O O – – – – – – – I I I/O – O – I O – O O – O O O – O Description LED drive current control output 3 (group A)*1 LED drive current control output 2 (group A)*1 LED drive current control output 1 (group A)*1 LED drive voltage output Charge pump boost capacitor connection Charge pump boost capacitor connection Charge pump boost capacitor connection Ground (charge pump) Charge pump boost capacitor connection Supply input (charge pump) Supply input (logic)*2 Torch/strobe selecting voltage input (strobe when LOW)*3 I2C interface clock input*3 I2C interface data input*3 Supply input (DC/DC converter) DC/DC converter coil switching output*4 Ground (DC/DC converter) DC/DC converter feedback input LDO output 2*4 Supply input (logic and LDOs) LDO output 1*4 Bypass capacitor connection Ground LED drive current control output 7 (high-current LED)*1 LED drive current control output 6 (group B)*1 LED drive current control output 5 (group B)*1 Ground LED drive current control output 4 (group A)*1 *1. Connect to ground when no LED is connected. *2. Connect to a supply with ≥ 1.8mA drive current capability. If pull-up resistors Rup are connected to SCL, SDA, and SBN, the current consumption increases by the amount flowing through the pull-up resistances only. The current component for each of the 3 pins is given by Iup [mA] = VEN [V] / Rup [kΩ]. *3. Pull-up or pull-down resistances are not built-in. *4. Leave open circuit when not used (do not connect to ground). SEIKO NPC CORPORATION —2 DIN3 DIN2 DIN1 VOUT C1P C2P C2M SM8150A 8. BLOCK DIAGRAM VIN1 C1M C1P C2M C2P VIN2 VOUT VIN3 Charge pump 1/ 1.5/ 2 DIN1 DIN2 Current control & Current detect VEN Group A DIN3 DIN4 Group B DIN5 DIN6 DIN7 GND2 OSC VREF Thermal shutdown UVLO SCL SDA I2 C interface & Control logic Torch/ Strobe Synchronous step-down DC/DC converter Programmable LDO Programmable LDO LX FB DCOUT SBN LDOUT1 LDOUT2 GND1 VREF PGND1 PGND2 SEIKO NPC CORPORATION —3 SM8150A 9. ABSOLUTE MAXIMUM RATINGS GND = PGND = 0V Parameter Supply voltage Logic operating voltage Input voltage All other input pins SDA Output voltage VOUT All other output pins VOUT Output current LX LDOUT1 to 2 Power dissipation Junction temperature Storage temperature − Pins VIN1 to 3 VEN SBN, SCL, SDA Symbol VIN VEN VDATA VINPUT VOUT_ACK VOUT_CP VOUTPUT IOUT_CP IOUT_LX IOUT_LDO PD TJMAX TSTG 1.1 (θJ Rating −0.3 to 5.5 −0.3 to 5.5 –0.3 to VEN + 0.3 –0.3 to VIN + 0.3 –0.3 to VEN + 0.3 5.5 –0.3 to VIN + 0.3 600 1.2 1 = 90°C /W)*1 +125 −55 to +125 Unit V V V V V V V mA A A W °C °C *1. When the SM8150A is mounted on a 40 × 60 × 1.6mm 2-layer board whose wiring pattern ratio is 130%. Note. The device may suffer breakdown if any one of these parameter ratings is exceeded. The thermal resistance θJ required for the operating environment is determined by the relationship with power dissipation and operating temperature given below. I I I Maximum junction temperature: TJMAX = 125 [°C] Operating temperature: Ta [°C] Thermal resistance: θJ [°C/W] PD = (TJMAX − Ta) θJ 2 1.5 PD [W] 1 0.5 0 0 25 50 Ta [°C] 75 85 θJ = 90°C/W SM8150A power dissipation SEIKO NPC CORPORATION —4 SM8150A 10. RECOMMENDED OPERATING CONDITIONS VIN1 = VIN2 = VIN3, GND = PGND = 0V Rating Parameter Pin Symbol VIN_×1 Supply voltage*1 VIN1 to 3 VIN_×1.5 VIN_×2 Logic operating voltage Input voltage Strobe time*2 Torch LED current*2 Operating temperature DIN7 − VEN SBN, SCL, SDA VEN VDATA tSTROBE ILED7 Ta ILED7 ≥ 150mA tTORCH > 250ms Conditions min ×1 mode, IOUT = 0mA ×1.5 mode, IOUT = 150mA ×2 mode, IOUT = 450mA 2.7 3.0 3.3 1.8 0 − − −30 typ 3.6 3.6 3.6 2.8 − − − 25 max 4.6 4.6 4.6 4.6 VEN 250 150 +85 V V V V V ms mA °C Unit *1. Supply voltage and IOUT (LED) When the white LED drive current is increased, the required supply voltage also increases. The supply is automatically switched in charge pump boost mode, and cannot be manually selected. The forward-bias voltage drop VF of the LED is assumed to be ≤ 3.5V. 500 400 IOUT (LED) [mA] 300 200 100 0 2.5 3 3.5 4 4.5 5 VIN [V] IOUT (LED) vs. VIN *2. Torch and Strobe Pin DIN7 is provided for connection to a high-current white LED. Two types of light modulation (dimming) data are available, switched by the SBN input voltage. When SBN is HIGH, torch mode is selected. When SBN is LOW, strobe mode is selected. The recommended operating condition is high current with short ON times in strobe mode, and low current with longer ON times in torch mode. In strobe mode (SBN = LOW), high-current supply is the main priority and, therefore, the current consumption is not optimized (see “Torch/Strobe Selecting”). I2C data settings DIN7 − Enable 1 1 1 * * 1 * * L H 1 1 1 * * 0 * * L OFF OFF OFF OFF ON OFF Strobe − − SBN H Torch ON Strobe OFF Dimming Torch Recommended operating conditions ILED7 < 150mA Operating time < 250ms − − DIN7 − Disable SEIKO NPC CORPORATION —5 SM8150A 11. ELECTRICAL CHARACTERISTICS 11-1. Common Blocks VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Standby current 1 VIN Standby current 2 Pin Symbol ISTB1 ISTB2 IEN1 Condition min VEN = 0V, input/outputs no load VEN ≥ 1.8V, input/outputs no load SCL = SDA = SBN = VEN SBN = VEN = 2.8V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN × 90% SBN = VEN = 4.6V SCL, SDA: f = 400kHz tr = tf = 300ns signal amplitude = VEN × 90% Design value VIN falling Design value Design value VEN ≥ 2.3V VEN ≥ 2.3V VEN < 2.3V VEN < 2.3V VIH = VEN VIL = GND – – – typ 0.01 0.1 0.1 max 1 1 1 µA µA µA Unit IEN2 Current consumption*1 VEN – 0.1 0.5 mA IEN3 Power-ON reset time*2 VIN UVLO operating voltage TSD operating temperature – TSD hysteresis H-level input voltage 1 L-level input voltage 1 H-level input voltage 2 L-level input voltage 2 H-level input current L-level input current SBN, SCL, SDA – 0.6 1.8 mA tPOR VUVLO TSD TSDHYS VIH1 VIL1 VIH2 VIL2 IIH IIL – 2.0 – – 1.8 – 1.5 – – –1.0 – 2.45 170 20 – – – – – – 1 2.65 – – – 0.6 – 0.3 1.0 – ms V °C °C V V V V µA µA *1. Excluding the current that flows to external circuit such as pull-up resistors. IEN A Rup Rup Rup 0.1µF VEN SCL SDA SBN *2. The time between when power is applied and the device enters standby mode. Reference Data 0.5 Standby current 2 [µA] 0.4 0.3 0.2 0.1 0 2.7 3 3.3 3.6 3.9 4.2 4.5 VIN [V] Standby current (VEN = 1.8V) SEIKO NPC CORPORATION —6 SM8150A 11-2. White LED Driver VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Pin Symbol IDRV_×1 Current consumption*1 VIN IDRV_×1.5 IDRV_×2 Output voltage*2 VOUT Output current Charge pump frequency Soft start time*3 DIN1 to 7 LED drive pin leakage current LED current (max) 1 DIN1 to 6 LED current relative accuracy LED current (max) 2 DIN7 C1M VOUT_CP IOUT_CP fOSC tSS ILEAK1 to 7 ILED1 to 6 ∆ILED ILED7 Standby mode, DIN1 to 7 = VIN ×1 mode, ILED1 to 6 max setting ×1 mode, ILED1 to 6 max setting ×2 mode, ILED7 max setting Condition min ×1 mode, no load ×1.5 mode, no load ×2 mode, no load Boost ON, no load Boost ON – – – 4.6 – 0.85 – – 23.5 –3.0 280 typ 0.3 4 5 4.9 – 1.0 1 0.01 25.0 – 300 max 1 8 10 5.2 450 1.15 3 1.0 26.5 +3.0 320 mA mA mA V mA MHz ms µA mA % mA Unit *1. LDOUT1 to 2 and the DC/DC converter is disabled. *2. Over voltage protection threshold. *3. The time from when one of the DIN1 to 7 outputs is enabled until the LED turns ON. Charge Pump Operating Mode Switching The SM8150A switches between 3 charge pump operating modes; ×1 mode (VIN through mode), ×1.5 mode (×1.5 charge pump boost), and ×2 mode (×2 charge pump boost), reducing the total power dissipation. These selecting occurs automatically in internal circuits, and cannot be controlled by external signals. If the LED current drops below the setting value while operating in ×1 or ×1.5 mode, each LED drive circuit detects the undercurrent and the operating mode is automatically selected ×1 → ×1.5, ×1.5 → ×2. This occurs even if only one LED undercurrent condition is detected among the 7-channel LED drive circuits, thus it is recommended that LED has small VF variation to optimize the total efficiency. In ×1.5 or ×2 mode operating, the SM8150A generates "a mode reset signal" internally once every 1 second. This signal forces to select the mode ×1.5 → ×1, ×2 → ×1.5. Reference Data 7 6 Efficiency [%] ×1 3 3.3 3.6 3.9 4.2 4.5 IDRV [mA] 5 4 3 2 1 0 2.7 ×1.5 ×2 100 80 60 40 20 0 3.0 3.3 3.6 3.9 4.2 4.5 VIN [V] VIN [V] Current consumption (No load) Efficiency (DIN1 to 6: 25mA, DIN7: 155mA) SEIKO NPC CORPORATION —7 SM8150A 11-3. I2C Interface VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter SCL clock frequency SCL hold time SCL L-level pulsewidth SCL SCL H-level pulsewidth SCL setup time SDA data hold time SDA data setup time Rise time SCL, SDA Fall time SCL setup time Bus free time Capacitive load for each bus line Pin SCL SCL, SDA Symbol fSCL tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tr tf tSU;STO tBUF Cb I2C stop condition I2C start condition I2C start condition Condition min − 0.6 1.3 0.6 0.6 0.05 100 − − 0.6 1.3 − typ − − − − − − − − − − − − max 400 − − − − 0.9 − 300 300 − − 400 kHz µs µs µs µs µs ns ns ns µs µs pF Unit SDA tf tLOW tr tr tSU;DAT tf tBUF tHD;STA SCL tHD;STA tHD;DAT tHIGH tSU;STA tSU;STO S Sr Note. S: START condition, Sr: repeated START condition, P: STOP condition P After a START condition, the slave address should be sent, and a data transfer should be terminated by a STOP condition. Start SDA 1st byte: Slave address 2nd byte: Control data Nth byte: Control data Stop ACK M3 M2 D2 D1 ACK M3 M2 D2 D1 ACK SCL 1 2 7 8 9 1 2 7 8 9 1 2 7 8 9 SEIKO NPC CORPORATION —8 SM8150A 11-4. DC/DC Converter VIN = 3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Current consumption*1 Soft start time*2 Output voltage range*3 FB pin voltage LX pin output current Switching frequency Supply-side switch ON resistance LX GND-side switch ON resistance LX pin leakage current Line regulation DCOUT Load regulation Overcurrent protection circuit operating current LX Pin VIN LX DCOUT FB DCOUT Symbol IDD tSS VDCO VFB IDCO fOSC RONP RONN ILEAKLX ∆VOUT1 ∆VOUT2 ILIMITLX ILX = 50mA ILX = 50mA Standby mode, LX = 1/2VIN 2.7 ≤ VIN ≤ 4.6V, IDCO = 1mA 1mA ≤ IDCO ≤ 300mA Supply-side switch IDCO = 1mA Condition min No load, switching stopped DCOUT = 1.8V – – 1.2 0.588 – 1.7 – – –1.0 – – 0.8 typ 0.5 1 – 0.6 – 2.0 0.5 0.4 – 10 60 1.2 max 1.2 – 3.0 0.612 500 2.3 1.0 0.8 1.0 – – 1.7 mA ms V V mA MHz Ω Ω µA mV mV A Unit *1. DIN1 to 7 and LDOUT1 to 2 outputs are disabled. *2. The time from when the DC/DC converter is enabled until the output is stabilized. *3. The DCOUT output voltage is determined by the external resistors R1 and R2, as given by the following equation. The SM8150A DC/DC converter controls the output such that the FB pin voltage remains at 0.6V. The DCOUT voltage is given for values of R1 and R2 in the table on the right, where R1 is a fixed 200kΩ resistance. DCOUT = 0.6 × (R1 + R2) R2 Example DCOUT [V] 1.200 1.502 R1 [kΩ] 200 200 200 200 200 200 200 R2 [kΩ] 200 133 100 63 60 54.5 50 FB SM8150 LX 2.2µH 8pF 2.2µF DCOUT R1 0.6V R2 1.800 2.505 2.600 2.802 3.000 SEIKO NPC CORPORATION —9 SM8150A Reference Data 100 80 Efficiency [%] IDD [mA] 60 40 20 0 1 10 100 1000 IDCO [mA] 1 0.8 0.6 0.4 0.2 0 2.7 3 3.3 3.6 3.9 4.2 4.5 VIN [V] Efficiency − Load current Current consumption (No load, switching stopped) 1.90 1.85 VDCO [V] VDCO [V] 4.5 IDCO = 300mA 1.90 1.85 1.80 1.75 1.70 3.0 3.3 3.6 3.9 4.2 0 100 200 300 400 500 VIN [V] IDCO [mA] 1.80 1.75 1.70 2.7 IDCO = 1mA Line regulation Load regulation IDCO = 300mA IDCO = 500mA SEIKO NPC CORPORATION —10 SM8150A 11-5. LDO VIN =3.6V, VEN = 2.8V, GND = PGND = 0V, Ta = 25°C unless otherwise noted. Rating Parameter Current consumption*1 VIN GND pin current Soft start time*2 Output voltage Output current IGND_LDO tSS_LDO VLDO ILDO VIN = 3V, VLDO (setting) = 3.3V ILDO = 100mA ILDO = 200mA ILDO = 300mA Pin Symbol IDD_LDO No load ILDO = 50mA, IGND_LDO = IDD_LDO − ILDO ILDO = 1mA ILDO = 1mA, VLDO ≤ VIN – 0.3V – – – – – – – 350 Condition min – – – typ 0.35 0.35 1 max 0.8 1.2 – mA mA ms Unit See “Output voltage table”. – 0.1 0.2 0.3 20 10 20 650 300 0.2 0.4 0.6 60 30 60 950 mA V V V mV mV mV mA Dropout voltage LDOUT1 to 2 Line Regulation VDROP ∆VOUT1 3.6V ≤ VIN ≤ 4.6V, VLDO (setting) = 3V, ILDO = 30mA VLDO (setting) = 3V, 5mA ≤ ILDO ≤ 100mA VLDO (setting) = 3V, 5mA ≤ ILDO ≤ 200mA Load Regulation ∆VOUT2 Overcurrent protection circuit operating current IOS *1. DIN1 to 7 and the DC/DC converter is disabled. *2. The time taken from when either of LDOUT1 to 2 is enabled until the output is stabilized. Output voltage table Setting 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 min 1.470 1.764 2.450 2.548 2.744 2.940 3.038 3.234 typ 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 max 1.530 1.836 2.550 2.652 2.856 3.060 3.162 3.366 unit V V V V V V V V SEIKO NPC CORPORATION —11 SM8150A Reference Data 10.00 Output noise [µV/ √ Hz] 0 -10 1.00 PSRR [dB] -20 -30 -40 -50 0.01 10 -60 100 1000 f [Hz] 10000 100000 10 100 1000 10000 100000 1000000 f [Hz] 0.10 Output noise VIN3: 2.2µF VREF: 0.1µF LDOUT: 2.2µF VIN = 3.6V VLDO = 1.8V ILDO = 10mA Ripple rejection VIN3: 0µF, 500mVp-p VREF: 0.1µF LDOUT: 2.2µF VIN = 3.6V VLDO = 1.8V ILDO = 10mA Step response 1 10 0 ∆VLDO [mV] -10 -20 -30 -40 0 50 100 150 200 250 300 ILDO [mA] VLDO = 1.8V VLDO = 2.8V Step response 2 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 2.7 VLDO = 1.8V ∆VLDO [mV] VLDO = 2.8V 3 3.3 3.6 3.9 4.2 4.5 VIN [V] Load regulation 0 -50 ∆VLDO [mV] -100 -150 -200 -250 -300 -350 0 100 200 300 ILDO [mA] IGND_LDO [mA] 0.8 0.6 0.4 0.2 0 0 1 Line regulation 100 200 ILDO [mA] 300 Dropout voltage (VLDO = 2.8V) GND pin current (VLDO = 1.8V) SEIKO NPC CORPORATION —12 SM8150A 12. FUNCTIONAL DESCRIPTION 12-1. Startup Method The SM8150A enters standby mode when the VIN supply is applied. After the VEN supply is applied, standby mode is released and operation commences when any one of the DIN1 to 4, DIN5 to 6, DIN7, LDOUT1, LDOUT2 outputs or the DC/DC converter is enabled. 12-2. Standby Mode In standby mode, all SM8150A circuit operation stops, reducing the current consumption. After the VIN supply is applied, the built-in power-ON reset circuit initializes the registers to their default values (see table 1) and the device enters standby mode. Also, when the VEN supply is turned OFF (0V), the registers are initialized to their default values and the device enters standby mode. However, when all the outputs are disabled (enable settings 1 and 2), the register values are stored and the device enters standby mode. 12-3. I2C Interface The individual SM8150A settings are set using an I2C interface. The SM8150A has a fixed 8-bit address (slave address) and the device must be addressed before inputting each data setting. The set data has an MSB first 8bit data structure. The first 3 bits select the register, and the next 5 bits are the write data. Each register is writeonly, and cannot be read. Transfer speed is in fast mode (400kbit/s). 12-3-1. Basic cycle SDA SCL Start condition Stop condition I2C start/stop condition Steps (1) to (4) represent the basic data input cycle. (1) Start condition (2) 1st byte (slave address input) (3) 2nd byte to nth byte (settings data input) (4) Stop condition Data transfer begins with the start condition, which is when the SDA input voltage changes from HIGH to LOW while the SCL input voltage is HIGH. Similarly, data transfer ends with the stop condition, which is when the SDA input voltage changes from LOW to HIGH while the SCL input voltage is HIGH. Immediately after each byte (8 bits) in steps (2) and (3), 1 clock cycle is used as an ACK (Acknowledge) cycle. The SM8150A acknowledges that it has recognized the slave address in the first byte by taking the SDA line LOWlevel output while the ACK clock cycle is HIGH. No signal is output if the slave address is not recognized. The second to nth bytes are always acknowledged by a LOW-level output bit, regardless of the received data content. The second and successive bytes are received and the corresponding setting is updated until the stop condition is input to the device. SEIKO NPC CORPORATION —13 SM8150A 12-3-2. 1st byte: slave address A6 0 A5 0 A4 0 A3 1 A2 0 A1 0 A0 1 R/W 0 12-3-3. 2nd byte to nth byte: data settings Data settings summary Mode select Function M3 MSB Main group LED dimmer setting (DIN1 to 4) Sub-group LED dimmer setting (DIN5 to 6) Torch LED dimmer setting (DIN7) Strobe LED dimmer setting (DIN7) LDO1 output voltage setting LDO2 output voltage setting Enable setting 2*2 (DC/DC converter) Enable setting 1*2 (DIN1 to 7, LDO1 to 2) 0 0 0 0 1 1 1 1 M2 Data 1 0 0 1 1 0 0 1 1 M1 Data 2 0 1 0 1 0 1 0 1 0*1 0*1 Buck Enable DIN1 to 4 Enable 0*1 0*1 0*1 DIN5 to 6 Enable 8-step voltage settings (see table 3) 0*1 DIN7 Enable 0*1 LDO1 Enable 0*1 LDO2 Enable 32-step dimming control (see table 2) D5 Data 3 D4 Data 4 Set data D3 Data 5 D2 Data 6 D1 LSB *1. Setting used by NPC for testing. Always input 0 for normal operation. *2. Enable settings are 1 for enabled, 0 for disabled. 12-3-4. Data input precautions The VIN supply is applied first, and data input should commence after an interval of ≥ 1ms has elapsed after the VEN supply is applied. VIN VEN 1ms Start ACK SDA 00010010 Slave address The LDO set voltage is changed using the following procedure. First, a) set to disabled, next b) change the voltage setting, and then c) set to enabled. The gap between steps a) and c) should be ≥ 0.3ms. Example ACK 00010010 Start Slave address ACK ACK ACK 111* * *0* LDO1 disable 10000111 LDO1 set (3.1V) 111* * *1* LDO1 enable Stop 0.3ms SEIKO NPC CORPORATION —14 SM8150A 12-4. Torch/Strobe Selecting The DIN7 pin LED drive current, when DIN7 is enabled, can be switched by the input voltage on the SBN pin. When SBN is HIGH, torch LED dimming is selected. When SBN is LOW, strobe LED dimming is selected. The SM8150A automatically switches the charge pump operating mode (×1, ×1.5, ×2 boost mode) to optimize the power consumption. However, when SBN is LOW the degree of boost is selected in the direction of increased boost only. That is, selecting in order of ×1 → ×1.5 → ×2 boost only, ×2 → ×1.5 → ×1 selecting does not occur. 12-5. Thermal Shutdown Circuit (TSD) If for whatever reason the chip temperature reaches approximately 170°C, the overtemperature protection thermal shutdown (TSD) circuit operates, stopping all output. Turn on occurs the IC cools by approximately 150°C. 12-6. Undervoltage Lockout Circuit (UVLO) If the VIN supply voltage falls below 2.45V, the supply undervoltage lockout (UVLO) circuit operates, initializing the registers to their default values and putting the device in standby mode. In this case, all data settings must be re-input. 12-7. Register Settings Table Table 1. Default settings (all disabled) Mode select Mode M3 MSB Main group LED dimmer setting (DIN1 to 4) Sub-group LED dimmer setting (DIN5 to 6) Torch LED dimmer setting (DIN7) Strobe LED dimmer setting (DIN7) LDO1 output voltage setting LDO2 output voltage setting Enable setting 2 (DC/DC converter) Enable setting 1 (DIN1 to 7, LDO1 to 2) 0 0 0 0 1 1 1 1 M2 Data 1 0 0 1 1 0 0 1 1 M1 Data 2 0 1 0 1 0 1 0 1 D5 Data 3 0 0 0 0 0 0 0 0 D4 Data 4 0 0 0 0 0 0 0 0 Set data D3 Data 5 0 0 0 0 0 0 0 0 D2 Data 6 0 0 0 0 0 0 0 0 D1 LSB 0 0 0 0 0 0 0 0 SEIKO NPC CORPORATION —15 SM8150A Table 2. LED drive current settings (not guaranteed values) D5 Data 3 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 D4 Data 4 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D3 Data 5 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D2 Data 6 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D1 LSB 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 DIN1 to 4 0 0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.5 7.3 8.1 8.9 9.7 10.5 11.3 12.1 12.9 13.7 14.5 15.3 16.1 16.9 17.7 18.5 19.4 20.2 21.0 21.8 22.6 23.4 24.2 25.0 DIN5 to 6 0 0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.5 7.3 8.1 8.9 9.7 10.5 11.3 12.1 12.9 13.7 14.5 15.3 16.1 16.9 17.7 18.5 19.4 20.2 21.0 21.8 22.6 23.4 24.2 25.0 DIN7 (Torch) 0 9.7 19.4 29.0 38.7 48.4 58.1 67.7 77.4 87.1 96.8 106 116 126 135 145 155 165 174 184 194 203 213 223 232 242 252 261 271 281 290 300 DIN7 (Strobe) 0 9.7 19.4 29.0 38.7 48.4 58.1 67.7 77.4 87.1 96.8 106 116 126 135 145 155 165 174 184 194 203 213 223 232 242 252 261 271 281 290 300 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Note. The values of the table 2 “LED drive current settings” are not guaranteed. The actual current values will spread around the values in the table. Especially the variation in 0.8mA setting is wide, and some of actual current may become 0mA. We recommend the usage that the minimum LED driving current value is set at 1.6mA at the brightness adjustment. Table 3. LDO output voltage settings (not guaranteed values) D5 Data 3 0 0 0 0 0 0 0 0 D4 Data 4 0 0 0 0 0 0 0 0 D3 Data 5 0 0 0 0 1 1 1 1 D2 Data 6 0 0 1 1 0 0 1 1 D1 LSB 0 1 0 1 0 1 0 1 LDOUT1 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 LDOUT2 1.5 1.8 2.5 2.6 2.8 3.0 3.1 3.3 Unit V V V V V V V V SEIKO NPC CORPORATION —16 SM8150A 13. TYPICAL APPLICATION CIRCUITS 1µF 1µF 3.6V C1P 4.7µF VIN1 PGND1 VIN2 PGND2 DIN2 2.2µF VIN3 DIN3 DIN4 DIN5 DIN6 Logic supply 0.1µF VEN DIN1 C1M C2P C2M VOUT 2.2µF 2.2µF SM8150A DIN7 IC 2 SCL SDA LDOUT1 2.2µF 2.2µF LDO1 output LDOUT2 LDO2 output Strobe ON/OFF SBN FB 8pF 100kΩ 200kΩ DCOUT (1.8V) 0.1µF VREF GND1 GND2 LX 2.2µH 2.2µF Note. A 2.2µF bypass capacitor should be connected between the VOUT and GND pins. A 4.7µF or greater capacitor value may cause an unstable output voltage condition. Any unused LED drive pins (DIN1 to DIN7) should be connected to GND. If the LDOUT1/2 or LX pins are not used, they should be left open circuit, and not connected to GND or power supply. SEIKO NPC CORPORATION —17 SM8150A 13-1. DIN1 to 3, DIN5, DIN7 (Strobe), and LDO1 1µF 1µF VIN "ON" 3.6V C1P C1M C2P C2M 4.7µF VIN1 PGND1 VIN2 PGND2 VIN3 DIN1 DIN2 DIN3 DIN4 DIN5 2.8V VEN 10kΩ 10kΩ 10kΩ VEN "ON" VOUT 2.2µF 1ms I 2 C address transfer 00010010 2.2µF Data transfer 00011111 Data transfer 00111010 Data transfer 01000000 Data transfer 01110000 Data transfer 10000111 DIN1 to 4 set to 25mA 2.2µF DIN5 to 6 set to 21mA Torch set to 0mA DIN6 Strobe set to 155mA SM8150A DIN7 LDO1 set to 3.3V 0.1µF I2 C SCL SDA H: Strobe OFF (Torch) L: Strobe ON LDOUT1 2.2µF LDO1 output Data transfer 11111010 Data transfer 111**1** DIN1 to 6, LDO1: Enable LDOUT2 LDOUT2: Leave open circuit. Do not connect to ground. DIN7: Enable (Waiting for SBN = Low) SBN SBN = Low, 200ms 200ms Strobe ON FB VREF 0.1µF GND1 GND2 VEN "OFF" LX LX: Leave open circuit. Do not connect to ground or power supply. Data transfer 111**0** DIN7: Disable LEDs OFF, LDO1 output stopped Standby mode I Unused pins • DIN4 and DIN6: Connect to GND. • FB: Connect to GND. • LDOUT2: Leave open circuit, do not connect to GND. • LX: Leave open circuit, do not connect to GND or power supply. Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10kΩ. The optimal resistance will vary with the actual mounting conditions. I SEIKO NPC CORPORATION —18 SM8150A 13-2. DIN1 to 2, DIN5 to 6, DIN7 (Torch), and DC/DC Converter 1µF 1µF VIN "ON" 3.6V C1P C1M C2P C2M 4.7µF VIN1 PGND1 VIN2 PGND2 VIN3 DIN1 DIN2 DIN3 DIN4 DIN5 2.8V VEN 10kΩ 10kΩ 10kΩ VEN "ON" VOUT 2.2µF 1ms I 2 C address transfer 00010010 2.2µF Data transfer 00011111 Data transfer 00110011 Data transfer 01000101 Data transfer 01100000 Data transfer 11111000 DIN1 to 4 set to 25mA 2.2µF DIN5 to 6 set to 15.3mA Torch set to 48.4mA DIN6 Strobe set to 0mA SM8150A DIN7 DIN1 to 6: Enable 0.1µF IC 2 SCL SDA LDOUT1 LDOUT1: Leave open circuit. Do not connect to ground. Data transfer 11010000 Data transfer 111**1** Data transfer 111**0** DC/DC converter: Enable LDOUT2 LDOUT2: Leave open circuit. Do not connect to ground. DIN7: Enable (Torch lighting) SBN FB 8pF VREF 0.1µF GND1 GND2 LX 2.2µH 2.2µF 100kΩ 200kΩ VEN "OFF" DIN7: Disable (Torch OFF) LEDs OFF, DC/DC converter stopped Standby mode DCOUT (1.8V) I Unused pins • DIN3 and DIN4: Connect to GND. • LDOUT1 and LDOUT2: Leave open circuit, do not connect to GND. Logic-level signal input pins Connect pull-up resistors to SCL, SDA, and SBN for pull-up to the VEN supply level. The resistances should be of the order of 1k to 10kΩ. The optimal resistance will vary with the actual mounting conditions. I SEIKO NPC CORPORATION —19 SM8150A 14. USAGE NOTES 14-1. External Capacitor Type The external capacitors connected to the SM8150A should be multi-layer ceramic capacitors, with low temperature coefficient X5R or X7R class (EIA standard) multi-layer ceramic capacitors recommended. Use of high temperature coefficient Z5U or Y5V class multi-layer ceramic capacitors may cause an unstable output voltage condition and should be avoided. Capacitor temperature coefficient 3-letter codes (EIA standard) Lower category temperature X = −55°C Y = −30°C Z = +10°C Upper category temperature 5 = +85°C 6 = +105°C 7 = +125°C 8 = +150°C Maximum deviation in capacitance from +25°C (0V DC) value F = ± 7.5% P = ± 10% R = ± 15% S = ± 22% T = +22%/−33% U = +22%/−56% V = +22%/−82% Selection : X5R characteristics 14-2. VIN Supply Input Capacitor In some cases, the printed board component layout may affect the stability of the output voltages. In such cases, the VIN power supply capacitor should be increased or an additional capacitor connected. 14-3. Mounting The package rear surface is metallic, and can be connected to the printed circuit board pattern as a heatsink. The connected pattern should be tied to GND level. Furthermore, use of a thermal via structure on the PCB or other technology should be used to provide sufficient heat dissipation. Use a printed circuit board with 4 or more layers. The PCB wiring ratio*1 should exceed 200%, where the wiring ratio is the sum total of printed wiring pattern surface area relative to the circuit board surface area. *1. Determining the wiring pattern ratio Example: 4-layer board with the same wiring pattern on 4 layers (left), where the wiring pattern surface area on each layer is represented by S1, and the non-wired surface area is represented by S2. The wiring pattern is connected directly to the IC, and each layer’s wiring pattern is connected to the IC by through holes. The circuit board surface area seen from above is S1 + S2. First, calculate the board surface area, here represented by S1 + S2. Next, calculate the wiring pattern surface area on each layer connected to the IC, represented here by S1. Calculate the total wiring pattern surface area for all 4 layers, in this example 4 × S1. Finally, calculate the wiring ratio percentage using the following equation: (Wiring ratio) = (Total wiring pattern surface area connected to the IC) / (PCB surface area) × 100. In this example, 4 × S1/(S1 + S2) × 100 [%], or a wiring ratio of 200% when S1 = S2. S1 S2 SEIKO NPC CORPORATION —20 SM8150A 15. PACKAGE DIMENSION (Unit: mm) Top view 4.0 ± 0.07 B A 4.0 ± 0.07 0.8 Bottom view 2.8 6 = 2.4 ± 0.05 0.3 ± 0.07 0.4 0.07 ± 0.03 0.05 S 0.4 16. FOOTPRINT PATTERN 4.6 ± 0.1 3.2 ± 0.1 0.4 × 6 = 2.4 0.21 ± 0.05 0.15 ± 0.03 0.7 ± 0.05 S 0.2 S 0.02 S A B 0.18 ± 0.05 φ 0.05 M S A B 0.3 0.4 × 6 = 2.4 3.2 ± 0.1 0.7 ± 0.1 0.3 2.6 SEIKO NPC CORPORATION —21 4.6 ± 0.1 2.6 2.8 C 0.3 SM8150A Please pay your attention to the following points at time of using the products shown in this document. The products shown in this document (hereinafter “Products”) are not intended to be used for the apparatus that exerts harmful influence on human lives due to the defects, failure or malfunction of the Products. Customers are requested to obtain prior written agreement for such use from SEIKO NPC CORPORATION (hereinafter “NPC”). Customers shall be solely responsible for, and indemnify and hold NPC free and harmless from, any and all claims, damages, losses, expenses or lawsuits, due to such use without such agreement. NPC reserves the right to change the specifications of the Products in order to improve the characteristic or reliability thereof. NPC makes no claim or warranty that the contents described in this document dose not infringe any intellectual property right or other similar right owned by third parties. Therefore, NPC shall not be responsible for such problems, even if the use is in accordance with the descriptions provided in this document. Any descriptions including applications, circuits, and the parameters of the Products in this document are for reference to use the Products, and shall not be guaranteed free from defect, inapplicability to the design for the mass-production products without further testing or modification. Customers are requested not to export or re-export, directly or indirectly, the Products to any country or any entity not in compliance with or in violation of the national export administration laws, treaties, orders and regulations. Customers are requested appropriately take steps to obtain required permissions or approvals from appropriate government agencies. SEIKO NPC CORPORATION 15-6, Nihombashi-kabutocho, Chuo-ku, Tokyo 103-0026, Japan Telephone: +81-3-6667-6601 Facsimile: +81-3-6667-6611 http://www.npc.co.jp/ Email: sales@npc.co.jp NC0506DE 2007.06 SEIKO NPC CORPORATION —22