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54F219

54F219

  • 厂商:

    NSC

  • 封装:

  • 描述:

    54F219 - 64-Bit Random Access Memory with TRI-STATEE Outputs - National Semiconductor

  • 数据手册
  • 价格&库存
54F219 数据手册
54F 74F219 64-Bit Random Access Memory with TRI-STATE Outputs November 1994 54F 74F219 64-Bit Random Access Memory with TRI-STATE Outputs General Description The ’F219 is a high-speed 64-bit RAM organized as a 16-word by 4-bit array Address inputs are buffered to minimize loading and are fully decoded on-chip The outputs are TRI-STATE and are in the high-impedance state whenever the Chip Select (CS) input is HIGH The outputs are active only in the Read mode This device is similar to the ’F189 but features non-inverting rather than inverting data outputs Features Y Y Y Y Y TRI-STATE outputs for data bus applications Buffered inputs minimize loading Address decoding on-chip Diode clamped inputs minimize ringing Available in SOIC (300 mil only) Commercial 74F219PC Military Package Number N16E Package Description 16-Lead (0 300 Wide) Molded Dual-In-Line 16-Lead Ceramic Dual-In-Line 16-Lead (0 300 Wide) Molded Small Outline JEDEC 16-Lead (0 300 Wide) Molded Small Outline EIAJ 16-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F219DL (Note 2) 74F219SC (Note 1) 74F219SJ (Note 1) 54F219FL (Note 2) 54F219LL (Note 2) J16A M16B M16D W16A E20A Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DLQB FLQB and LLQB Logic Symbol Connection Diagrams Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC TL F 9500–1 TL F 9500 – 2 TL F 9500 – 3 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9500 RRD-B30M105 Printed in U S A Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 10 10 20 10 10 10 10 150 40 (33 3) Input IIH IIL Output IOH IOL 20 mA b0 6 mA 20 mA b1 2 mA 20 mA b0 6 mA 20 mA b0 6 mA b 3 mA 24 mA (20 mA) A0 – A3 CS WE D0 – D3 O 0 – O3 Address Inputs Chip Select Input (Active LOW) Write Enable Input (Active LOW) Data Inputs TRI-STATE Data Outputs Function Table Inputs CS L L H WE L H X Operation Write Read Inhibit Condition of Outputs High Impedance True Stored Data High Impedance H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Block Diagram TL F 9500 – 4 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) Standard Output TRI-STATE Output b 65 C to a 150 C b 55 C to a 125 C b 55 C to a 175 C b 55 C to a 150 C b 0 5V to a 7 0V b 0 5V to a 7 0V b 30 mA to a 5 0 mA Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 100 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V b 0 5V to VCC b 0 5V to a 5 5V DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75 b0 6 b1 2 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH IOH e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA 25 24 25 24 27 27 05 05 20 0 50 100 70 250 50 V Min VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ ICC Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current V mA mA mA V mA mA mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max 0 0V Max IOL e 20 mA IOL e 24 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V (An WE Dn) VIN e 0 5V (CS) VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V Output Leakage Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test Power Supply Current 37 b 60 50 b 50 b 150 500 55 3 AC Electrical Characteristics 74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ Access Time HIGH or LOW An to On Access Time HIGH or LOW CS to On Disable Time HIGH or LOW CS to On Write Recovery Time HIGH or LOW WE to On Disable Time HIGH or LOW WE to On 10 0 80 35 50 20 30 65 65 40 50 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 18 5 13 5 60 90 40 55 20 0 11 0 70 90 Max 26 0 19 0 85 13 0 60 80 28 0 15 5 10 0 13 0 54F TA e a 100 C VCC e Mil CL e 50 pF Min 90 80 35 50 20 25 65 65 35 50 Max 32 0 23 0 10 5 15 0 80 10 0 37 5 17 5 12 0 15 0 74F TA VCC e Com CL e 50 pF Min 10 0 80 35 50 20 30 65 65 40 50 Max 27 0 20 0 95 14 0 70 90 29 0 16 5 11 0 14 0 ns Units ns ns AC Operating Requirements 74F Symbol Parameter TA e a 25 C VCC e a 5 0V Min ts(H) ts(L) th(H) th(L) ts(H) ts(L) th(H) th(L) ts(L) th(L) tw(L) Setup Time HIGH or LOW An to WE Hold Time HIGH or LOW An to WE Setup Time HIGH or LOW Dn to WE Hold Time HIGH or LOW Dn to WE Setup Time LOW CS to WE Hold Time LOW CS to WE WE Pulse Width LOW 0 0 20 20 10 0 10 0 0 0 0 60 60 Max 54F TA e a 100 C VCC e Mil Min 0 0 20 20 11 0 11 0 20 20 0 75 15 0 Max 74F TA VCC e Com Min 0 0 20 20 10 0 10 0 0 0 0 ns 60 60 ns Max Units ns ns 4 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 219 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) L e Military (b55 C to a 100 C) Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 16-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M16B 6 Physical Dimensions inches (millimeters) (Continued) 16-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M16D 16-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N16E 7 54F 74F219 64-Bit Random Access Memory with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flatpak (F) NS Package Number W16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Europe Fax (a49) 0-180-530 85 86 Email cnjwge tevm2 nsc com Deutsch Tel (a49) 0-180-530 85 85 English Tel (a49) 0-180-532 78 32 Fran ais Tel (a49) 0-180-532 93 58 Italiano Tel (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductor Japan Ltd Tel 81-043-299-2309 Fax 81-043-299-2408 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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