74F244PC

54F 74F240  54F 74F241  54F 74F244 Octal Buffers Line Drivers with TRI-STATE Outputs May 1995 54F 74F240  54F 74F241  54F 74F244 Octal Buffers Line Drivers with TRI-STATE Outputs General Description The ’F240 ’F241 and ’F244 are octal buffers and line drivers designed to be employed as memory and address drivers clock drivers and bus-oriented transmitters receivers which provide improved PC and board density Features Y Y Y Y Y TRI-STATE outputs drive bus lines or buffer memory address registers Outputs sink 64 mA (48 mA mil) 12 mA source current Input clamp diodes limit high-speed termination effects Guaranteed 4000V minimum ESD protection Commercial 74F240PC Military Package Number N20A Package Description 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Molded Shrink Small Outline EIAJ Type II 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F240DM (Note 2) 74F240SC (Note 1) 74F240SJ (Note 1) 54F240FM (Note 2) 54F240LM (Note 2) 74F241PC 54F241DM (Note 2) 74F241SC (Note 1) 74F241SJ (Note 1) 54F241FM (Note 2) 54F241LM (Note 2) 74F244PC 54F244DM (Note 2) 74F244SC (Note 1) 74F244SJ (Note 1) 74F244MSA (Note 1) 54F244FM (Note 2) 54F244LM (Note 2) J20A M20B M20D W20A E20A N20A J20A M20B M20D W20A E20A N20A J20A M20B M20D MSA20 W20A E20A Note 1 Devices also available in 13 reel Use Suffix e SCX SJX and MSAX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9501 RRD-B30M75 Printed in U S A Connection Diagrams Pin Assignment for LCC ’F240 ’F241 ’F244 TL F 9501 – 6 TL F 9501–2 TL F 9501 – 4 Pin Assignment for DIP SOIC SSOP and Flatpak TL F 9501–1 TL F 9501 – 3 TL F 9501 – 5 Logic Symbols IEEE IEC ’F240 IEEE IEC ’F241 IEEE IEC ’F244 TL F 9501–7 TL F 9501 – 8 TL F 9501 – 9 2 Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 1 0 1 667 1 0 1 667 1 0 1 667 1 0 2 667 600 106 6 (80) Input IIH IIL Output IOH IOL 20 mA b1 mA 20 mA b1 mA 20 mA b1 mA 20 mA b1 6 mA b 12 mA 64 mA (48 mA) OE1 OE2 OE2 I 0 – I7 I0 – I 7 O0 – O7 O0 – O7 TRI-STATE Output Enable Input (Active LOW) TRI-STATE Output Enable Input (Active HIGH) Inputs (’F240) Inputs (’F241 ’F244) Outputs Worst-case ’F240 enabled ’F241 ’F244 disabled Truth Tables ’F240 OE1 H L L D1n X H L O1n Z L H ’F241 OE1 H L L D1n X H L O1n Z H L OE2 L H H D2n X H L O2n Z H L OE2 H L L D2n X H L O2n Z L H OE1 H L L D1n X H L O1n Z H L ’F244 OE2 H L L D2n X H L O2n Z H L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance 3 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150 Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V C C C C b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75 b1 0 b1 6 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA 24 20 24 20 27 0 55 0 55 20 0 50 100 70 250 50 V Min VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current V mA mA mA V mA mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max 0 0V IOL e 48 mA IOL e 64 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V (OE1 OE2 OE2 Dn (’F240)) VIN e 0 5V (Dn (’F241 ’F244)) VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V Output Leakage Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test b 100 50 b 50 b 225 500 4 DC Electrical Characteristics Symbol ICCH ICCL ICCZ ICCH ICCL ICCZ Parameter (Continued) 54F 74F Min Typ 19 50 42 40 60 60 Max 29 75 63 60 90 90 mA mA mA mA mA mA Max Max Max Max Max Max VO e HIGH VO e LOW VO e HIGH Z VO e HIGH VO e LOW VO e HIGH Z Units VCC Conditions Power Supply Current (’F240) Power Supply Current (’F240) Power Supply Current (’F240) Power Supply Current (’F241 ’F244) Power Supply Current (’F241 ’F244) Power Supply Current (’F241 ’F244) AC Electrical Characteristics 74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay Data to Output (’F240) Output Enable Time (’F240) Output Disable Time (’F240) Propagation Delay Data to Output (’F241 ’F244) Output Enable Time (’F241 ’F244) Output Disable Time (’F241 ’F244) 30 20 20 40 20 20 25 25 20 20 20 20 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 51 35 35 69 40 60 40 40 43 54 45 45 Max 70 47 47 90 53 80 52 52 57 70 60 60 54F TA VCC e Mil CL e 50 pF Min 30 20 20 40 20 20 20 20 20 20 20 20 Max 90 60 65 10 5 65 12 5 65 70 70 85 70 75 74F TA VCC e Com CL e 50 pF Min 30 20 20 40 20 20 25 25 20 20 20 20 Max 80 57 57 10 0 63 95 62 65 67 80 70 70 ns ns Units ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercia 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC MSA e Shrink Small Outline Package (EIAJ SSOP) (’244 only) SJ e Small Outline SOIC EIAJ 240 241 244 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) NOTE Not required for MSA package code 5 6 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 7 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M20B 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M20D 8 Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline EIAJ Type II (MSA) NS Package Number MSA20 20-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 9 54F 74F240  54F 74F241  54F 74F244 Octal Buffers Line Drivers with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications