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LM308AM

LM308AM

  • 厂商:

    NSC

  • 封装:

  • 描述:

    LM308AM - Operational Amplifiers - National Semiconductor

  • 数据手册
  • 价格&库存
LM308AM 数据手册
LM108A LM208A LM308A Operational Amplifiers May 1989 LM108A LM208A LM308A Operational Amplifiers General Description The LM108 LM108A series are precision operational amplifiers having specifications about a factor of ten better than FET amplifiers over their operating temperature range In addition to low input currents these devices have extremely low offset voltage making it possible to eliminate offset adjustments in most cases and obtain performance approaching chopper stabilized amplifiers The devices operate with supply voltages from g 2V to g 18V and have sufficient supply rejection to use unregulated supplies Although the circuit is interchangeable with and uses the same compensation as the LM101A an alternate compensation scheme can be used to make it particularly insensitive to power supply noise and to make supply bypass capacitors unnecessary The low current error of the LM108A series makes possible many designs that are not practical with conventional amplifiers In fact it operates from 10 MX source resistances introducing less error than devices like the 709 with 10 kX sources Integrators with drifts less than 500 mV sec and analog time delays in excess of one hour can be made using capacitors no larger than 1 mF The LM208A is identical to the LM108A except that the LM208A has its performance guaranteed over a b25 C to a 85 C temperature range instead of b 55 C to a 125 C The LM308A devices have slightly-relaxed specifications and performances over a 0 C to a 70 C temperature range Features Y Y Y Y Y Offset voltage guaranteed less than 0 5 mV Maximum input bias current of 3 0 nA over temperature Offset current less than 400 pA over temperature Supply current of only 300 mA even in saturation Guaranteed 5 mV C drift Compensation Circuits Standard Compensation Circuit Alternate Frequency Compensation Cf t R1 CO R1 a R2 CO e 30 pF TL H 7759 – 1 Improves rejection of power supply noise by a factor of ten TL H 7759 – 2 Bandwidth and slew rate are proportional to 1 Cf Bandwidth and slew rate are proportional to 1 Cs Feedforward Compensation TL H 7759 – 3 C1995 National Semiconductor Corporation TL H 7759 RRD-B30M115 Printed in U S A LM108A LM208A Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications (Note 5) g 20V Supply Voltage Power Dissipation (Note 1) 500 mW g 10 mA Differential Input Current (Note 2) g 15V Input Voltage (Note 3) Output Short-Circuit Duration Continuous Operating Free Air Temperature Range b 55 C to a 125 C LM108A b 25 C to a 85 C LM208A b 65 C to a 150 C Storage Temperature Range Lead Temperature (Soldering 10 sec ) (DIP) 260 C Soldering Information Dual-In-Line Package Soldering (10 sec ) Small Outline Package Vapor Phase (60 sec ) Infrared (15 sec ) 260 C 215 C 220 C See An-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount devices ESD Tolerance (Note 6) 2000V Electrical Characteristics (Note 4) Parameter Input Offset Voltage Input Offset Current Input Bias Current Input Resistance Supply Current Large Signal Voltage Gain Input Offset Voltage Average Temperature Coefficient of Input Offset Voltage Input Offset Current Average Temperature Coefficient of Input Offset Current Input Bias Current Supply Current Large Signal Voltage Gain Output Voltage Swing Input Voltage Range Common Mode Rejection Ratio Supply Voltage Rejection Ratio TA e 125 C VS e g 15V VOUT e g 10V RL t 10 kX VS e g 15V RL e 10 kX VS e g 15V 40 g 13 g 13 5 g 14 Conditions TA e 25 C TA e 25 C TA e 25 C TA e 25 C TA e 25 C TA e 25 C VS e g 15V VOUT e g 10V RL t 10 kX Min Typ 03 0 05 08 Max 05 02 20 Units mV nA nA MX 30 70 03 06 mA V mV 80 300 10 10 50 04 05 25 30 0 15 04 mV mV C nA pA C nA mA V mV V V 96 96 110 110 dB dB Note 1 The maximum junction temperature of the LM108A is 150 C while that of the LM208A is 100 C For operating at elevated temperatures devices in the H08 package must be derated based on a thermal resistance of 160 C W junction to ambient or 20 C W junction to case The thermal resistance of the dual-in-line package is 100 C W junction to ambient Note 2 The inputs are shunted with back-to-back diodes for overvoltage protection Therefore excessive current will flow if a differential input voltage in excess of 1V is applied between the inputs unless some limiting resistance is used Note 3 For supply voltages less than g 15V the absolute maximum input voltage is equal to the supply voltage Note 4 These specifications apply for g 5V s VS s g 20V and b 55 C s TA s 125 C unless otherwise specified With the LM208A however all temperature specifications are limited to b 25 C s TA s 85 C Note 5 Refer to RETS108AX for LM108AH and LM108AJ-8 military specifications Note 6 Human body model 1 5 kX in series with 100 pF 2 LM308A Absolute Maximum Ratings If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage Power Dissipation (Note 1) Differential Input Current (Note 2) Input Voltage (Note 3) Output Short-Circuit Duration Operating Temperature Range Storage Temperature Range H-Package Lead Temperature (Soldering 10 sec ) g 18V Lead Temperature (Soldering 10 sec ) (DIP) Soldering Information Dual-In-Line Package Soldering (10 sec ) Small Outline Package Vapor phase (60 sec ) Infrared (15 sec ) 260 C 260 C 500 mW g 10 mA g 15V Continuous 0 C to a 70 C b 65 C to a 150 C 300 C 215 C 220 C See An-450 ‘‘Surface Mounting Methods and Their Effect on Product Reliability’’ for other methods of soldering surface mount devices ESD rating to be determined Electrical Characteristics (Note 4) Parameter Input Offset Voltage Input Offset Current Input Bias Current Input Resistance Supply Current Large Signal Voltage Gain Input Offset Voltage Average Temperature Coefficient of Input Offset Voltage Input Offset Current Average Temperature Coefficient of Input Offset Current Input Bias Current Large Signal Voltage Gain Output Voltage Swing Input Voltage Range Common Mode Rejection Ratio Supply Voltage Rejection Ratio VS e g 15V VOUT e g 10V RL t 10 kX VS e g 15V RL e 10 kX VS e g 15V 60 g 13 g 14 g 14 Conditions TA e 25 C TA e 25 C TA e 25 C TA e 25 C TA e 25 C VS e g 15V TA e 25 C VS e g 15V VOUT e g 10V RL t 10 kX VS e g 15V RS e 100X VS e g 15V RS e 100X Min Typ 03 02 15 Max 05 1 7 Units mV nA nA MX 10 40 03 08 mA V mV 80 300 0 73 20 50 15 20 10 10 mV mV C nA pA C nA V mV V V 96 96 110 110 dB dB Note 1 The maximum junction temperature of the LM308A is 85 C For operating at elevated temperatures devices in the H08 package must be derated based on a thermal resistance of 160 C W junction to ambient or 20 C W junction to case The thermal resistance of the dual-in-line package is 100 C W junction to ambient Note 2 The inputs are shunted with back-to-back diodes for overvoltage protection Therefore excessive current will flow if a differential input voltage in excess of 1V is applied between the inputs unless some limiting resistance is used Note 3 For supply voltages less than g 15V the absolute maximum input voltage is equal to the supply voltage Note 4 These specifications apply for g 5V s VS s g 15V and 0 C s TA s a 70 C unless otherwise specified 3 Typical Applications Sample and Hold Teflon polyethylene or polycarbonate dielectric capacitor Worst case drift less than 2 5 mV sec TL H 7759 – 4 High Speed Amplifier with Low Drift and Low Input Current TL H 7759 – 5 4 Application Hints A very low drift amplifier poses some uncommon application and testing problems Many sources of error can cause the apparent circuit drift to be much higher than would be predicted Thermocouple effects caused by temperature gradient across dissimilar metals are perhaps the worst offenders Only a few degrees gradient can cause hundreds of microvolts of error The two places this shows up generally are the package-to-printed circuit board interface and temperature gradients across resistors Keeping package leads short and the two input leads close together helps greatly Resistor choice as well as physical placement is important for minimizing thermocouple effects Carbon oxide film and some metal film resistors can cause large thermocouple errors Wirewound resistors of evanohm or manganin are best since they only generate about 2 mV C referenced to copper Of course keeping the resistor ends at the same temperature is important Generally shielding a low drift stage electrically and thermally will yield good results Resistors can cause other errors besides gradient generated voltages If the gain setting resistors do not track with temperature a gain error will result For example a gain of 1000 amplifier with a constant 10 mV input will have a 10V output If the resistors mistrack by 0 5% over the operating temperature range the error at the output is 50 mV Referred to input this is a 50 mV error All of the gain fixing resistor should be the same material Testing low drift amplifiers is also difficult Standard drift testing technique such as heating the device in an oven and having the leads available through a connector thermoprobe or the soldering iron method do not work Thermal gradients cause much greater errors than the amplifier drift Coupling microvolt signal through connectors is especially bad since the temperature difference across the connector can be 50 C or more The device under test along with the gain setting resistor should be isothermal Schematic Diagram TL H 7759 – 6 5 Connection Diagrams Metal Can Package Dual-In-Line Package TL H 7759–7 Pin 4 is connected to the case Unused pin (no internal connection) to allow for input anti-leakage guard ring on printed circuit board layout TL H 7759 – 8 Top View Order Number LM108AJ-8 LM208AJ-8 LM308AJ-8 LM308AM or LM308AN See NS Package Number J08A M08A or N08E Order Number LM108AH LM208AH or LM208AH See NS Package Number H08C Physical Dimensions inches (millimeters) Metal Can Package (H) Order Number LM108AH LM208AH or LM308AH NS Package Number H08C 6 Physical Dimensions inches (millimeters) (Continued) Ceramic Dual-In-Line Package (J) Order Number LM108AJ-8 LM208AJ-8 or LM308AJ-8 NS Package Number J08A S O Package (M) Order Number LM308AM NS Package Number M08A 7 LM108A LM208A LM308A Operational Amplifiers Physical Dimensions inches (millimeters) (Continued) Molded Dual-In-Line Package (N) Order Number LM308AN NS Package Number N08E LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Europe Fax (a49) 0-180-530 85 86 Email cnjwge tevm2 nsc com Deutsch Tel (a49) 0-180-530 85 85 English Tel (a49) 0-180-532 78 32 Fran ais Tel (a49) 0-180-532 93 58 Italiano Tel (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductor Japan Ltd Tel 81-043-299-2309 Fax 81-043-299-2408 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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