LM4830N

LM4830 Two-Way Audio Amplification System with Volume Control January 1999 LM4830 Two-Way Audio Amplification System with Volume Control General Description The LM4830 is an integrated solution for two-way audio amplification. It contains a bridge-connected audio power amplifier capable of delivering 1W of continuous average power to an 8Ω load with less than 1% THD from a 5V power supply. It also has the capability of driving 100 mW into a single-ended 32Ω impedance for headset operation. There is a 30 dB attenuator in front of a bridged power amplifier with 6 dB of gain. The attenuation is controlled through 4 bits of parallel digital control; 15 steps of 2 dB each. The device also contains a microphone preamp with two selectable inputs. Mic2 is selected when HS is high and A1 is in single-ended mode. Mic1 is selected when HS is low and A1 is in bridged mode. This configuration is optimum for switching between an internal system speaker and external headset with microphone. The device also incorporates a buffer used for driving capacitive loads. The LM4830 also provides a low-current consumption shutdown mode making it optimally suited for low-power portable systems. In addition, the device has an internal thermal shutdown protection mechanism. Key Specifications n n n n THD at 1W cont. avg PO into 8Ω: 1% (max) Instantaneous peak output power: 1.4W Shutdown current: 0.5 µA (typ) Supply voltage range: 2.7V ≤ V DD ≤ 5.5V Features 4-bit digital control for 30 dB of volume attenuation Two selectable microphone inputs High performance microphone preamp Extra buffer for driving long cables No bootstrap capacitors or snubber circuits are necessary n Small Outline (SO) packaging n Thermal shutdown protection circuitry n n n n n Applications n n n n n Hands-free phone systems Mobile phone accessories Desktop conference phones Portable computers Teleconference computer applications Connection Diagram Dual-In-Line and Small Outline Packages DS012677-2 Top View Order Number LM4830M See NS Package Number M24B for SO Order Number LM4830N See NS Package Number N24A for DIP © 1999 National Semiconductor Corporation DS012677 www.national.com Typical Application DS012677-1 FIGURE 1. Typical Application Circuit www.national.com 2 Absolute Maximum Ratings (Note 2) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 3) ESD Susceptibility (Note 4) ESD Susceptibility (Note 5) Junction Temperature Soldering Information Small Outline Package Vapor Phase (60 sec.) 6.0V −65˚C to +150˚C −0.3V to VDD + 0.3V Internally Limited 2000V 250V 150˚C Infrared (15 sec.) 220˚C See AN-450 “Surface Mounting and their Effects on Product Reliability” for other methods of soldering surface mount devices. Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX Supply Voltage θJC (typ) — M24B θJA (typ) — M24B θJC (typ) — N24A θJA (typ) — N24A −40˚C ≤ TA ≤ 85˚C 2.7V ≤ VDD ≤ 5.5V 32˚C/W 79˚C/W 21˚C/W 61˚C/W 215˚C Electrical Characteristics (Notes 1, 2) The following specifications apply for VDD = 5V, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4830 Typical (Note 6) POWER AMPLIFIER, A1 IDD Quiescent Power Supply Current VO = 0V, IO = 0A, RL = ∞ 11.0 Bridged RL = 8Ω HS = 5V, SD = 0V, VO1 On Only HS = 5V, SD = 5V, IC Off VIN = 0V IHF-A Weighting Filter, RS = 25Ω Bridged Output, VO1–VO2, RL = 8Ω Single-Ended Output, VO1, RL = 32Ω THD = 1% (max); f = 1 kHz, RL = 8Ω THD+N = 10%; f = 1 kHz, RL = 8Ω THD+N = 10%; f = 1 kHz, RL = 4Ω f = 1 kHz, Attenuation @ 0 dB PO = 1.5W, RL = 4Ω PO = 1W, RL = 8Ω VO1 On Only, VO = 60 mV, RL = 32Ω Attenuation Step Size Error Absolute Attenuation RIN VIH VIL RIN VOS eIN THD Power Amp Input Resistance High Input Voltage Low Input Voltage Mic1 and Mic2 Input Resistance Output Offset Voltage Input Noise Total Harmonic Distortion VIN = 0V IHF-A Weighting Filter, RS = 25Ω AVCL = 100, VIN = 10 mVrms, f = 1 kHz AVCL = −1, PO = 50 mW, f = 1 kHz, RL = 32Ω (Refer to Figure 2 ) CMOS Compatible Only CMOS Compatible Only 21.5 2.0 1.3 0.06 0.02 10.0 0 dB to −30 dB Attenuation @ 0 dB Attenuation @ −30 dB DIGITAL INPUTS 4.5 0.5 V V kΩ mV µV (max) % 11.4 7.9 0.5 0.7 30 16 1.15 1.4 2 0.2 0.2 0.06 1.0 2.0 50.0 5.8 20.0 mA (min) mA (max) mA mA µA (max) mV (max) µV µV W (min) W W % % % dB dB dB kΩ Limit (Note 7) Units (Limits) ISD VOS eIN Shutdown Current Output Offset Voltage Input Noise PO Output Power, Bridged THD Total Harmonic Distortion ± 0.5 ± 0.5 ± 1.0 40 PREAMP, A2 3 www.national.com Electrical Characteristics (Notes 1, 2) Symbol Parameter (Continued) The following specifications apply for VDD = 5V, unless otherwise specified. Limits apply for TA = 25˚C. Conditions LM4830 Typical (Note 6) PREAMP, A2 Xtalk PSRR RIN VOS eIN THD Xtalk Crosstalk Power Supply Rejection Ratio Buffer Input Resistance Output Offset Voltage Input Noise Total Harmonic Distortion Crosstalk VIN = 0V IHF-A Weighting Filter, RS = 25Ω PO = 50 mW, f = 1 kHz, RL = 32Ω Power Amp: PO = 1W, RL = 8Ω, f = 1 kHz AVCL = 100, Power Amp: PO = 1W, R L = 8Ω, f = 1 kHz VDDAC = 0.5 VPP, f = 1 kHz −72 60 17 2.0 5.8 0.5 −76 dB dB kΩ mV µV % dB Limit (Note 7) Units (Limits) MICROPHONE BUFFER, A3 Note 1: All voltages are measured with respect to the ground pins (Pins 2, 15, and 24), unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θ JA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX = (TJMAX − T A)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4830M, TJMAX = +150˚C, and the typical junction-to-ambient thermal resistance, when board mounted, is 79˚C/W. Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Note 5: Machine model, 200 pF–240 pF discharged through all pins. Note 6: Typicals are measured at 25˚C and represent the parametric norm. Note 7: Limits are guarantees that all parts are tested in production to meet the stated values. Timing Diagram DS012677-3 www.national.com 4 Computer Application Circuit DS012677-4 FIGURE 2. 5 www.national.com Typical Performance Characteristics Output Power vs Supply Voltage (Power Amp-Bridged) Frequency Response vs Attenuation Level Wideband Noise Floor DS012677-6 DS012677-5 DS012677-7 Output Power vs Supply Voltage Output Power vs Supply Voltage Output Power vs Supply Voltage DS012677-8 DS012677-9 DS012677-10 THD + N vs Output Power THD + N vs Output Power THD + N vs Output Power DS012677-11 DS012677-12 DS012677-13 THD + N vs Output Power THD + N vs Output Power THD + N vs Output Power DS012677-14 DS012677-15 DS012677-16 www.national.com 6 Typical Performance Characteristics THD + N vs Output Power (Power Amp-Bridged) (Continued) THD + N vs Output Power THD + N vs Output Power DS012677-17 DS012677-18 DS012677-19 THD + N vs Output Power THD + N vs Output Power THD + N vs Output Power DS012677-20 DS012677-21 DS012677-22 THD + N vs Output Power THD + N vs Frequency THD + N vs Frequency DS012677-23 DS012677-24 DS012677-25 THD + N vs Output Power THD + N vs Output Power THD + N vs Output Power DS012677-26 DS012677-27 DS012677-28 7 www.national.com Typical Performance Characteristics THD + N vs Output Power (Power Amp-Bridged) (Continued) Power Amp Crosstalk to Preamp and Buffer Power Amp Crosstalk to Preamp DS012677-29 DS012677-30 DS012677-31 Wideband Noise Floor Wideband Noise Floor Buffer Frequency Response DS012677-32 DS012677-33 DS012677-34 Output Attenuation in Shutdown Mode Power Dissipation vs Output Power Power Derating Curve DS012677-37 DS012677-35 DS012677-36 Supply Current vs Supply Voltage Supply Current vs Temperature Power Supply Rejection Ratio DS012677-38 DS012677-39 DS012677-40 www.national.com 8 Application Information POWER AMPLIFIER HANDSFREE MODE As shown in Figure 1, amplifier A1 can be used in one of two modes, bridged output or single-ended output. This IC was intended to be used in systems requiring both internal speaker drive and external mono-headphone drive capability. Headphones generally have a much higher impedance than that of speakers since headphones don’t require as much output power. This also allows headphones to be driven single-endedly. Shown in Figure 1, the output can be automatically switched from bridged speaker drive to single-ended headphone drive using a control pin in the headphone jack that is tied to the Headset (HS) pin, pin 3. When the voltage at the HS pin input changes from 0V to 5V, VO2 of the bridged amplifier output is put into high impedance. This allows the permanently connected internal speaker of the system to be disabled when a headphone is plugged into the headphone jack. Output VO1 then drives the headphone single-endedly through the output coupling cap, CC. CC should be chosen to allow the full audio bandwidth to be amplified. Since CC and R L create a high-pass filter, CC must be big enough to allow frequencies down to 20 Hz to be amplified. The following equation should be used for proper component selection. CC = 1/(2π(20 Hz)(R L)) where 16Ω ≤ RL ≤ 600Ω (1) As usual, the output drive limitations are the maximum supply voltage swing, current drive capability, and power dissipation. In bridged-output drive mode, the power amplifier will drive 4Ω or 8Ω with normal music signals over time. However, trying to put a sinewave through the amplifier at the worst case power dissipation point could cause the amplifier to go into thermal shutdown. In single-ended drive mode, the amplifier is intended to drive 32Ω headphones. It will drive lower impedances with the limitations of voltage swing and current drive capability. The result of driving lower impedance loads single-endedly is lower achievable output power. Headset and Shutdown Pin Table HS Pin Low High X X — “Don’t Care” Even with the large internal power dissipation created by the bridged amplifier, the LM4830 does not require heatsinking over a large range of ambient temperatures. Using Equation 2, assuming a 5V power supply and a 8Ω load, the maximum power dissipation point is 633 mW. PDMAX = (TJMAX − TA)/θJA (3) For the LM4830 surface mount package, θJA = 79˚C/W and TJMAX = 150˚C. Depending on the ambient temperature, TA, of the system surroundings, Equation 3 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 2 is greater than that of Equation 3, then either the supply voltage must be decreased, the load impedance increased, or the ambient temperature reduced. For the typical application of a 5V power supply, with a bridged 8Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 100˚C provided that device operation is around the maximum power dissipation point. The average power dissipation caused by typical music material played at a reasonable level is generally lower than the maximum power dissipation point. Refer to the Typical Performance Characteristics curves for power dissipation information for lower output powers. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. The capacitor location on both the half-supply bypass and power supply pins should be as close to the device as possible. The effect of a larger half-supply bypass capacitor is improved low frequency PSRR due to increased half-supply stability. Typical applications employ a 5V regulator with 10 µF and a 0.1 µF bypass capacitors which aid in supply stability, but do not eliminate the need for bypassing the supply nodes of the LM4830. The selection of bypass capacitors, especially Cb, is thus dependent upon desired low frequency PSRR, system cost, and size constraints. GROUNDING In order to achieve the best possible performance, there are certain grounding techniques that should be followed. All input reference grounds should be tied with their respective source grounds and brought back to the power supply ground separately from the output load ground returns. Those input grounds should also be tied in with the half-supply bypass ground, pin 16. As an example, the AC input ground reference for the power amplifier, A1, is VIN+, pin 7. This ground should be tied as close as possible to the Bypass ground (pin 16), as shown in Figure 1. In order to tie in the signal source ground, the audio jack ground on VIN− should also be tied to the Bypass ground. As stated above, the ground returns for the output loads should be brought back to the supply ground individually. This will keep large signal currents on those ground lines from interfering with the stable AC input ground references. In addition, the signal ground reference for the preamp, A2, (the ground end of capacitor CI) should be tied together with the mic inputs’ signal ground reference from the microphone. LAYOUT ISSUES As stated in the Grounding section, placement of ground return lines is imperative in maintaining the highest level of system performance. It is not only important to route the correct ground return lines together, but also equally important to be aware of where those ground return lines are routed in conjunction with each other. As an example, the output load 9 www.national.com SD Pin Low Low High IC Operation All Outputs On 1/2 A1 On (VO1 On Only) Whole IC Off Microphone MIC1 On MIC2 On NA NA — Not Applicable POWER DISSIPATION Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to ensure a successful design. Equation 2 states the maximum power dissipation point for a bridged amplifier operating at a given supply voltage and driving a specified output load. PDMAX = 4(VDD) 2/(2π2 RL) (2) Although the LM4830 has three amplifiers in the package, the bridged amplifier produces the majority of the power dissipation because it supplies the largest amount of output power. If each of the amplifiers in the LM4830 were of the same power level, each of their power dissipations would need to be taken into account. However, this is not the case and the bridged power amplifier is the only major power dissipation contributor. Application Information (Continued) ground return lines should not be tied together with AC input reference ground return lines. In addition, the layout of these ground lines should be physically located as far as reasonably possible from each other so that large signal coupling cannot occur. To further exemplify this point, the outputs and output load returns for the power amplifier, which have volts of signal on them, should be physically isolated from the sensitive inputs and AC input ground returns associated with the preamp. It is easy for large signals to couple into the sensitive low voltage microphone preamp inputs. TABLE 1. 4-Bit Attenuation Control LD Pin 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 Input Bits msb: lsb D3–D0 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 XXXX 0 dB −2 dB −4 dB −6 dB −8 dB −10 dB −12 dB −14 dB −16 dB −18 dB −20 dB −22 dB −24 dB −26 dB −28 dB −30 dB NC Attenuation Level (dB) Bridge Amplifier Gain (dB) 6 dB 4 dB 2 dB 0 dB −2 dB −4 dB −6 dB −8 dB −10 dB −12 dB −14 dB −16 dB −18 dB −20 dB −22 dB −24 dB NC SELECTION OF EXTERNAL CAPACITORS The IC’s low frequency power supply rejection can be improved by using a larger bypass capacitor, Cb. By increasing this capacitor value, the THD performance at low frequencies will also be improved. For cost sensitive designs, 0.1 µF is recommended, however, for best performance at least 1 µF should be used. The selection of the microphone input coupling capacitors should be based on desired low frequency coupling. Since the input resistance for those inputs is around 20 kΩ, the coupling cap should be 0.47 µF for 17 Hz coupling or 0.047 µF for 170 Hz coupling. Similarly, the selection of the power amplifier input coupling capacitors should be based on an input resistance of 40 kΩ, so for flatband 20 Hz reproduction, 0.47 µF caps or larger should be used. VOICE-BAND DESIGN The preamp on this IC is intended to be used for microphone amplification. Depending upon the frequency response of the microphone, the preamplifier’s response can be configured to fit the microphone. Simple capacitors can be used to bandwidth limit the frequency response of the preamplifier and improve the system’s performance. Once the gain of the preamp is chosen, the values for the resistors and capacitors can be selected based upon desired cutoff frequencies using the equations below. AVCL = 1 + Rf/R i (4) (5) flp = 1/(2π RfCf ) (6) fhp = 1/(2π RiCi ) As an example, lets assume that the desired closed-loop gain is 40 dB and the desired voice-band is 300 Hz to 3 kHz. Using Equation 4, we choose Rf = 100 kΩ and Ri = 1 kΩ. The desired value in dB is equal to 20 log (AVCL). Then, solving for Cf and Ci using flp = 3 kHz, fhp = 300 Hz, Rf = 100 kΩ, and Ri = 1 kΩ we get the following: Cf = 530 pF and C i = 0.53 µF. COMPUTER APPLICATION CIRCUIT The LM4830 can also be used to drive both an internal system speaker and stereo headphones simultaneously, as shown in Figure 2. The internally configured unity-gain buffer requires the preamp to also be set up in an inverting unity-gain fashion to maintain proper signal phase between channels for the stereo headphone amplifier. The unity-gain configured circuit also requires that the AC input signal dynamic range be properly conditioned for the 2.5 VPK signal swing. Please refer to the Typical Performance Characteristics curves for THD+N vs P O and frequency of the MIC preamp and buffer. SHUTDOWN FUNCTION In order to reduce current consumption while not in use, the LM4830 contains a shutdown pin to externally turn off the IC’s bias circuitry. This shutdown feature turns the IC off when a logic high is placed on the shutdown pin. The trigger point between a logic low and logic high is typically half-supply. Quiescent current consumption will depend upon the value of this voltage. It is best for this voltage to be forced to VDDto obtain the guaranteed shutdown current. The shutdown feature reduces quiescent supply current consumption from a typical 11 mA to under 2 µA for the whole IC. 0 — Logic Low (0V) 1 — Logic High (5V) X — Don’t Care NC — No Change DIGITAL ATTENUATION CONTROL The Load (LD) pin, pin 9, has two modes of operation. When this input pin is a logic high, 5V, the power amp’s attenuation control is in “transparent mode” where the voltages on bits D0–D3 will cause the appropriate attenuation level to be latched and decoded within the IC. For normal attenuation, pin 9 should be at 5V. When the LD input pin is a logic low, 0V, the power amp’s attenuation control is “locked-out” so that any change in the input bits will not cause a subsequent change in the amp’s attenuation level. The attenuation level is preset to −16 dB when the IC is first powered up, assuming that LD is a logic low until the IC is fully biased up. To provide the best click and pop performance when changing attenuation levels, each step should be utilized. If a mute-type function is desired, it is recommended that each of the attenuation steps be “ramped through” quicker than the normal attenuation ramp. To ensure that attenuation steps are flawless when data is transitioning with load, refer to the timing diagram for proper setup and hold times. www.national.com 10 Application Information (Continued) This feature is especially useful when the IC is used in portable battery operated systems where energy conservation is imperative. In many applications, a microcontroller or microprocessor output interfaces to the LM4830 shutdown pin, providing a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground and enables the amplifier. If the switch is open, the external pull-up resistor disables the LM4830 by bringing the shutdown pin up to VDD. This scheme guarantees that the shutdown pin will not float, preventing unwanted state changes. Additionally, when the IC comes out of shutdown the IC’s volume attenuation setting will remain unchanged. 11 www.national.com 12 Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead (0.300" Wide) Molded Small Outline Package, JEDEC Order Number LM4830M NS Package Number M24B 24-Lead (0.600" Wide) Molded Dual-In-Line Package Order Number LM4830N NS Package Number N24A 13 www.national.com LM4830 Two-Way Audio Amplification System with Volume Control LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation Americas Tel: 1-800-272-9959 Fax: 1-800-737-7018 Email: support@nsc.com National Semiconductor Europe Fax: +49 (0) 1 80-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 1 80-530 85 85 English Tel: +49 (0) 1 80-532 78 32 Français Tel: +49 (0) 1 80-532 93 58 Italiano Tel: +49 (0) 1 80-534 16 80 National Semiconductor Asia Pacific Customer Response Group Tel: 65-2544466 Fax: 65-2504466 Email: sea.support@nsc.com National Semiconductor Japan Ltd. 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