LMC555 CMOS Timer
May 2006
LMC555 CMOS Timer
General Description
The LMC555 is a CMOS version of the industry standard 555 series general purpose timers. In addition to the standard package (SOIC, MSOP, and MDIP) the LMC555 is also available in a chip sized package (8 Bump micro SMD) using National’s micro SMD package technology. The LMC555 offers the same capability of generating accurate time delays and frequencies as the LM555 but with much lower power dissipation and supply current spikes. When operated as a one-shot, the time delay is precisely controlled by a single external resistor and capacitor. In the stable mode the oscillation frequency and duty cycle are accurately set by two external resistors and one capacitor. The use of National Semiconductor’s LMCMOS™ process extends both the frequency range and low supply capability.
Features
n n n n n n n n n n Less than 1 mW typical power dissipation at 5V supply 3 MHz astable frequency capability 1.5V supply operating voltage guaranteed Output fully compatible with TTL and CMOS logic at 5V supply Tested to −10 mA, +50 mA output current levels Reduced supply current spikes during output transitions Extremely low reset, trigger, and threshold currents Excellent temperature stability Pin-for-pin compatible with 555 series of timers Available in 8-pin MSOP Package and 8-Bump micro SMD package
Pulse Width Modulator
00866915
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Ordering Information
Package Temperature Range Industrial −40˚C to +85˚C 8-Pin Small Outline (SO) 8-Pin Mini Small Outline (MSOP) 8-Pin Molded Dip (MDIP) 8-Bump micro SMD 8-Bump micro SMD NOPB LMC555CM LMC555CMX LMC555CMM LMC555CMMX LMC555CN LMC555CBP LMC555CBPX LMC555CTP LMC555CTPX LMC555CM ZC5 LMC555CN F1 F02 Rails 2.5k Units Tape and Reel 1k Units Tape and Reel 3.5k Units Tape and Reel Rails 250 Units Tape and Reel 3k Units Tape and Reel 250 Units Tape and Reel 3k Units Tape and Reel M08A MUA08A N08E BPA08EFB TPA08EFA Package Marking Transport Media NSC Drawing
Note: See Mil-datasheet MNLMC555-X for specifications on the military device LMC555J/883.
LMCMOS™ is a trademark of National Semiconductor Corp.
© 2006 National Semiconductor Corporation
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LMC555
Connection Diagrams
8-Pin SOIC, MSOP, MDIP
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Top View 8-Bump micro SMD
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Top View (Bump Side Down)
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LMC555
Absolute Maximum Ratings (Notes 2, 3)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage, V+ Input Voltages, VTRIG, VRES, VCTRL, VTHRESH Output Voltages, VO, VDIS Output Current IO, IDIS Storage Temperature Range Soldering Information MDIP Soldering (10 seconds) SOIC, MSOP Vapor Phase (60 sec) SOIC, MSOP Infrared (15 sec) 260˚C 215˚C 220˚C 15V −0.3V to VS + 0.3V 15V 100 mA −65˚C to +150˚C
Thermal Resistance (θJA) (Note 2) SO, 8-Pin Small Outline MSOP, 8-Pin Mini Small Outline MDIP, 8-Pin Molded Dip 8-Bump micro SMD Maximum Allowable Power Dissipation @25˚C MDIP-8 SO-8 MSOP-8 8 Bump micro SMD 1126 mW 740 mW 555 mW 568 mW 169˚C/W
225˚C/W 111˚C/W 220˚C/W
Note: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
Operating Ratings(Notes 2, 3)
Termperature Range −40˚C to +85˚C
Electrical Characteristics (Notes 1, 2) Test Circuit, T = 25˚C, all switches open, RESET to VS unless otherwise noted
Symbol IS Parameter Supply Current VS = 1.5V VS = 5V VS = 12V VS = 1.5V VS = 5V VS = 12V 0.8 2.9 7.4 Conditions Min Typ 50 100 150 1.0 3.3 8.0 75 150 0.2 0.3 1.0 1.0 4.4 10.5 0.4 3.7 0.4 0.4 1.25 4.7 11.3 0.5 4.0 10 0.7 0.75 10 10 1.0 0.9 1.0 1.0 1.1 1.1 1.1 0.3 100 1.25 1.20 1.25 1.0 1.1 0.6 4.3 Max 150 250 400 1.2 3.8 8.6 150 300 0.4 0.6 2.0 Units (Limits) µA
VCTRL
Control Voltage
V
VDIS VOL
Discharge Saturation Voltage VS = 1.5V, IDIS = 1 mA VS = 5V, IDIS = 10 mA Output Voltage (Low) VS = 1.5V, IO = 1 mA VS = 5V, IO = 8 mA VS = 12V, IO = 50 mA VS = 1.5V, IO = −0.25 mA VS = 5V, IO = −2 mA VS = 12V, IO = −10 mA VS = 1.5V VS = 12V VS = 5V VS = 1.5V (Note 4) VS = 12V VS = 5V VS = 5V VS = 12V SW 2, 4 Closed VS = 1.5V VS = 5V VS = 12V VS = 5V ± 1V
mV
V
VOH
Output Voltage (High) Trigger Voltage Trigger Current Reset Voltage Reset Current Threshold Current Discharge Leakage Timing Accuracy
V
VTRIG ITRIG VRES IRES ITHRESH IDIS t
V pA V pA pA nA
ms
∆t/∆VS
Timing Shift with Supply
%/V
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LMC555
Electrical Characteristics (Notes 1, 2) Test Circuit, T = 25˚C, all switches open, RESET to VS unless otherwise noted (Continued)
Symbol ∆t/∆T fA fMAX t R , tF tPD Parameter Timing Shift with Temperature Astable Frequency Maximum Frequency Output Rise and Fall Times Trigger Propagation Delay Conditions VS = 5V −40˚C ≤ T ≤ +85˚C SW 1, 3 Closed, VS = 12V Max. Freq. Test Circuit, VS = 5V Max. Freq. Test Circuit VS = 5V, CL = 10 pF VS = 5V, Measure Delay from Trigger to Output 4.0 Min Typ 75 4.8 3.0 15 5.6 Max Units (Limits) ppm/˚C kHz MHz ns
100
ns
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good indication of device performance. Note 3: See AN-450 for other methods of soldering surface mount devices, and also AN-1112 for micro SMD considerations. Note 4: If the RESET pin is to be used at temperatures of −20˚C and below VS is required to be 2.0V or greater. Note 5: For device pinout please refer to table 1
Test Circuit (Note 5)
Maximum Frequency Test Circuit (Note 5)
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TABLE 1. Package Pinout Names vs. Pin Function Pin Function GND Trigger Output Reset Control Voltage Threshold Discharge V+ 1 2 3 4 5 6 7 8 Package Pin numbers 8-Pin SO, MSOP, and MDIP 8-Bump micro SMD A3 B3 C3 C2 C1 B1 A1 A2
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LMC555
Application Information
MONOSTABLE OPERATION In this mode of operation, the timer functions as a one-shot (Figure 1). The external capacitor is initially held discharged by internal circuitry. Upon application of a negative trigger pulse of less than 1/3 VS to the Trigger terminal, the flip-flop is set which both releases the short circuit across the capacitor and drives the output high.
negative pulse to the reset terminal. The output will then remain in the low state until a trigger pulse is again applied. When the reset function is not use, it is recommended that it be connected to V+ to avoid any possibility of false triggering. Figure 3 is a nomograph for easy determination of RC values for various time delays.
Note: In monstable operation, the trigger should be driven high before the end of timing cycle.
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FIGURE 1. Monostable (One-Shot) The voltage across the capacitor then increases exponentially for a period of tH = 1.1 RAC, which is also the time that the output stays high, at the end of which time the voltage equals 2/3 VS. The comparator then resets the flip-flop which in turn discharges the capacitor and drives the output to its low state. Figure 2 shows the waveforms generated in this mode of operation. Since the charge and the threshold level of the comparator are both directly proportional to supply voltage, the timing internal is independent of supply.
FIGURE 3. Time Delay ASTABLE OPERATION If the circuit is connected as shown in Figure 4 (Trigger and Threshold terminals connected together) it will trigger itself and free run as a multivibrator. The external capacitor charges through RA + RB and discharges through RB. Thus the duty cycle may be precisely set by the ratio of these two resistors.
00866910
VCC = 5V TIME = 0.1 ms/Div. RA = 9.1 kΩ C = 0.01 µF
Top Trace: Input 5 V/Div. Middle Trace: Output 5 V/Div. Bottom Trace: Capacitor Voltage 2 V/Div.
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FIGURE 4. Astable (Variable Duty Cycle Oscillator) In this mode of operation, the capacitor charges and discharges between 1/3 VS and 2/3 VS. As in the triggered mode, the charge and discharge times, and therefore the frequency are independent of the supply voltage. Figure 5 shows the waveform generated in this mode of operation.
FIGURE 2. Monostable Waveforms Reset overrides Trigger, which can override threshold. Therefore the trigger pulse must be shorter than the desired tH. The minimum pulse width for the Trigger is 20ns, and it is 400ns for the Reset. During the timing cycle when the output is high, the further application of a trigger pulse will not effect the circuit so long as the trigger input is returned high at least 10µs before the end of the timing interval. However the circuit can be reset during this time by the application of a
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LMC555
Application Information
(Continued)
FREQUENCY DIVIDER The monostable circuit of Figure 1 can be used as a frequency divider by adjusting the length of the timing cycle. Figure 7 shows the waveforms generated in a divide by three circuit.
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VCC = 5V TIME = 20 µs/Div. RA = 3.9 kΩ RB = 9 kΩ C = 0.01 µF
Top Trace: Output 5 V/Div. Bottom Trace: Capacitor Voltage 1 V/Div.
00866914
VCC = 5V TIME = 20 µs/Div. RA = 9.1 kΩ C = 0.01 µF
Top Trace: Input 4 V/Div. Middle Trace: Output 2 V/Div. Bottom Trace: Capacitor 2 V/Div.
FIGURE 5. Astable Waveforms The charge time (output high) is given by t1 = 0.693 (RA + RB)C And the discharge time (output low) by: t2 = 0.693 (RB)C Thus the total period is: T = t1 + t2 = 0.693 (RA + RB)C The frequency of oscillation is:
FIGURE 7. Frequency Divider Waveforms PULSE WIDTH MODULATOR When the timer is connected in the monostable mode and triggered with a continuous pulse train, the output pulse width can be modulated by a signal applied to the Control Voltage Terminal. Figure 8 shows the circuit, and in Figure 9 are some waveform examples.
Figure 6 may be used for quick determination of these RC Values. The duty cycle, as a fraction of total period that the output is low, is:
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FIGURE 8. Pulse Width Modulator
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FIGURE 6. Free Running Frequency
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Application Information
(Continued)
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VCC = 5V
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Top Trace: Modulation Input 1 V/Div. Bottom Trace: Output Voltage 2 V/Div.
TIME = 0.1 ms/Div. RA = 3.9 kΩ RB = 3 kΩ C = 0.01 µF
VCC = 5V TIME = 0.2 ms/Div. RA = 9.1 kΩ C = 0.01 µF
Top Trace: Modulation 1 V/Div. Bottom Trace: Output Voltage 2 V/Div.
FIGURE 11. Pulse Position Modulator Waveforms FIGURE 9. Pulse Width Modulator Waveforms PULSE POSITION MODULATOR This application uses the timer connected for astable operation, as in Figure 10, with a modulating signal again applied to the control voltage terminal. The pulse position varies with the modulating signal, since the threshold voltage and hence the time delay is varied. Figure 11 shows the waveforms generated for a triangle wave modulation signal. 50% DUTY CYCLE OSCILLATOR The frequency of oscillation is f = 1/(1.4 RCC)
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FIGURE 12. 50% Duty Cycle Oscillator micro SMD Marking Orientation Top View
FIGURE 10. Pulse Position Modulator
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Bumps are numbered counter-clockwise
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LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted
Molded Small Outline (SO) Package (M) NS Package Number M08A
8-Pin (0.118” Wide) Molded Mini Small Outline Package NS Package Number MUA08A
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LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Molded Dual-in-line Package (N) NS Package Number N08E
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LMC555
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. 63Sn/37Pb EUTECTIC BUMP 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. REMAINING PINS ARE NUMBERED COUNTERCLOCKWISE. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package NS Package Number BPA08EFB X1 = 1.387 X2 = 1.412 X3 = 0.850
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LMC555 CMOS Timer
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
NOTES: UNLESS OTHERWISE SPECIFIED 1. EPOXY COATING 2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
8-Bump micro SMD Package NS Package Number TPA08EFA X1 = 1.387 X2 = 1.412 X3 = 0.500
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LMC555 CMOS Timer
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