NTE5671

NTE5671 TRIAC − 800VRM, 20A TO220 Full Pack Description: The NTE5671 TRIAC is designed for use in applications requiring high bidirectional transient and blocking voltage capability. Typical applications include AC power control circuits such as lighting, industrial and domestic heating, motor control and switching systems.. Absolute Maximum Ratings: Non−Repetitive Peak Off−State Voltage (Either Direction, t ≤ 10ms), VDSM . . . . . . . . . . . . . . . . 800V Repetitive Peak Off−State Voltage (Either Direction, δ ≤ 0.01), VDRM . . . . . . . . . . . . . . . . . . . . . 800V Crest Working Off−State Voltage (Either Direction), VDWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V RMS On−State Current (Conduction Angle 360°, TH = +67°C), IT(RMS) . . . . . . . . . . . . . . . . . . . . 16A Repetitive Peak On−State Current, ITRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140A Non−Repetitive Peak On−State Current, ITSM (TJ = +120°C Prior to Surge, t = 20ms, Full Sine Wave) . . . . . . . . . . . . . . . . . . . . . . . . . . 140A 2 I t for Fusing (t = 10ms), I2t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95A2s Rate of Rise of On−State Current After Triggering, dIT/dt (IG = 200mA to IT = 20A, dIGdt = 0.2A/µs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30A/µs Average Power Dissipation (Averaged Over any 20ms Period), PG(AV) . . . . . . . . . . . . . . . . . . . 0.5W Peak Power Dissipation, PGM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0W RMS Isolation Voltage (From All Three Terminals to External Heatsink[Peak]), V(ISO) . . . . . . 1000V Isolation Capacitance (From T2 to External Heatsink), C(ISO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12pF Full Operating Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +120°C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40° to +125°C Typical Thermal Resistance, Junction−to−Heatsink (See Mounting Instructions), RthJH With Heatsink Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5K/W Without Heatsink Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5K/W Thermal Resistance, Junction−to−Ambient (Note 1), RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55K/W Note 1. Mounted on a printed circuit board at any lead length. The quoted value of RthJA should be used only when no leads of other dissipating components run to the same tie−point. Electrical Characteristics: (TJ = +25°C, unless otherwise specified. Polarities, positive or negative, are identified with respect to MT1.) Parameter On−State Voltage (Measured under pulse conditions to prevent excessive dissipation) Rate of Rise of Off−State Voltage (That will not trigger any device) Rate of Change of Commutating Voltage (That will not trigger any device) Off−State Current Symbol VT dVD/dt Test Conditions IT = 20A − − 1.6 TJ = +120°C, Gate Open − − 100 V/µs − 10 − V/µs − − 0.5 mA 1.5 − − V dVcom/dt −dIcom/dt = 7.2A/ms, IT(RMS) = 16A, TH = 70°C, VD = 400V, Gate Open ID Min Typ Max Unit VD = 400V, TJ = +120°C V Gate Voltage (That will trigger all devices) VGT Gate Voltage (That will not trigger any device) MT2 (+), G (+); MT2 (−), G (−) VGD VD = 400V, TJ = +120°C − − 250 mV Gate Current (That will trigger all devices) MT2 (+), G (+) IGT G to MT1 35 − − Ma MT2 (+), G (−) 35 − − mA MT2 (−), G (−) 35 − − mA MT2 (−), G (+) 70 − − mA − − 30 mA − − 40 Ma MT2 (+), G (−) − − 60 mA MT2 (−), G (−) − − 40 mA MT2 (−), G (+) − − 60 mA Holding Current IH Latching Current MT2 (+), G (+) IL VD = 12V Mounting Instructions: 1. The TRIAC may be soldered directly into the circuit, but the maximum permissible temperature of the soldering iron or bath is +275°C; it must not be in contact with the joint for more than 5 seconds. Soldered joints must be at least .185” (4.7mm) from the seal. 2. The leads should not be bent less than .094” (2.4mm) from the seal, and should be supported during bending. The leads can be bent, twisted or straightened by 90° maximum. The minimum bending radius is .039” (1mm). 3. Mounting by means of a spring clip (not provided by NTE) is the best mounting method because if offers good thermal contact under the crystal area and slightly lower RthJH values than screw mounting. However, if a screw is used, it should be an M3 cross−recess pan−head. Care should be taken to avoid damage to the plastic body. 4. For good thermal contact, heatsink compound should be used between the seating plane and the heatsink. values of RthJH given for mounting with heatsink compound refer to the use of a metallic− oxide loaded compound. Ordinary silicone grease is not recommended. 5. Rivit mounting is not recommended. 6. The heatsink must have a flatness in the mounting area of .0007 (.02mm) maximum per .393 (10mm). Mounting holes must be deburred. MT2 MT1 Gate .402 (10.2) Max .224 (5.7) Max .122 (3.1) Dia .295 (7.5) .165 (4.2) .669 (17.0) Max MT2 MT1 Gate .531 (13.5) Min .100 (2.54) .059 (1.5) Max .173 (4.4) Max .114 (2.9) Max