74AHC241PW,118

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia 74AHC241; 74AHCT241 Octal buffer/line driver; 3-state Rev. 01 — 11 January 2010 Product data sheet 1. General description The 74AHC241 and 74AHCT241 are 8-bit buffer/line drivers with 3-state outputs. These devices can be used as two 4-bit buffers or one 8-bit buffer. They feature two output enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on 1OE or LOW on 2OE causes the associated outputs to assume a high-impedance OFF-state. Inputs are over voltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments. 2. Features „ „ „ „ „ „ Balanced propagation delays All inputs have a Schmitt-trigger action Inputs accepts voltages higher than VCC For 74AHC241 only: operates with CMOS input levels For 74AHCT241 only: operates with TTL input levels ESD protection: ‹ HBM JESD22-A114F exceeds 2 000 V ‹ CDM JESD22-C101D exceeds 1 000 V „ Multiple package options „ Specified from −40 °C to +85 °C and from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number 74AHC241D Package Temperature range Name Description Version −40 °C to +125 °C SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 −40 °C to +125 °C TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 −40 °C to +125 °C DHVQFN20 plastic dual in-line compatible thermal enhanced SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5 × 4.5 × 0.85 mm 74AHCT241D 74AHC241PW 74AHCT241PW 74AHC241BQ 74AHCT241BQ 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 4. Functional diagram 1 2 1A0 1Y0 18 17 2A0 2Y0 3 4 1A1 1Y1 16 15 2A1 2Y1 5 6 1A2 1Y2 14 13 2A2 2Y2 7 8 1A3 1Y3 12 11 2A3 2Y3 9 1 1OE 19 2OE 2 18 4 16 6 14 8 12 19 mna771 EN EN 11 9 13 7 15 5 17 3 mna773 Fig 1. Logic symbol Fig 2. IEC logic symbol 5. Pinning information 5.1 Pinning 1 terminal 1 index area 74AHC241 74AHCT241 20 VCC 1OE 74AHC241 74AHCT241 1A0 2 19 2OE 2Y0 3 18 1Y0 1A1 4 17 2A0 1OE 1 20 VCC 1A0 2 19 2OE 2Y0 3 18 1Y0 2Y1 5 16 1Y1 1A1 4 17 2A0 1A2 6 15 2A1 2Y1 5 16 1Y1 2Y2 7 1A2 6 15 2A1 1A3 8 2Y2 7 14 1Y2 1A3 8 13 2A2 2Y3 9 2Y3 9 12 1Y3 GND 10 11 2A3 14 1Y2 GND(1) 13 2A2 2A3 11 GND 10 12 1Y3 001aal191 Transparent top view 001aal190 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. It is recommended that no connection is made at all. Fig 3. Pin configuration SO20 and TSSOP20 Fig 4. Pin configuration DHVQFN20 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 2 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE 1 output enable input (active LOW) 2OE 19 output enable input (active HIGH) 1A0, 1A1, 1A2, 1A3 2, 4, 6, 8 data input 2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 data input 1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14, 12 data output 2Y0, 2Y1, 2Y2, 2Y3 3, 5, 7, 9 data output GND 10 ground (0 V) VCC 20 power supply 6. Functional description Table 3. Function table[1] Input Output Input Output 1OE 1An 1Yn 2OE 2An 2Yn L L L H L L L H H H H H H X Z L X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI IIK input clamping current VI < −0.5 V IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V IO output current VO = −0.5 V to (VCC + 0.5 V) ICC supply current IGND ground current Tstg storage temperature Ptot [1] [2] Min Max Unit supply voltage −0.5 +7.0 V input voltage −0.5 +7.0 V [1] −20 - mA [1] - ±20 mA - ±25 mA - 75 mA −75 - mA −65 +150 °C - 500 mW total power dissipation Conditions Tamb = −40 °C to +125 °C [2] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. For SO20 package: above 70 °C the value of Ptot derates linearly with 8.0 mW/K. For TSSOP20 package: above 60 °C the value of Ptot derates linearly with 5.5 mW/K. For DHVQFN20 package: above 60 °C the value of Ptot derates linearly with 4.5 mW/K. 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 3 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit 74AHC241 VCC supply voltage 2.0 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C Δt/ΔV input transition rise and fall rate VCC = 3.3 V ± 0.3 V - - 1 00 ns/V VCC = 5 V ± 0.5 V - - 20 ns/V 74AHCT241 VCC supply voltage 4.5 5.0 5.5 V VI input voltage 0 - 5.5 V VO output voltage 0 - VCC V Tamb ambient temperature −40 +25 +125 °C Δt/ΔV input transition rise and fall rate - - 20 ns/V VCC = 5 V ± 0.5 V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 1.5 - - 1.5 - 1.5 - V VCC = 3.0 V 2.1 - - 2.1 - 2.1 - V VCC = 5.5 V 3.85 - - 3.85 - 3.85 - V VCC = 2.0 V - - 0.5 - 0.5 - 0.5 V VCC = 3.0 V - - 0.9 - 0.9 - 0.9 V 74AHC241 VIH VIL VOH VOL HIGH-level input voltage LOW-level input voltage VCC = 2.0 V VCC = 5.5 V - - 1.65 - 1.65 - 1.65 V HIGH-level VI = VIH or VIL output voltage IO = −50 μA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 μA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 μA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.80 - 3.70 - V LOW-level VI = VIH or VIL output voltage IO = 50 μA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 μA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 μA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 4 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 μA IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 μA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 μA CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF VI = VCC or GND 74AHCT241 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 - - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - - 0.8 - 0.8 - 0.8 V VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 μA 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.80 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 μA IO = −8.0 mA VOL LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 μA IO = 8.0 mA II input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V IOZ OFF-state VI = VIH or VIL; output current VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - ±0.25 - ±2.5 - ±10.0 μA ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 4.0 - 40 - 80 μA ΔICC additional per input pin; supply current VI = VCC − 2.1 V; other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 3 10 - 10 - 10 pF CO output capacitance - 4 - - - - - pF VI = VCC or GND 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 5 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter 25 °C Conditions Min Typ[1] VCC = 3.0 V to 3.6 V; CL = 15 pF - VCC = 3.0 V to 3.6 V; CL = 50 pF - VCC = 4.5 V to 5.5 V; CL = 15 pF −40 °C to +125 °C Unit Max Min Max Max (85 °C) (125 °C) 4.5 8.4 1.0 9.7 11.5 ns 6.5 12.2 1.0 14.5 16.9 ns - 3.2 5.4 1.0 6.2 7.8 ns - 3.2 7.9 1.0 9.2 11.2 ns VCC = 3.0 V to 3.6 V; CL = 15 pF - 8.9 10.4 1.0 12.2 14.0 ns VCC = 3.0 V to 3.6 V; CL = 50 pF - 5.5 14.8 1.0 17.8 19.6 ns VCC = 4.5 V to 5.5 V; CL = 15 pF - 6.1 6.6 1.0 7.6 9.1 ns - 3.9 9.4 1.0 11.0 12.2 ns VCC = 3.0 V to 3.6 V; CL = 15 pF - 6.5 10.4 1.0 12.2 14.0 ns VCC = 3.0 V to 3.6 V; CL = 50 pF - 5.6 14.8 1.0 17.8 19.6 ns VCC = 4.5 V to 5.5 V; CL = 15 pF - 3.2 6.6 1.0 7.6 9.1 ns VCC = 4.5 V to 5.5 V; CL = 50 pF - 4.0 9.4 1.0 11.0 12.2 ns VCC = 3.0 V to 3.6 V; CL = 15 pF - 5.1 10.2 1.0 11.8 13.3 ns VCC = 3.0 V to 3.6 V; CL = 50 pF - 7.2 14.4 1.0 15.8 19.2 ns VCC = 4.5 V to 5.5 V; CL = 15 pF - 3.6 7.3 1.0 8.2 9.2 ns - 5.1 9.9 1.0 10.8 13.0 ns VCC = 3.0 V to 3.6 V; CL = 15 pF - 5.0 10.2 1.0 11.8 13.3 ns VCC = 3.0 V to 3.6 V; CL = 50 pF - 7.1 14.4 1.0 15.8 19.2 ns VCC = 4.5 V to 5.5 V; CL = 15 pF - 3.6 7.3 1.0 8.2 9.2 ns - 5.1 9.9 1.0 10.8 13.0 ns - 9 - - - - pF VCC = 4.5 V to 5.5 V; CL = 15 pF - 3.5 5.7 1.0 6.5 7.9 ns VCC = 4.5 V to 5.5 V; CL = 50 pF - 5.1 7.9 1.0 9.2 11.2 ns 74AHC241 tpd propagation delay nAn to nYn; see Figure 5 [2] VCC = 4.5 V to 5.5 V; CL = 50 pF ten enable time 1OE to 1Yn; see Figure 6 [2] VCC = 4.5 V to 5.5 V; CL = 50 pF 2OE to 2Yn; see Figure 7 tdis disable time 1OE to 1Yn; see Figure 6 [2] [2] VCC = 4.5 V to 5.5 V; CL = 50 pF 2OE to 2Yn; see Figure 7 [2] VCC = 4.5 V to 5.5 V; CL = 50 pF CPD power dissipation capacitance VI = GND to VCC; CL = 50 pF; fi = 1 MHz [3] nAn to nYn; see Figure 5 [2] 74AHCT241 tpd propagation delay 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 6 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter ten enable time 25 °C Conditions Max Min - 3.7 6.6 1.0 7.8 9.2 ns - 5.4 9.5 1.0 11.1 12.4 ns - 3.7 6.6 1.0 7.8 9.2 ns - 5.4 9.5 1.0 11.1 12.4 ns VCC = 4.5 V to 5.5 V; CL = 15 pF - 4.8 7.8 1.0 8.8 9.7 ns VCC = 4.5 V to 5.5 V; CL = 50 pF - 7.1 10.5 1.0 11.4 13.5 ns - 4.8 7.8 1.0 8.8 9.7 ns - 7.1 10.5 1.0 11.4 13.5 ns - 9 - - - - pF [2] 2OE to 2Yn; see Figure 7 VCC = 4.5 V to 5.5 V; CL = 15 pF VCC = 4.5 V to 5.5 V; CL = 50 pF [2] 1OE to 1Yn; see Figure 6 [2] 2OE to 2Yn; see Figure 7 VCC = 4.5 V to 5.5 V; CL = 15 pF VCC = 4.5 V to 5.5 V; CL = 50 pF CPD power dissipation capacitance [3] VI = GND to VCC; CL = 50 pF; fi = 1 MHz [1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). [2] tpd is the same as tPLH and tPHL; ten is the same as tPZH and tPZL; tdis is the same as tPLZ and tPHZ. [3] Max Max (85 °C) (125 °C) [2] 1OE to 1Yn; see Figure 6 VCC = 4.5 V to 5.5 V; CL = 50 pF disable time Unit Min VCC = 4.5 V to 5.5 V; CL = 15 pF tdis −40 °C to +125 °C Typ[1] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs. 11. Waveforms VI nAn input VM VM GND tPHL tPLH VOH VM nYn output VM VOL mgu781 Measurement points are given in Table 8. VOL and VOH are typical voltage output drop that occur with the output load. Fig 5. Propagation delay input (nAn) to output (nYn) 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 7 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state VI 1OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs enabled outputs disabled mna775 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Enable and disable times for input 1OE VI 2OE input VM GND t PLZ t PZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL t PZH t PHZ VOH output HIGH-to-OFF OFF-to-HIGH VY VM GND outputs enabled outputs enabled outputs disabled mna776 Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Enable and disable times for input 2OE Table 8. Measurement points Type Input Output VM VM VX VY 74AHC241 0.5VCC 0.5VCC VOL + 0.3 V VOH − 0.3 V 74AHCT241 1.5 V 0.5VCC VOL + 0.3 V VOH − 0.3 V 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 8 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC G VI VCC VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 8. Load circuitry for switching times Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH tPZH, tPHZ tPZL, tPLZ 74AHC241 VCC 3.0 ns 15 pF, 50 pF 1 kΩ open GND VCC 74AHCT241 3.0 V 3.0 ns 15 pF, 50 pF 1 kΩ open GND VCC 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 9 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 12. Package outline SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 20 11 Q A2 A (A 3) A1 pin 1 index θ Lp L 10 1 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT163-1 (SO20) 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 10 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 E D A X c HE y v M A Z 11 20 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 10 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.5 0.2 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 10. Package outline SOT360-1 (TSSOP20) 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 11 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B w M C b L 1 10 Eh e 20 11 19 12 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 4.6 4.4 3.15 2.85 2.6 2.4 1.15 0.85 0.5 3.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT764-1 --- MO-241 --- EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Fig 11. Package outline SOT764-1 (DHVQFN20) 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 12 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description CDM Charge Device Model CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT241_1 20100111 Product data sheet - - 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 13 of 15 74AHC241; 74AHCT241 NXP Semiconductors Octal buffer/line driver; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT241_1 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 01 — 11 January 2010 14 of 15 NXP Semiconductors 74AHC241; 74AHCT241 Octal buffer/line driver; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 January 2010 Document identifier: 74AHC_AHCT241_1