74AHC259D

74AHC259; 74AHCT259 8-bit addressable latch Rev. 02 — 15 May 2008 Product data sheet 1. General description The 74AHC259; 74AHCT259 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A. The 74AHC259; 74AHCT259 is a high-speed 8-bit addressable latch designed for general purpose storage applications in digital systems. It is a multifunctional device capable of storing single-line data in eight addressable latches and providing a 3-to-8 decoder and multiplexer function with active HIGH outputs (Q0 to Q7). It also incorporates an active LOW common reset (MR) for resetting all latches as well as an active LOW enable input (LE). The 74AHC259; 74AHCT259 has four modes of operation: • In the addressable latch mode, data on the data line (D) is written into the addressed latch. The addressed latch will follow the data input with all non-addressed latches remaining in their previous states. • In the memory mode, all latches remain in their previous states and are unaffected by the data or address inputs. • In the 3-to-8 decoding or demultiplexing mode, the addressed output follows the state of the data input (D) with all other outputs in the LOW state. • In the reset mode, all outputs are LOW and unaffected by the address inputs (A0 to A2) and data input (D). When operating the 74AHC259; 74AHCT259 as an address latch, changing more than one bit of the address could impose a transient-wrong address. Therefore, this should only be done while in the memory mode. 2. Features I I I I I I I I I I Balanced propagation delays All inputs have Schmitt-trigger actions Combines demultiplexer and 8-bit latch Serial-to-parallel capability Output from each storage bit available Random (addressable) data entry Easily expandable Common reset input Useful as a 3-to-8 active HIGH decoder Inputs accept voltages higher than VCC NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch I Input levels: N For 74AHC259: CMOS level N For 74AHCT259: TTL level I ESD protection: N HBM EIA/JESD22-A114E exceeds 2000 V N MM EIA/JESD22-A115-A exceeds 200 V N CDM EIA/JESD22-C101C exceeds 1000 V I Multiple package options I Specified from −40 °C to +85 °C and from −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Package Temperature range Name 74AHC259 74AHC259D 74AHC259PW 74AHCT259 74AHCT259D 74AHCT259PW −40 °C to +125 °C −40 °C to +125 °C SO16 TSSOP16 plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT109-1 SOT403-1 −40 °C to +125 °C −40 °C to +125 °C SO16 TSSOP16 plastic small outline package; 16 leads; body width 3.9 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT109-1 SOT403-1 Description Version Type number 4. Functional diagram 13 15 14 Z9 G8 G10 9,10D 0 1 C10 8R DX 14 LE Q0 13 D Q1 Q2 Q3 1 2 3 A0 A1 A2 MR 15 mna573 4 1 4 5 6 7 9 10 11 12 2 3 0 G 2 0 7 1 5 6 2 7 3 9 4 10 5 11 6 12 7 mna572 Q4 Q5 Q6 Q7 Fig 1. Logic symbol Fig 2. IEC logic symbol © NXP B.V. 2008. All rights reserved. 74AHC_AHCT259_2 Product data sheet Rev. 02 — 15 May 2008 2 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Q0 1 2 3 A0 A1 A2 1-of-8 DECODER 8 LATCHES 14 15 13 LE MR D Q1 Q2 Q3 Q4 4 5 6 7 9 Q5 10 Q6 11 Q7 12 mna571 Fig 3. Functional diagram 5. Pinning information 5.1 Pinning 74AHC259 74AHCT259 A0 A1 A2 Q0 Q1 Q2 Q3 GND 1 2 3 4 5 6 7 8 001aai126 16 VCC 15 MR 14 LE 13 D 12 Q7 11 Q6 10 Q5 9 Q4 Fig 4. Pin configuration 5.2 Pin description Table 2. Symbol A0 A1 A2 Q0 Q1 Q2 Q3 GND Q4 Q5 74AHC_AHCT259_2 Pin description Pin 1 2 3 4 5 6 7 8 9 10 Description address input address input address input latch output latch output latch output latch output ground (0 V) latch output latch output © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 3 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Table 2. Symbol Q6 Q7 D LE MR VCC Pin description …continued Pin 11 12 13 14 15 16 Description latch output latch output data input latch enable input (active LOW) conditional reset input (active LOW) supply voltage 6. Functional description Table 3. Function table[1] Input MR Reset (clear) L Demultiplexer L (active HIGH 8-channel) decoder (when D = H) LE H L D X d d d d d d d d Memory (no action) Addressable latch H H H L X d d d d d d d H [1] Operating mode Output A0 X L H L H L H L H X L H L H L H L H A1 X L L H H L L H H X L L H H L L H H A2 X L L L L H H H H X L L L L H H H H Q0 L L L L L L L L q0 q0 q0 q0 q0 q0 q0 q0 Q1 L Q2 L L Q3 L L L Q4 L L L L Q5 L L L L L Q6 L L L L L L Q7 L L L L L L L Q=d q7 q7 q7 q7 q7 q7 q7 Q=d Q=d L L L L L L L q1 Q=d L L L L L L q2 q2 Q=d L L L L L q3 q3 q3 Q=d L L L L q4 q4 q4 q4 Q=d L L L q5 q5 q5 q5 q5 Q=d L L q6 q6 q6 q6 q6 q6 Q=d L Q = d q1 q1 q1 q1 q1 q1 q1 Q = d q2 q2 q2 q2 q2 q2 Q = d q3 q3 q3 q3 q3 Q = d q4 q4 q4 q4 Q = d q5 q5 q5 Q = d q6 q6 Q = d q7 H = HIGH voltage level; L = LOW voltage level; X = don’t care; d = HIGH or LOW data one set-up time prior to the LOW-to-HIGH LE transition; q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition. 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 4 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Table 4. LE L H L H [1] Operating mode select table[1] MR H H L L Mode addressable latch memory active HIGH 8-channel demultiplexer reset H = HIGH voltage level; L = LOW voltage level. 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC VI IIK IOK IO ICC IGND Tstg Ptot [1] [2] Parameter supply voltage input voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation Conditions Min −0.5 −0.5 Max +7.0 +7.0 +20 +25 +75 +150 500 Unit V V mA mA mA mA mA °C mW VI < −0.5 V VO < −0.5 V or VO > VCC + 0.5 V VO = −0.5 V to (VCC + 0.5 V) [1] [1] −20 −20 −25 −75 −65 Tamb = −40 °C to +125 °C [2] - The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For SO16 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K. For TSSOP16 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K. 8. Recommended operating conditions Table 6. Symbol 74AHC259 VCC VI VO Tamb ∆t/∆V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 74AHCT259 VCC VI VO Tamb ∆t/∆V 74AHC_AHCT259_2 Operating conditions Parameter Conditions Min 2.0 0 0 −40 4.5 0 0 −40 VCC = 4.5 V to 5.5 V Typ 5.0 +25 5.0 +25 Max 5.5 5.5 VCC +125 100 20 5.5 5.5 VCC +125 20 Unit V V V °C ns/V ns/V V V V °C ns/V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 5 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch 9. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter 74AHC259 VIH HIGH-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VIL LOW-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VOH HIGH-level VI = VIH or VIL output voltage IO = −50 µA; VCC = 2.0 V IO = −50 µA; VCC = 3.0 V IO = −50 µA; VCC = 4.5 V IO = −4.0 mA; VCC = 3.0 V IO = −8.0 mA; VCC = 4.5 V VOL LOW-level VI = VIH or VIL output voltage IO = 50 µA; VCC = 2.0 V IO = 50 µA; VCC = 3.0 V IO = 50 µA; VCC = 4.5 V IO = 4.0 mA; VCC = 3.0 V IO = 8.0 mA; VCC = 4.5 V II ICC CI CO input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V 1.5 2.1 3.85 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 0 0 0 3 4 0.5 0.9 1.65 0.1 0.1 0.1 0.36 0.36 0.1 4.0 10 1.5 2.1 3.85 1.9 2.9 4.4 2.48 3.80 0.5 0.9 1.65 0.1 0.1 0.1 0.44 0.44 1.0 40 10 1.5 2.1 3.85 1.9 2.9 4.4 2.40 3.70 0.5 0.9 1.65 0.1 0.1 0.1 0.55 0.55 2.0 80 10 V V V V V V V V V V V V V V V V µA µA pF pF Conditions Min 25 °C Typ Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V input capacitance output capacitance HIGH-level input voltage LOW-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VCC or GND 74AHCT259 VIH VIL VOH 2.0 0.8 2.0 0.8 2.0 0.8 V V HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = −50 µA IO = −8.0 mA LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA 4.4 3.94 - 4.5 0 - 0.1 0.36 4.4 3.80 - 0.1 0.44 4.4 3.70 - 0.1 0.55 V V V V VOL 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 6 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter II ICC ∆ICC input leakage current Conditions Min VI = 5.5 V or GND; VCC = 0 V to 5.5 V 25 °C Typ Max 0.1 4.0 1.35 −40 °C to +85 °C −40 °C to +125 °C Unit Min Max 1.0 40 1.5 Min Max 2.0 80 1.5 µA µA mA supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V additional per input pin; VI = VCC − 2.1 V; supply current other pins at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V input capacitance output capacitance VI = VCC or GND CI CO - 3 4 10 - - 10 - - 10 - pF pF 10. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter 74AHC259 tpd propagation D to Qn; see Figure 5 delay VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF An to Qn; see Figure 6 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF LE to Qn; see Figure 7 VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF 4.3 5.5 8.0 10.0 1.0 1.0 9.5 11.5 1.0 1.0 10.5 12.5 ns ns 6.2 7.7 12.0 15.5 1.0 1.0 14.0 17.5 1.0 1.0 15.2 19.0 ns ns [2] [2] [2] Conditions Min 25 °C Typ[1] Max −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max - 5.8 7.3 4.1 5.3 11.5 14.5 7.5 9.5 1.0 1.0 1.0 1.0 13.5 17.0 9.0 11.0 1.0 1.0 1.0 1.0 15.0 18.5 10.0 12.0 ns ns ns ns - 7.5 9.1 5.3 6.5 14.5 18.0 9.5 11.5 1.0 1.0 1.0 1.0 17.0 21.0 11.5 13.5 1.0 1.0 1.0 1.0 18.5 23.0 12.5 15.0 ns ns ns ns 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 7 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter tpd Conditions Min propagation MR to Qn; see Figure 8 delay VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF tW pulse width LE HIGH or LOW; see Figure 7 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V MR LOW; see Figure 8 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V tsu set-up time D, An to LE; see Figure 9 and Figure 10 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V th hold time D, An to LE; see Figure 9 and Figure 10 VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V CPD power fi = 1 MHz; VI = GND to VCC dissipation capacitance propagation D to Qn; see Figure 5 delay CL = 15 pF CL = 50 pF An to Qn; see Figure 6 CL = 15 pF CL = 50 pF LE to Qn; see Figure 7 CL = 15 pF CL = 50 pF MR to Qn; see Figure 8 CL = 15 pF CL = 50 pF tW pulse width LE HIGH or LOW; see Figure 7 MR LOW; see Figure 8 74AHC_AHCT259_2 25 °C Typ[1] Max [3] −40 °C to +85 °C −40 °C to +125 °C Unit Min Max Min Max - 5.4 7.0 3.9 5.1 10.5 13.5 7.0 9.0 1.0 1.0 1.0 1.0 12.5 15.5 8.5 10.5 1.0 1.0 1.0 1.0 13.5 17.0 9.5 11.5 ns ns ns ns 5.0 5.0 5.0 5.0 - - 5.0 5.0 5.0 5.0 - 5.0 5.0 5.0 5.0 - ns ns ns ns 4.0 4.0 - - 4.0 4.0 - 4.0 4.0 - ns ns 1.0 1.0 [4] 13 - 1.0 1.0 - - 1.0 1.0 - - ns ns pF - 74AHCT259; VCC = 4.5 V to 5.5 V tpd [2] [2] 4.1 5.4 5.5 6.6 4.3 5.5 3.9 5.1 - 7.5 9.5 9.5 12.0 8.0 10.0 7.0 9.0 - 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 5.0 5.0 9.0 11.0 11.5 14.0 9.5 12.0 8.5 10.5 - 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 5.0 5.0 10.0 12.0 12.5 15.5 10.4 13.0 9.5 11.5 - ns ns ns ns ns ns ns ns ns ns [2] [3] 5.0 5.0 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 8 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11. Symbol Parameter tsu th CPD set-up time hold time Conditions Min D, An to LE; see Figure 9 and Figure 10 D, An to LE; see Figure 9 and Figure 10 [4] 25 °C Typ[1] 17 Max 4.0 1.0 - −40 °C to +85 °C −40 °C to +125 °C Unit Min 4.0 1.0 Max Min 4.0 1.0 Max ns ns pF fi = 1 MHz; VI = GND to VCC power dissipation capacitance [1] [2] [3] [4] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V). tpd is the same as tPLH and tPHL. tpd is the same as tPHL only. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 11. Waveforms VCC D input GND tPHL VOH Qn output VOL VM 001aah123 VM tPLH Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Data input to output propagation delays 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 9 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch VCC An input GND tPHL VOH Qn output VOL VM 001aah122 VM tPLH Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. Address input to output propagation delays VCC D input GND VCC LE input GND tW tPHL VOH Qn output VOL VM 001aah121 VM tPLH Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Enable input to output propagation delays and pulse width VCC MR input GND tW tPHL VOH Qn output VOL VM 001aah124 VM Measurement points are given in Table 9. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Conditional reset input to output propagation delays 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 10 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch VCC LE input GND VM tsu VCC D input GND VM tsu th th VOH Qn output VOL 001aah125 Q=D VM Q=D Measurement points are given in Table 9. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Data input to latch enable input set-up and hold times VCC An input GND VM ADDRESS STABLE tsu VCC th LE input GND VM 001aah126 Measurement points are given in Table 9. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 10. Address input to latch enable input set-up and hold times Table 9. Type 74AHC259 74AHCT259 Measurement points Input VM 0.5 × VCC 1.5 V Output VM 0.5 × VCC 0.5 × VCC 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 11 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch VI negative pulse GND tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VCC G VI VO VM VI positive pulse GND VM DUT RT CL 001aah768 Test data is given in Table 10. Definitions test circuit: RT = termination resistance should be equal to output impedance Zo of the pulse generator. CL = load capacitance including jig and probe capacitance. Fig 11. Load circuitry for measuring switching times Table 10. Type 74AHC259 74AHCT259 Test data Input VI VCC 3.0 V tr, tf ≤ 3.0 ns ≤ 3.0 ns Load CL 15 pF, 50 pF 15 pF, 50 pF tPLH, tPHL tPLH, tPHL Test 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 12 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch 12. Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index θ Lp 1 e bp 8 wM L detail X A1 (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ 0.010 0.057 0.069 0.004 0.049 0.019 0.0100 0.39 0.014 0.0075 0.38 0.244 0.041 0.228 0.028 0.004 0.012 8 o 0 o ISSUE DATE 99-12-27 03-02-19 Fig 12. Package outline SOT109-1 (SO16) 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 13 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 D E A X c y HE vMA Z 16 9 Q A2 pin 1 index A1 θ Lp L (A 3) A 1 e bp 8 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 θ 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 13. Package outline SOT403-1 (TSSOP16) 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 14 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch 13. Abbreviations Table 11. Acronym CDM CMOS DUT ESD HBM LSTTL MM Abbreviations Description Charged Device Model Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Low-power Schottky Transistor-Transistor Logic Machine Model 14. Revision history Table 12. Revision history Release date 20080515 Data sheet status Product data sheet Change notice Supersedes 74AHC_AHCT259_1 Document ID 74AHC_AHCT259_2 Modifications: • • • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 6: the conditions for input leakage current have been changed. Product specification - 74AHC_AHCT259_1 20000314 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 15 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT259_2 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 02 — 15 May 2008 16 of 17 NXP Semiconductors 74AHC259; 74AHCT259 8-bit addressable latch 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 May 2008 Document identifier: 74AHC_AHCT259_2