74AHCT1G14GW,165

74AHC1G14; 74AHCT1G14 Inverting Schmitt trigger Rev. 06 — 18 May 2009 Product data sheet 1. General description 74AHC1G14 and 74AHCT1G14 are high-speed Si-gate CMOS devices. They provide an inverting buffer function with Schmitt trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. 2. Features n Symmetrical output impedance n High noise immunity n ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Low power dissipation n Balanced propagation delays n SOT353-1 and SOT753 package options n Specified from −40 °C to +125 °C 3. Applications n Wave and pulse shapers n Astable multivibrators n Monostable multivibrators 4. Ordering information Table 1. Ordering information Type number 74AHC1G14GW Package Temperature range Name Description Version −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74AHCT1G14GW 74AHC1G14GV 74AHCT1G14GV 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 5. Marking Table 2. Marking codes Type number Marking code 74AHC1G14GW AF 74AHCT1G14GW CF 74AHC1G14GV A14 74AHCT1G14GV C14 6. Functional diagram A 2 Y 4 2 4 Y mna025 mna024 mna023 Fig 1. Logic symbol A Fig 2. IEC logic symbol Fig 3. Logic diagram 7. Pinning information 7.1 Pinning 74AHC1G14 74AHCT1G14 n.c. 1 A 2 GND 3 5 VCC 4 Y 001aaf087 Fig 4. Pin configuration 7.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 2 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 8. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L H H L 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage VI input voltage IIK input clamping current VI < −0.5 V IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V IO output current −0.5 V < VO < VCC + 0.5 V [1] Min Max Unit −0.5 +7.0 V −0.5 +7.0 V −20 - mA - ±20 mA - ±25 mA ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74AHC1G14 Min Typ 74AHCT1G14 Max Min Typ Unit Max VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 - 5.5 0 - 5.5 V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 3 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max HIGH-level VI = VT+ or VT− output voltage IO = −50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = −50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = −50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = −4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = −8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VT+ or VT− output voltage IO = 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V For type 74AHC1G14 VOH VOL IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA input capacitance - 1.5 10 - 10 - 10 pF 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V II input leakage current ICC CI VI = 5.5 V or GND; VCC = 0 V to 5.5 V For type 74AHCT1G14 VOH HIGH-level VI = VT+ or VT−; VCC = 4.5 V output voltage IO = −50 µA IO = −8.0 mA VOL LOW-level VI = VT+ or VT−; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA VI = 5.5 V or GND; VCC = 0 V to 5.5 V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA ∆ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 4 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 3.0 V - - 2.2 - 2.2 - 2.2 V VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V VCC = 5.5 V - - 3.85 - 3.85 - 3.85 V For type 74AHC1G14 VT+ VT− VH positive-going threshold voltage negative-going threshold voltage hysteresis voltage VCC = 3.0 V 0.9 - - 0.9 - 0.9 - V VCC = 4.5 V 1.35 - - 1.35 - 1.35 - V VCC = 5.5 V 1.65 - - 1.65 - 1.65 - V VCC = 3.0 V 0.3 - 1.2 0.3 1.2 0.25 1.2 V VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.5 - 1.6 0.5 1.6 0.45 1.6 V VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V For type 74AHCT1G14 VT+ VT− VH positive-going threshold voltage negative-going threshold voltage hysteresis voltage 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 5 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; tr = tf ≤ 3.0 ns. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max - 4.2 12.8 1.0 15.0 1.0 16.5 ns - 6.0 16.3 1.0 18.5 1.0 20.5 ns - 3.2 8.6 1.0 10.0 1.0 11.0 ns - 4.6 10.6 1.0 12.0 1.0 13.5 ns - 12 - - - - - pF - 4.1 7.0 1.0 8.0 1.0 9.0 ns - 5.9 8.5 1.0 10.0 1.0 11.0 ns - 13 - - - - - pF For type 74AHC1G14 tpd propagation delay A to Y; VCC = 3.0 V to 3.6 V [1] [2] CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V [3] CL = 15 pF CL = 50 pF CPD power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC [4] For type 74AHCT1G14 tpd propagation delay A to Y; VCC = 4.5 V to 5.5 V [1] [3] CL = 15 pF CL = 50 pF CPD power per buffer; dissipation VI = GND to VCC capacitance [4] [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 6 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 13. Waveforms VM A input VCC tPHL tPLH VI PULSE GENERATOR VM Y output VO DUT CL RT mna101 mna033 The test data is given in Table 10 Test data is given in Table 9. Definitions for test circuit: CL = Load capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 5. The input (A) to output (Y) propagation delays Table 10. Fig 6. Load circuitry for switching times Test data Type number Input Output VI VM VM 74AHC1G14 GND to VCC 0.5 × VCC 0.5 × VCC 74AHCT1G14 GND to 3.0 V 1.5 V 0.5 × VCC 13.1 Transfer characteristic waveforms VO VI VT+ VH VT− VH VT− VO VI VT+ Fig 7. Transfer characteristic mna027 mna026 Fig 8. The definitions of VT+, VT− and VH 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 7 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger mna401 1.5 mna402 5 ICC (mA) ICC (mA) 4 1 3 2 0.5 1 0 0 0 Fig 9. 1 2 VI (V) 3 1 0 Typical 74AHC1G14 transfer characteristics; VCC = 3.0 V 2 3 4 V (V) 5 I Fig 10. Typical 74AHC1G14 transfer characteristics; VCC = 4.5 V mna403 8 ICC (mA) 6 4 2 0 0 2 4 VI (V) 6 Fig 11. Typical 74AHC1G14 transfer characteristics; VCC = 5.5 V 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 8 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger mna404 5 mna405 8 ICC (mA) ICC (mA) 4 6 3 4 2 2 1 0 0 0 1 2 3 4 V (V) 5 I Fig 12. Typical 74AHCT1G14 transfer characteristics; VCC = 4.5 V 0 2 4 VI (V) 6 Fig 13. Typical 74AHCT1G14 transfer characteristics; VCC = 5.5 V 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula: Padd = fi × (tr × ∆ICC(AV) + tf × ∆ICC(AV)) × VCC where: Padd = additional power dissipation (µW); fi = input frequency (MHz); tr = input rise time (ns); 10 % to 90 %; tf = input fall time (ns); 90 % to 10 %; ∆ICC(AV) = average additional supply current (µA). Average additional ICC differs with positive or negative input transitions, as shown in Figure 14 and Figure 15. For 74AHC1G14 and 74AHCT1G14 used in relaxation oscillator circuit, see Figure 16. Note to the application information: 1. All values given are typical unless otherwise specified. 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 9 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger mna036 200 mna058 200 ∆ICC(AV) (µA) ∆ICC(AV) (µA) 150 150 positive-going edge positive-going edge 100 100 50 50 negative-going edge negative-going edge 0 0 0 2.0 4.0 VCC (V) 0 6.0 Fig 14. Average additional ICC for 74AHC1G14 Schmitt trigger devices; linear change of VI between 0.1VCC to 0.9VCC 2 4 VCC (V) 6 Fig 15. Average additional ICC for 74AHCT1G14 Schmitt trigger devices; linear change of VI between 0.1VCC to 0.9VCC R C mna035 1 T 1 0.55 × RC For 74AHC1G14: f = --- ≈ ------------------------- 1 T 1 0.60 × RC For 74AHCT1G14: f = --- ≈ ------------------------- Fig 16. Relaxation oscillator using the 74AHC1G14 and 74AHCT1G14 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 10 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 17. Package outline SOT353-1 (TSSOP5) 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 11 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 18. Package outline SOT753 (SC-74A) 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 12 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 16. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 17. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AHC_AHCT1G14_6 20090518 Product data sheet - 74AHC_AHCT1G14_5 Modifications: • Table 7: the conditions for HIGH-level output voltage and LOW-level output voltage have been changed. 74AHC_AHCT1G14_5 20070629 Product data sheet - 74AHC_AHCT1G14_4 74AHC_AHCT1G14_4 20020528 Product specification - 74AHC_AHCT1G14_3 74AHC_AHCT1G14_3 20020218 Product specification - 74AHC_AHCT1G14_2 74AHC_AHCT1G14_2 20010222 Product specification - 74AHC_AHCT1G14_1 74AHC_AHCT1G14_1 19990805 Product specification - - 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 13 of 15 74AHC1G14; 74AHCT1G14 NXP Semiconductors Inverting Schmitt trigger 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AHC_AHCT1G14_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 18 May 2009 14 of 15 NXP Semiconductors 74AHC1G14; 74AHCT1G14 Inverting Schmitt trigger 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Transfer characteristics . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Transfer characteristic waveforms. . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 May 2009 Document identifier: 74AHC_AHCT1G14_6