74ALVC04PW,118

INTEGRATED CIRCUITS DATA SHEET 74ALVC04 Hex inverter Product specification Supersedes data of 2003 Feb 04 2003 May 14 Philips Semiconductors Product specification Hex inverter 74ALVC04 FEATURES DESCRIPTION • Wide supply voltage range form 1.65 to 3.6 V The 74ALVC04 is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families. • 3.6 V tolerant inputs/outputs • CMOS low power consumption Schmitt-trigger action at all inputs makes the circuit tolerant for slower input rise and fall times. • Direct interface with TTL levels (2.7 to 3.6 V) • Power-down mode The 74ALVC04 provides six inverting buffers. • Latch-up performance exceeds 250 mA • Complies with JEDEC standard: JESD8-7 (1.65 to 1.95 V) JESD8-5 (2.3 to 2.7 V) JESD8B/JESD36 (2.7 to 3.6 V). • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C. SYMBOL tPHL/tPLH PARAMETER propagation delay nA to nY CI input capacitance CPD power dissipation capacitance per buffer CONDITIONS UNIT VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ 2.4 ns VCC = 2.5 V; CL = 30 pF; RL = 500 Ω 1.8 ns VCC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.3 ns VCC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.0 ns 3.5 pF 26 pF VCC = 3.3 V; notes 1 and 2 Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. 2. The condition is VI = GND to VCC. 2003 May 14 TYPICAL 2 Philips Semiconductors Product specification Hex inverter 74ALVC04 ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE SO14 plastic SOT108-1 74ALVC04D −40 to +85 °C 14 74ALVC04PW −40 to +85 °C 14 TSSOP14 plastic SOT402-1 74ALVC04BQ −40 to +85 °C 14 DHVQFN14 plastic SOT762-1 FUNCTION TABLE See note 1. INPUT OUTPUT nA nY L H H L Note 1. H = HIGH voltage level; a) L = LOW voltage level. PINNING PIN SYMBOL DESCRIPTION 1 1A data input 2 1Y data output 3 2A data input 1A 1 14 VCC 4 2Y data output 1Y 2 13 6A 5 3A data input 2A 3 12 6Y 6 3Y data output 2Y 4 7 GND ground (0 V) 3A 5 10 5Y 8 4Y data output 9 4A data input 3Y 6 9 10 5Y data output GND 7 8 4Y 11 5A data input 12 6Y data output 13 6A data input 14 VCC supply voltage 2003 May 14 handbook, halfpage 04 11 5A 4A MNA340 Fig.1 Pin configuration SO14 and TSSOP14. 3 Philips Semiconductors Product specification Hex inverter 74ALVC04 handbook, halfpage 1A VCC 1 14 1Y 2 13 6A 2A 3 12 6Y 2Y 4 11 5A handbook, halfpage GND(1) Y A MNA341 3A 5 10 5Y 3Y 6 9 4A Top view 7 8 GND 4Y MBL760 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin of input. Fig.2 Pin configuration DHVQFN14. Fig.3 Logic diagram (one inverter). handbook, halfpage 1 1 2 handbook, halfpage 1 1A 1Y 2 3 2A 2Y 4 5 3A 3Y 6 9 4A 4Y 8 3 5 9 11 5A 5Y 10 13 6A 6Y 12 11 13 MNA342 1 4 1 6 1 8 1 10 1 12 MNA343 Fig.4 Logic symbol. 2003 May 14 Fig.5 IEC logic symbol. 4 Philips Semiconductors Product specification Hex inverter 74ALVC04 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage 1.65 3.6 V VI input voltage 0 3.6 V VO output voltage VCC = 1.65 to 3.6 V 0 VCC V VCC = 0 V; Power-down mode 0 3.6 V Tamb operating ambient temperature −40 +85 °C tr, tf input rise and fall times VCC = 1.65 to 2.7 V 0 20 ns/V VCC = 2.7 to 3.6 V 0 10 ns/V LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL PARAMETER VCC supply voltage IIK input diode current VI input voltage IOK output diode current VO output voltage CONDITIONS VI < 0 VO > VCC or VO < 0 MIN. MAX. UNIT −0.5 +4.6 V − −50 mA −0.5 +4.6 V − ±50 mA notes 1 and 2 −0.5 VCC + 0.5 V Power-down mode; note 2 −0.5 +4.6 V VO = 0 to VCC − ±50 mA IO output source or sink current ICC, IGND VCC or GND current − ±100 mA Tstg storage temperature −65 +150 °C Ptot power dissipation − 500 mW Tamb = −40 to +85 °C; note 3 Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation. 3. For SO14 packages: above 70 °C derate linearly with 8 mW/K. a) For TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K. b) For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K. 2003 May 14 5 Philips Semiconductors Product specification Hex inverter 74ALVC04 DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER MIN. OTHER TYP.(1) MAX. UNIT VCC (V) Tamb = −40 to +85 °C VIH VIL VOL VOH HIGH-level input voltage HIGH-level output voltage − V 1.7 − − V 2 − − V 2.7 to 3.6 1.65 to 1.95 − − 0.35 × VCC V 2.3 to 2.7 − − 0.7 V 2.7 to 3.6 − − 0.8 V IO = 100 µA 1.65 to 3.6 − − 0.2 V IO = 6 mA 1.65 − 0.11 0.3 V IO = 12 mA 2.3 − 0.17 0.4 V IO = 18 mA 2.3 − 0.25 0.6 V IO = 12 mA 2.7 − 0.16 0.4 V IO = 18 mA 3.0 − 0.23 0.4 V IO = 24 mA 3.0 − 0.30 0.55 V IO = −100 µA 1.65 to 3.6 VCC − 0.2 − − V IO = −6 mA 1.65 1.25 1.51 − V IO = −12 mA 2.3 1.8 2.10 − V IO = −18 mA 2.3 1.7 2.01 − V IO = −12 mA 2.7 2.2 2.53 − V IO = −18 mA 3.0 2.4 2.76 − V IO = −24 mA 3.0 2.2 2.68 − V VI = 3.6 V or GND 3.6 − ±0.1 ±5 µA LOW-level input voltage LOW-level output voltage 1.65 to 1.95 0.65 × VCC − 2.3 to 2.7 VI = VIH or VIL VI = VIH or VIL ILI input leakage current Ioff power OFF leakage VI or VO = 3.6 V current 0.0 − ±0.1 ±10 µA ICC quiescent supply current VI = VCC or GND; IO = 0 3.6 − 0.2 20 µA ∆ICC additional quiescent supply current per input pin VI = VCC − 0.6 V; IO = 0 3.0 to 3.6 − 5 750 µA Note 1. All typical values are measured at Tamb = 25 °C. 2003 May 14 6 Philips Semiconductors Product specification Hex inverter 74ALVC04 AC CHARACTERISTICS TEST CONDITIONS SYMBOL PARAMETER MIN. WAVEFORMS TYP.(1) MAX. UNIT VCC (V) Tamb = −40 to +85 °C tPHL/tPLH propagation delay nA to nY see Figs 6 and 7 1.65 to 1.95 1.0 2.4 4.4 ns 2.3 to 2.7 1.0 1.8 3.0 ns 2.7 1.0 2.3 3.3 ns 3.0 to 3.6 1.0 2.0 2.8 ns Note 1. All typical values are measured at Tamb = 25 °C. AC WAVEFORMS handbook, halfpage VI VM nA input GND t PHL t PLH VOH VM nY output VOL MNA344 INPUT VCC VM VI tr = tf 1.65 to 1.95 V 0.5 × VCC VCC ≤ 2.0 ns 2.3 to 2.7 V 0.5 × VCC VCC ≤ 2.0 ns 2.7 V 1.5 V 2.7 V ≤ 2.5 ns 3.0 to 3.6 V 1.5 V 2.7 V ≤ 2.5 ns Fig.6 Inputs nA to output nY propagation delay times. 2003 May 14 7 Philips Semiconductors Product specification Hex inverter 74ALVC04 VEXT handbook, full pagewidth VCC PULSE GENERATOR VI RL VO D.U.T. CL RT RL MNA616 VCC VI CL RL VEXT tPLH/tPHL tPZH/tPHZ tPZL/tPLZ 1.65 to 1.95 V VCC 30 pF 1 kΩ open GND 2 × VCC 2.3 to 2.7 V VCC 30 pF 500 Ω open GND 2 × VCC 2.7 V 2.7 V 50 pF 500 Ω open GND 6V 3.0 to 3.6 V 2.7 V 50 pF 500 Ω open GND 6V Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.7 Load circuitry for switching times. 2003 May 14 8 Philips Semiconductors Product specification Hex inverter 74ALVC04 PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.05 0.028 0.024 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.244 0.039 0.041 0.228 0.016 θ Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2003 May 14 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 9 o 8 0o Philips Semiconductors Product specification Hex inverter 74ALVC04 TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 2003 May 14 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 MO-153 10 o Philips Semiconductors Product specification Hex inverter 74ALVC04 DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B w M C b L 1 7 Eh e 14 8 13 9 Dh X 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 1.65 1.35 2.6 2.4 1.15 0.85 0.5 2 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT762-1 --- MO-241 --- 2003 May 14 11 EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 Philips Semiconductors Product specification Hex inverter 74ALVC04 If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferably be kept: Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. • below 220 °C for all the BGA packages and packages with a thickness ≥ 2.5mm and packages with a thickness