74LVC3G07DC

74LVC3G07 Triple buffer with open-drain output Rev. 06 — 16 June 2008 Product data sheet 1. General description The 74LVC3G07 provides three non-inverting buffers. The output of the device is an open-drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features I I I I Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant input/output for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: N JESD8-7 (1.65 V to 1.95 V) N JESD8-5 (2.3 V to 2.7 V) N JESD8-B/JESD36 (2.7 V to 3.6 V). ESD protection: N HBM JESD22-A114E exceeds 2000 V N MM JESD22-A115-A exceeds 200 V −24 mA output drive (VCC = 3.0 V) CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Inputs accept voltages up to 5 V Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C. I I I I I I I I NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 3. Ordering information Table 1. Ordering information Package Temperature range 74LVC3G07DP 74LVC3G07DC 74LVC3G07GT −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C Name TSSOP8 VSSOP8 XSON8 XSON8U XQFN8U Description plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm plastic very thin shrink small outline package; 8 leads; body width 2.3 mm plastic extremely thin small outline package; no leads; 8 terminals; body 1 × 1.95 × 0.5 mm plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 × 2 × 0.5 mm plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 × 1.6 × 0.5 mm Version SOT505-2 SOT765-1 SOT833-1 SOT996-2 SOT902-1 Type number 74LVC3G07GD −40 °C to +125 °C 74LVC3G07GM −40 °C to +125 °C 4. Marking Table 2. Marking codes Marking code V07 V07 V07 V07 V07 Type number 74LVC3G07DP 74LVC3G07DC 74LVC3G07GT 74LVC3G07GD 74LVC3G07GM 5. Functional diagram 1 1A 1Y 1A 1Y 1 2A 2Y 2A 2Y Y 3A 3Y 3A 001aah762 1 3Y 001aah763 A GND mna591 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one driver) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 2 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 6. Pinning information 6.1 Pinning 74LVC3G07 1A 1 8 VCC 3Y 2 7 1Y 74LVC3G07 1A 3Y 2A GND 1 2 3 4 001aab022 8 7 6 5 VCC 1Y 3A 2Y 2A 3 6 3A GND 4 5 2Y 001aac022 Transparent top view Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 5. Pin configuration SOT833-1 (XSON8) 74LVC3G07 terminal 1 index area 1Y 1 VCC 8 74LVC3G07 1A 3Y 2A GND 1 2 3 4 8 7 6 5 VCC 7 1A 3A 1Y 3A 2Y 2Y 2 6 3Y 3 4 5 2A GND 001aag243 001aai252 Transparent top view Transparent top view Fig 6. Pin configuration SOT996-2 (XSON8U) Fig 7. Pin configuration SOT902-1 (XQFN8U) 6.2 Pin description Table 3. Symbol Pin description Pin SOT505-2, SOT765-1, SOT833-1 and SOT996-2 1A, 2A, 3A GND 1Y, 2Y, 3Y VCC 1, 3, 6 4 7, 5, 2 8 SOT902-1 7, 5, 2 4 1, 3, 6 8 data input ground (0 V) data output supply voltage Description 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 3 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 7. Functional description Table 4. Input nA L H [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. Function table[1] Output nY L Z 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Tstg Ptot [1] [2] [3] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current storage temperature total power dissipation Conditions VI < 0 V [1] Min −0.5 −50 −0.5 −50 [1] [1][2] Max +6.5 +6.5 +6.5 +6.5 50 100 +150 250 Unit V mA V mA V V mA mA mA °C mW VO < 0 V Active mode Power-down mode VO = 0 V to 6.5 V −0.5 −0.5 −100 −65 Tamb = −40 °C to +125 °C [3] - The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K. For XSON8, XSON8U and XQFN8U packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Symbol VCC VI VO Tamb ∆t/∆V Operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Active mode Power-down mode; VCC = 0 V Conditions Min 1.65 0 0 0 −40 Max 5.5 5.5 5.5 5.5 +125 20 10 Unit V V V V °C ns/V ns/V 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 4 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter °C[1] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOZ IOFF ICC ∆ICC CI input leakage current OFF-state output current power-off leakage current supply current additional supply current input capacitance VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A [2] [2] Conditions Min Typ Max 0.7 0.8 0.3 × VCC 0.1 0.45 0.3 0.4 0.55 0.55 ±5 ±10 ±10 10 500 - Unit V V V V V V V V V V V V V µA µA µA µA µA pF Tamb = −40 °C to +85 HIGH-level input voltage 0.65 × VCC 1.7 2.0 0.7 × VCC ±0.1 ±0.1 ±0.1 0.1 5 2.5 0.35 × VCC V 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 5 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOZ IOFF ICC ∆ICC input leakage current OFF-state output current power-off leakage current supply current additional supply current VI = 5.5 V or GND; VCC = 0 V to 5.5 V VI = VIH or VIL; VO = VCC or GND; VCC = 5.5 V VI or VO = 5.5 V; VCC = 0 V VI = 5.5 V or GND; IO = 0 A; VCC = 1.65 V to 5.5 V per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A 0.1 0.70 0.45 0.60 0.80 0.80 ±20 ±10 ±20 40 5000 V V V V V V µA µA µA µA µA Min Typ Max 0.7 0.8 0.3 × VCC Unit V V V V V V V Tamb = −40 °C to +125 °C 0.65 × VCC 1.7 2.0 0.7 × VCC - 0.35 × VCC V [1] [2] All typical values are measured at Tamb = 25 °C. These typical values are measured at VCC = 3.3 V. 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 6 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9. Symbol Parameter tpd Conditions [2] −40 °C to +85 °C Min Typ[1] 2.9 1.7 2.3 2.1 1.5 6.5 Max 6.7 4.3 4.2 3.7 2.9 - −40 °C to +125 °C Min 1.0 0.5 1.0 0.5 0.5 Max 8.4 5.5 5.3 4.7 3.7 - Unit propagation delay nA to nY; see Figure 8 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.0 0.5 1.0 0.5 0.5 [3] ns ns ns ns ns pF CPD power dissipation capacitance VI = GND to VCC; VCC = 3.3 V - [1] [2] [3] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. tpd is the same as tPLZ and tPZL. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. 12. Waveforms VI nA input GND t PLZ VCC nY output VOL VX mna528 VM VM t PZL VM Measurement points are given in Table 9. VOL is the typical output voltage drop that occur with the output load. Fig 8. The input (nA) to output (nY) propagation delays 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 7 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output Table 9. VCC Measurement points Input VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC Output VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC VX VOL + 0.15 V VOL + 0.15 V VOL + 0.3 V VOL + 0.3 V VOL + 0.3 V Supply voltage 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V VEXT VCC VI VO DUT RT CL RL RL G mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 9. Table 10. VCC Load circuit for measuring switching times Test data Input VI VCC VCC 2.7 V 2.7 V VCC tr = tf ≤ 2.0 ns ≤ 2.0 ns ≤ 2.5 ns ≤ 2.5 ns ≤ 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 kΩ 500 Ω 500 Ω 500 Ω 500 Ω VEXT tPZL, tPLZ 2 × VCC 2 × VCC 6V 6V 2 × VCC Supply voltage 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 8 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 D E A X c y HE vMA Z 8 5 A pin 1 index A2 A1 (A3) Lp L θ 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 θ 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 Fig 10. Package outline SOT505-2 (TSSOP8) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 9 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 D E A X c y HE vMA Z 8 5 Q A pin 1 index A2 A1 (A3) θ Lp L 1 e bp 4 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 θ 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 Fig 11. Package outline SOT765-1 (VSSOP8) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 10 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm SOT833-1 1 2 3 b 4 4× L (2) L1 e 8 e1 7 e1 6 e1 5 8× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max 0.5 A1 max 0.04 b 0.25 0.17 D 2.0 1.9 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT833-1 REFERENCES IEC --JEDEC MO-252 JEITA --EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 12. Package outline SOT833-1 (XSON8) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 11 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm SOT996-2 D B A E A A1 detail X terminal 1 index area e1 L1 1 e b 4 v w M M CAB C C y1 C y L2 L 8 5 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1 OUTLINE VERSION SOT996-2 REFERENCES IEC --JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 13. Package outline SOT996-2 (XSON8U) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 12 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm SOT902-1 D terminal 1 index area B A E A A1 detail X L1 L e 4 e ∅v M C A B ∅w M C 5 C y1 C y 3 metal area not for soldering 2 6 b e1 e1 7 1 terminal 1 index area 8 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 1.65 1.55 E 1.65 1.55 e 0.55 e1 0.5 L 0.35 0.25 L1 0.15 0.05 v 0.1 w 0.05 y 0.05 y1 0.05 OUTLINE VERSION SOT902-1 REFERENCES IEC --JEDEC MO-255 JEITA --- EUROPEAN PROJECTION ISSUE DATE 05-11-25 07-11-14 Fig 14. Package outline SOT902-1 (XQFN8U) 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 13 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 14. Abbreviations Table 11. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20080616 Data sheet status Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet Change notice Supersedes 74LVC3G07_5 74LVC3G07_4 74LVC3G07_3 74LVC3G07_2 74LVC3G07_1 Document ID 74LVC3G07_6 Modifications: 74LVC3G07_5 74LVC3G07_4 74LVC3G07_3 74LVC3G07_2 74LVC3G07_1 • Added type number 74LVC3G07GD (XSON8U package) 20080219 20070521 20050201 20041027 20040608 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 14 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74LVC3G07_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 16 June 2008 15 of 16 NXP Semiconductors 74LVC3G07 Triple buffer with open-drain output 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 June 2008 Document identifier: 74LVC3G07_6