BB179BLX

BB179BLX UHF variable capacitance diode Rev. 01 — 29 January 2009 Product data sheet 1. Product profile 1.1 General description The BB179BLX is a planar technology variable capacitance diode in a SOD882T ultra small leadless plastic SMD package. The excellent matching performance is achieved by gliding matching and a Direct Matching Assembly (DMA) procedure. 1.2 Features I I I I I Excellent linearity Excellent matching to 2 % DMA Ultra small leadless SMD package Cd(28V) :2.1 pF; Cd(1V) to Cd(28V) ratio typical 9 Low series resistance 1.3 Applications I Voltage Controlled Oscillators (VCO) I Electronic tuning in UHF television tuners 2. Pinning information Table 1. Pin 1 2 Pinning Description cathode anode 1 2 sym008 Simplified outline [1] Graphic symbol Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Package Name BB179BLX Description leadless ultra small plastic package; 2 terminals; body 1.0 × 0.6 × 0.4 mm Version SOD882T Type number NXP Semiconductors BB179BLX UHF variable capacitance diode 4. Marking Table 3. BB179BLX Marking codes Marking code L5 Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VR IF Tstg Tj Parameter reverse voltage forward current storage temperature junction temperature Conditions Min −55 −55 Max 32 20 +150 +125 Unit V mA °C °C 6. Characteristics Table 5. Symbol IR Characteristics Parameter reverse current Conditions see Figure 3 VR = 30 V VR = 30 V; Tj = 85 °C rs Cd diode series resistance diode capacitance f = 470 MHz at Cd = 9 pF; see Figure 2 f = 1 MHz; see Figure 1 and Figure 4 VR = 1 V VR = 28 V Cd(1V)/Cd(2V) Cd(1V)/Cd(28V) ∆Cd/Cd diode capacitance ratio (1 V to 2 V) diode capacitance ratio (1 V to 28 V) f = 1 MHz f = 1 MHz f = 1 MHz VR = 1 V to 28 V; in sequence of 5 diodes (gliding) 18.22 1.9 8.45 2.1 1.27 9 1.05 20 2.25 10.9 2 % pF pF 0.65 10 200 nA nA Ω Min Typ Max Unit Cd(25V)/Cd(28V) diode capacitance ratio (25 V to 28 V) diode capacitance matching BB179BLX_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 29 January 2009 2 of 7 NXP Semiconductors BB179BLX UHF variable capacitance diode 30 Cd (pF) 20 001aaj480 0.8 rs (Ω) 0.6 001aaj481 0.4 10 0.2 0 10−1 1 10 VR (V) 102 0 10−1 1 10 VR (V) 102 f = 1 MHz; Tj = 25 °C. f = 470 MHz; Tj = 25 °C. Fig 1. Diode capacitance as a function of reverse voltage; typical values 001aaj482 Fig 2. Diode serial resistance as a function of reverse voltage; typical values 001aaj483 103 IR (nA) 102 10−2 TCCd (K−1) 10−3 10 10−4 1 0 20 40 60 80 Tj (°C) 100 10−5 10−1 1 10 VR (V) 102 Tj = 0 °C to 85 °C. Fig 3. Reverse current as a function of junction temperature; maximum values Fig 4. Temperature coefficient of diode capacitance as a function of reverse voltage; typical values BB179BLX_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 29 January 2009 3 of 7 NXP Semiconductors BB179BLX UHF variable capacitance diode 7. Package outline Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm (2 ×) w M SOD882T L1 (2×) A 1 2 b (2 ×) (2 ×) w e1 M B A A1 y E A D (1) B 0 DIMENSIONS (mm are the original dimensions) UNIT mm A 0.40 0.36 A1 max 0.04 b 0.55 0.45 D 0.65 0.55 E 1.05 0.95 e1 0.65 L1 0.30 0.22 w 0.1 y 0.03 0.5 scale 1 mm Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD882T REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-12-14 06-04-12 Fig 5. BB179BLX_1 Package outline SOD882T © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 29 January 2009 4 of 7 NXP Semiconductors BB179BLX UHF variable capacitance diode 8. Abbreviations Table 6. Acronym SMD UHF Abbreviations Description Surface Mounted Device Ultra High Frequency 9. Revision history Table 7. Revision history Release date 20090129 Data sheet status Product data sheet Change notice Supersedes Document ID BB179BLX_1 BB179BLX_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 29 January 2009 5 of 7 NXP Semiconductors BB179BLX UHF variable capacitance diode 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BB179BLX_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 29 January 2009 6 of 7 NXP Semiconductors BB179BLX UHF variable capacitance diode 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 January 2009 Document identifier: BB179BLX_1