BC546B

BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors Rev. 07 — 17 November 2009 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages. Table 1. Product overview Package NXP BC846 BC846W BC846T BC546A[2] BC546B[2] [1] [2] Type number[1] JEITA SC-70 SC-75 SC-43A SC-43A JEDEC TO-236AB TO-92 TO-92 PNP complement BC856 BC856W BC856T BC556A BC556B SOT23 SOT323 SOT416 SOT54 SOT54 Valid for all available selection groups. Also available in SOT54A and SOT54 variant packages (see Section 2). 1.2 Features General-purpose transistors SMD plastic packages Two different gain selections 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 2. Symbol VCEO IC hFE Quick reference data Parameter collector-emitter voltage collector current DC current gain hFE group A hFE group B VCE = 5 V; IC = 2 mA Conditions open base Min 110 110 200 Typ 180 290 Max 65 100 450 220 450 Unit V mA NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 2. Pinning information Table 3. Pin 1 2 3 Pinning Description base emitter collector 1 2 006aaa144 Simplified outline Symbol SOT23; SOT323; SOT416 3 1 2 sym021 3 SOT54 1 2 3 emitter base collector 1 2 3 001aab347 3 2 1 sym026 SOT54A 1 2 3 emitter base collector 1 2 3 001aab348 3 2 1 sym026 SOT54 variant 1 2 3 emitter base collector 1 2 3 001aab447 3 2 1 sym026 BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 2 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 3. Ordering information Table 4. Ordering information Package Name BC846 BC846W BC846T BC546A[2] BC546B[2] [1] [2] Type number[1] Description plastic surface mounted package; 3 leads plastic surface mounted package; 3 leads plastic surface mounted package; 3 leads plastic single-ended leaded (through hole) package; 3 leads plastic single-ended leaded (through hole) package; 3 leads Version SOT23 SOT323 SOT416 SOT54 SOT54 SC-70 SC-75 SC-43A SC-43A Valid for all available selection groups. Also available in SOT54 and SOT54 variant packages (see Section 2 and Section 9). 4. Marking Table 5. BC846 BC846A BC846B BC846W BC846AW BC846BW [1] Marking codes Marking code[1] 1D* 1A* 1B* 1D* 1A* 1B* Type number BC846T BC846AT BC846BT BC546A BC546B Marking code[1] 1M 1A 1B C546A C546B - Type number * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 3 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation SOT23 SOT323 SOT416 SOT54 Tj Tamb Tstg [1] Conditions open emitter open base open collector single pulse; tp ≤ 1 ms single pulse; tp ≤ 1 ms Tamb ≤ 25 °C [1] Min - Max 80 65 6 100 200 200 Unit V V V mA mA mA −65 −65 250 200 150 500 150 +150 +150 mW mW mW mW °C °C °C junction temperature ambient temperature storage temperature Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SOT23 SOT323 SOT416 SOT54 [1] Conditions in free air [1] Min Typ Max Unit - - 500 625 833 250 K/W K/W K/W K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 4 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter ICBO Conditions Min Typ Max 15 5 100 Unit nA μA nA collector-base cut-off VCB = 30 V; IE = 0 A current VCB = 30 V; IE = 0 A; Tj = 150 °C emitter-base cut-off current DC current gain hFE group A hFE group B DC current gain hFE group A hFE group B VCEsat VBEsat VBE fT Cc Ce NF collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage transition frequency VCE = 5 V; IC = 10 μA VCE = 5 V; IC = 10 μA VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 2 mA VCE = 5 V; IC = 2 mA IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA IC = 2 mA; VCE = 5 V IC = 10 mA; VCE = 5 V VCE = 5 V; IC = 10 mA; f = 100 MHz [1] [2] [2] [3] [3] IEBO hFE VEB = 5 V; IE = 0 A 110 110 200 580 100 - 180 290 180 290 90 200 760 900 660 2 11 2 450 220 450 200 400 700 770 3 10 mV mV mV mV mV mV MHz pF pF dB collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz emitter capacitance noise figure VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz IC = 200 μA; VCE = 5 V; RS = 2 kΩ; f = 1 kHz; B = 200 Hz [1] [2] [3] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. VBEsat decreases by approximately 1.7 mV/K with increasing temperature. VBE decreases by approximately 2 mV/K with increasing temperature. BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 5 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 400 hFE (1) mgt723 1200 VBE (mV) 1000 (1) mgt724 300 800 (2) 200 (2) 600 (3) (3) 400 100 200 0 10−1 1 10 102 I C (mA) 103 0 10−1 1 10 102 I C (mA) 103 VCE = 5 V (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C VCE = 5 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig 1. Selection A: DC current gain as a function of collector current; typical values 103 mgt725 Fig 2. Selection A: Base-emitter voltage as a function of collector current; typical values mgt726 VCEsat (mV) 1200 VBEsat (mV) 1000 (1) 800 (2) 102 (1) (2) (3) 600 (3) 400 200 10 10−1 1 10 102 I C (mA) 103 0 10−1 1 10 102 I C (mA) 103 IC/IB = 20 (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig 3. Selection A: Collector-emitter saturation voltage as a function of collector current; typical values Fig 4. Selection A: Base-emitter saturation voltage as a function of collector current; typical values BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 6 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 600 hFE 500 (1) mgt727 1200 VBE (mV) 1000 (1) mgt728 400 (2) 800 (2) 300 600 (3) 200 (3) 400 100 200 0 10−1 1 10 102 I C (mA) 103 0 10−2 10−1 1 10 102 103 I C (mA) VCE = 5 V (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C VCE = 5 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig 5. Selection B: DC current gain as a function of collector current; typical values 104 mgt729 Fig 6. Selection B: Base-emitter voltage as a function of collector current; typical values mgt730 VCEsat (mV) 103 1200 VBEsat (mV) 1000 (1) 800 (2) 600 (3) 102 (1) (3) (2) 400 200 10 10−1 1 10 102 I C (mA) 103 0 10−1 1 10 102 I C (mA) 103 IC/IB = 20 (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig 7. Selection B: Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. Selection B: Base-emitter saturation voltage as a function of collector current; typical values BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 7 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 8. Package outline 3.0 2.8 3 1.1 0.9 2.2 1.8 3 0.45 0.15 1.1 0.8 0.45 0.15 2.5 1.4 2.1 1.2 2.2 1.35 2.0 1.15 1 2 1 0.48 0.38 0.15 0.09 04-11-04 Dimensions in mm 2 0.4 0.3 1.3 04-11-04 0.25 0.10 1.9 Dimensions in mm Fig 9. Package outline SOT23 (TO-236AB) 1.8 1.4 3 0.45 0.15 0.95 0.60 Fig 10. Package outline SOT323 (SC-70) 4.2 3.6 0.45 0.38 1.75 0.9 1.45 0.7 4.8 4.4 1 2 0.30 0.15 1 Dimensions in mm 04-11-04 0.25 0.10 5.2 5.0 Dimensions in mm 14.5 12.7 0.48 0.40 1 2 2.54 3 1.27 04-11-16 Fig 11. Package outline SOT416 (SC-75) Fig 12. Package outline SOT54 (SC-43A/TO-92) 0.45 0.38 4.2 3.6 1.27 4.2 3.6 0.45 0.38 0.48 0.40 1 3 max 2.5 max 1 0.48 0.40 2 2.54 3 1.27 4.8 4.4 2 5.08 2.54 3 5.2 5.0 14.5 12.7 04-06-28 5.2 5.0 Dimensions in mm 14.5 12.7 4.8 4.4 Dimensions in mm 05-01-10 Fig 13. Package outline SOT54A Fig 14. Package outline SOT54 variant BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 8 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] BC846 BC846W BC846T BC546A Package SOT23 SOT323 SOT416 SOT54 SOT54A Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel bulk, straight leads tape and reel, wide pitch tape ammopack, wide pitch SOT54 variant bulk, delta pinning BC546B SOT54 SOT54A bulk, straight leads tape and reel, wide pitch tape ammopack, wide pitch SOT54 variant bulk, delta pinning [1] [2] Packing quantity 3000 -215 -115 -115 5000 -412 -112 -412 -112 10000 -235 -135 -135 -116 -126 -116 -126 - For further information and the availability of packing methods, see Section 13. Valid for all available selection groups. BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 9 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 10. Soldering 2.90 2.50 solder lands solder resist 0.85 3.00 0.85 1.30 3 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 2 1 2.70 occupied area solder paste Dimensions in mm Fig 15. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 4.60 4.00 1.20 3 1 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 16. Wave soldering footprint SOT23 (TO-236AB) BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 10 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 2.65 0.75 1.325 1.30 solder lands 2 solder paste 0.60 2.35 0.85 (3×) 3 0.50 (3×) 1.90 1 solder resist occupied area Dimensions in mm 0.55 (3×) 2.40 msa429 Fig 17. Reflow soldering footprint SOT323 (SC-70) 4.60 4.00 1.15 2 3.65 2.10 3 2.70 solder lands 1 0.90 (2×) solder resist occupied area Dimensions in mm preferred transport direction during soldering msa419 Fig 18. Wave soldering footprint SOT323 (SC-70) 2.2 0.6 0.7 1.1 2 2.0 0.85 3 1 0.5 (3x) 1.5 0.6 (3x) 1.9 Dimensions in mm solder lands solder resist msa438 solder paste occupied area Fig 19. Reflow soldering footprint SOT416 (SC-75) BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 11 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 11. Revision history Table 10. Revision history Release date 20091117 Data sheet status Product data sheet Change notice Supersedes BC846_BC546_SER_6 Document ID BC846_BC546_SER_7 Modifications: • • • • • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. Table 3 “Pinning”: updated Figure 17 “Reflow soldering footprint SOT323 (SC-70)”: updated Figure 18 “Wave soldering footprint SOT323 (SC-70)”: updated Figure 19 “Reflow soldering footprint SOT416 (SC-75)”: updated Product data sheet BC846_BC847_ BC848_5 BC846T_847T_ SERIES_3 BC846W_BC847W_ BC848W_4 BC546_547_4 BC846_BC847_ BC848_4 BC846T_847T_2 BC846W_847W_3 BC546_547_3 BC846_BC546_SER_6 20060207 BC846_BC847_BC848_5 20040206 BC846T_847T_SERIES_ 20001115 3 BC846W_BC847W_ BC848W_4 BC546_547_4 20020204 20041125 Product specification Product specification Product specification Product specification - BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 12 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 07 — 17 November 2009 13 of 14 NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 November 2009 Document identifier: BC846_BC546_SER_7