BFQ540,115

SO T8 9 BFQ540 NPN wideband transistor Rev. 05 — 21 March 2013 Product data sheet 1. Product profile 1.1 General description NPN wideband transistor in a SOT89 plastic package. 1.2 Features and benefits  High gain  Gold metallization ensures excellent reliability  Low thermal resistance.  High output voltage  Low noise 1.3 Applications  VHF, UHF and CATV amplifiers. 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions VCBO collector-base voltage open emitter Min Typ Max Unit 20 V VCES collector-emitter voltage RBE = 0 15 V VEBO emitter-base voltage open collector 2.5 V IC collector current (DC) 120 mA 1.2 W Ptot total power dissipation Ts  60 C hFE DC current gain IC = 40 mA; VCE = 8 V; Tj = 25 C fT transition frequency IC = 40 mA; VCE = 8 V; f = 1 GHz; Tamb = 25 C s212 insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C F noise figure IC = 40 mA; VCE = 8 V; f = 900 MHz; S = opt [1] Ts is the temperature at the soldering point of the collector pin. [1] 100 12 120 250 9 GHz 13 dB 1.9 2.4 dB BFQ540 NXP Semiconductors NPN wideband transistor 2. Pinning information Table 2. Pinning Pin Description 1 emitter 2 collector 3 base Simplified outline Graphic symbol 2 3 3 2 1 1 sym042 3. Ordering information Table 3. Ordering information Type number BFQ540 Package Name Description Version - plastic surface-mounted package; collector pad for good heat transfer; 3 leads SOT89 4. Marking Table 4. Marking codes Type number Marking code BFQ540 N4 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCBO collector-base voltage VCES collector-emitter voltage VEBO emitter-base voltage open collector IC collector current (DC) Ptot total power dissipation Tstg storage temperature Tj operating junction temperature Min Max Unit open emitter 20 V RBE = 0 15 V 2.5 V 120 mA Ts  60 C 65 1.2 W +150 C 175 C 6. Thermal characteristics Table 6. BFQ540_5 Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth j-s thermal resistance from junction to soldering point Ts  60 C; Ptot = 1.2 W 95 K/W All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 2 of 9 BFQ540 NXP Semiconductors NPN wideband transistor Ptot (W) mbg241 1.4 mbg244 103 1.2 IC (mA) 1.0 0.8 102 0.6 0.4 0.2 10 0 0 50 100 150 Tj (°C) 1 200 10 VCE (V) 102 VCE  9 V. Fig 1. Power derating curve. Fig 2. SOAR. 7. Characteristics Table 7. Characteristics Tj = 25 C unless otherwise specified. BFQ540_5 Product data sheet Symbol Parameter Conditions V(BR)CBO collector-base breakdown open emitter; IC = 10 A; voltage IE = 0 V(BR)CES collector-emitter breakdown voltage V(BR)EBO Min Typ Max Unit 20 V RBE = 0; IC = 40 A 15 V emitter-base breakdown voltage IE = 100 A; IC = 0 2 V ICBO collector-base leakage current VCB = 8 V; IE = 0 50 nA IEBO emitter-base leakage current VCB = 1 V; IC = 0 200 nA hFE DC current gain IC = 40 mA; VCE = 8 V fT transition frequency IC = 40 mA; VCE = 8 V; fm = 1 GHz 9 GHz Ce emitter capacitance IC = ie = 0; VEB = 0.5 V; f = 1 MHz 2 pF Cre feedback capacitance IC = 0; VCE = 8 V; f = 1 MHz 0.9 pF s212 insertion power gain IC = 40 mA; VCE = 8 V; f = 900 MHz; Tamb = 25 C 13 dB Vo output voltage [1] 500 mV [2] 350 mV d2 second order intermodulation distortion F noise figure 100 12 120 [3] IC = 40 mA; VCE = 8 V; f = 900 MHz; S = opt All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 1.9 250 -53 dB 2.4 dB © NXP B.V. 2013. All rights reserved. 3 of 9 BFQ540 NXP Semiconductors NPN wideband transistor [1] dim = 60 dB (DIN45004B); VCE = 8 V; IC = 40 mA; RL = 50 ; Vp = Vo; Vq = Vo 6 dB; Vr = Vo 6 dB; fp = 795.25 MHz; fq = 803.25 MHz; fr = 805.5 MHz; measured at fp + fq - fr = 793.25 MHz. [2] dim = 60 dB (DIN 45004B); IC = 40 mA; VCE = 8 V; RL = 50 ; Vp = Vq = Vo; fp = 806 MHz; fq = 810 MHz; measured at 2fp  fq = 802 MHz. [3] IC = 40 mA; VCE = 8 V; RL = 50 ; Vp = Vq = 225 mV; fp = 250 MHz; fq = 560 MHz; measured at fp + fq = 810 MHz. mra688 1 Cre (pF) 0.8 mra689 12 fT (GHz) VCE = 8 V 8 4V 0.6 0.4 4 0.2 0 0 4 8 0 10−1 12 1 IC (mA) IC = 0; f = 1 MHz. Fig 3. f = 1 GHz; Tamb = 25 °C. Feedback capacitance as a function of collector-base voltage; typical values. Fig 4. Transition frequency as a function of collector current; typical values. mbg242 -20 mbg243 -20 d2 (dB) dim (dB) -30 -30 -40 -40 -50 -50 -60 -60 -70 10 20 30 40 50 -70 60 IC (mA) 10 VCE = 8 V; Vo = 475 mV; RL = 50 . fp + fq  fr = 793.25 MHz; Tamb = 25 C. Fig 5. 102 10 VCB (V) Intermodulation distortion as a function of collector current; typical values. BFQ540_5 Product data sheet 20 30 40 50 60 IC (mA) VCE = 8 V; Vo = 225 mV; RL = 50 ; fp + fq = 810 MHz; Tamb = 25 C. Fig 6. Second order intermodulation distortion as a function of collector current; typical values. All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 4 of 9 BFQ540 NXP Semiconductors NPN wideband transistor 8. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 B D A bp3 E HE Lp 1 2 3 c bp2 w M B bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.23 4.6 4.4 2.6 2.4 OUTLINE VERSION SOT89 Fig 7. e 3.0 e1 HE Lp w 1.5 4.25 3.75 1.2 0.8 0.13 REFERENCES IEC JEDEC JEITA TO-243 SC-62 EUROPEAN PROJECTION ISSUE DATE 06-03-16 06-08-29 Package outline SOT89 (TO-243). BFQ540_5 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 5 of 9 BFQ540 NXP Semiconductors NPN wideband transistor 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BFQ540 v.5 20130321 Product data sheet - BFQ540_N_4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • Legal texts have been adapted to the new company name where appropriate. Package outline drawings have been updated to the latest version. VEBO value updated. BFQ540_N_4 20070925 Product data sheet BFQ540_3 (9397 750 07064) 20000523 Product specification BFQ540_2 BFQ540_2 (9397 750 04296) 19980827 Product specification BFQ540_1 BFQ540_1 19950904 Product specification - BFQ540_5 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 BFQ540_3 © NXP B.V. 2013. All rights reserved. 6 of 9 BFQ540 NXP Semiconductors NPN wideband transistor 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 10.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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This document supersedes and replaces all information supplied prior to the publication hereof. BFQ540_5 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 7 of 9 BFQ540 NXP Semiconductors NPN wideband transistor Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BFQ540_5 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 21 March 2013 © NXP B.V. 2013. All rights reserved. 8 of 9 BFQ540 NXP Semiconductors NPN wideband transistor 12. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 2 2 3 5 6 7 7 7 7 8 8 9 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 March 2013 Document identifier: BFQ540_5