BGA2802

BGA2802 MMIC wideband amplifier Rev. 1 — 24 February 2011 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits Internally matched to 50 Ω A gain of 25.8 dB at 950 MHz Output power at 1 dB gain compression = 4 dBm Supply current = 12.5 mA at a supply voltage of 3.3 V Reverse isolation > 36 dB up to 2 GHz Good linearity with low second order and third order products Noise figure = 4.1 dB at 950 MHz Unconditionally stable (K > 1) No output inductor required 1.3 Applications LNB IF amplifiers General purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz 2. Pinning information Table 1. Pin 1 2, 5 3 4 6 Pinning Description VCC GND2 RF_OUT GND1 RF_IN 1 2 3 6 5 4 6 4 2, 5 sym052 Simplified outline Graphic symbol 1 3 NXP Semiconductors BGA2802 MMIC wideband amplifier 3. Ordering information Table 2. Ordering information Package Name BGA2802 Description plastic surface-mounted package; 6 leads Version SOT363 Type number 4. Marking Table 3. BGA2802 Marking Marking code MA* Description * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia Type number 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC ICC Ptot Tstg Tj Pdrive Parameter supply voltage supply current total power dissipation storage temperature junction temperature drive power Tsp = 90 °C Conditions RF input AC coupled Min −0.5 −40 Max 3.6 55 200 +125 125 −16.5 Unit V mA mW °C °C dBm 6. Thermal characteristics Table 5. Symbol Rth(j-sp) Thermal characteristics Parameter Conditions Typ 300 Unit K/W thermal resistance from junction to Ptot = 200 mW; Tsp = 90 °C solder point 7. Characteristics Table 6. Characteristics VCC = 3.3 V; ZS = ZL = 50 Ω; Pi = −40 dBm; Tamb = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions Min 3.0 9.8 Typ 3.3 12.5 Max 3.6 15.2 Unit V mA BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 2 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier Table 6. Characteristics …continued VCC = 3.3 V; ZS = ZL = 50 Ω; Pi = −40 dBm; Tamb = 25 °C; measured on demo board; unless otherwise specified. Symbol Parameter Gp power gain Conditions f = 250 MHz f = 950 MHz f = 2150 MHz RLin input return loss f = 250 MHz f = 950 MHz f = 2150 MHz RLout output return loss f = 250 MHz f = 950 MHz f = 2150 MHz ISL isolation f = 250 MHz f = 950 MHz f = 2150 MHz NF noise figure f = 250 MHz f = 950 MHz f = 2150 MHz B−3dB K −3 dB bandwidth Rollett stability factor 3 dB below gain at 1 GHz f = 250 MHz f = 950 MHz f = 2150 MHz PL(sat) saturated output power f = 250 MHz f = 950 MHz f = 2150 MHz PL(1dB) output power at 1 dB gain compression f = 250 MHz f = 950 MHz f = 2150 MHz IP3I input third-order intercept point Pdrive = −40 dBm (for each tone) f1 = 250 MHz; f2 = 251 MHz f1 = 950 MHz; f2 = 951 MHz f1 = 2150 MHz; f2 = 2151 MHz IP3O output third-order intercept point Pdrive = −40 dBm (for each tone) f1 = 250 MHz; f2 = 251 MHz f1 = 950 MHz; f2 = 951 MHz f1 = 2150 MHz; f2 = 2151 MHz PL(2H) second harmonic output power Pdrive = −40 dBm f1H = 250 MHz; f2H = 500 MHz f1H = 950 MHz; f2H = 1900 MHz ΔIM2 second-order intermodulation distance Pdrive = −40 dBm (for each tone) f1 = 250 MHz; f2 = 251 MHz f1 = 950 MHz; f2 = 951 MHz 25 25 27 27 29 29 dBc dBc −38 −37 −36 −35 −34 −34 dBm dBm 13 14 14 15 16 17 17 18 20 dBm dBm dBm −18 −17 −17 −16 −15 −14 −14 −13 −11 dBm dBm dBm Min 30.6 30.4 29.6 25 20 10 12 16 12 50 58 50 2.6 3.7 4.7 1.9 29 37 28 5 5 6 4 4 6 Typ 31.2 31.1 31.0 27 22 16 17 17 15 70 60 52 3.1 4.1 5.1 2.1 44 45 46 5 6 7 5 6 7 Max 31.8 31.8 32.5 29 24 23 21 18 18 91 62 55 3.6 4.5 5.5 2.3 60 53 62 6 8 9 5 7 8 dBm dBm dBm dBm dBm dBm Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB GHz BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 3 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 8. Application information Figure 1 shows a typical application circuit for the BGA2802 MMIC. The device is internally matched to 50 Ω, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The 22 nF supply decoupling capacitor C1 should be located as close as possible to the MMIC. The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes as close as possible to the MMIC. VS C1 VS RF_IN RF_OUT C3 C2 RF input RF output GND1 GND2 001aaf761 Fig 1. Typical application circuit 8.1 Application examples wideband amplifier to IF circuit or demodulator antenna wideband amplifier mixer from RF circuit LNA mixer to IF circuit or demodulator oscillator oscillator 001aaf762 001aaf763 The MMIC is very suitable as IF amplifier in e.g. LNB’s. The excellent wideband characteristics make it an easy building block. As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution. Fig 2. Application as IF amplifier Fig 3. Application as RF amplifier BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 4 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 8.2 Graphs 90° +1 135° +0.5 +2 45° 1.0 0.8 0.6 0.4 0.2 180° 0 0.2 0.5 (3) (2) (1) +0.2 +5 1 2 5 10 0° 0 − 0.2 −5 − 135° − 0.5 −1 − 90° −2 − 45° 1.0 001aan417 Tamb = 25 °C; ICC = 12.0 mA; VCC = 3.3 V; Z0 = 50 Ω. (1) f = 250 MHz (2) f = 950 MHz (3) f = 2150 MHz Fig 4. Input reflection coefficient (S11); typical values BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 5 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 90° +1 135° +0.5 +2 45° 1.0 0.8 0.6 0.4 0.2 180° 0 0.2 0.5 (1) +0.2 (3) +5 1 2 5 10 0° 0 (2) − 0.2 −5 − 135° − 0.5 −1 − 90° −2 − 45° 1.0 001aan419 Tamb = 25 °C; ICC = 12.0 mA; VCC = 3.3 V; Z0 = 50 Ω. (1) f = 250 MHz (2) f = 950 MHz (3) f = 2150 MHz Fig 5. Output reflection coefficient (S22); typical values BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 6 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 103 K 001aan421 0 RLin (dB) −10 (1) (2) (3) (4) (5) 001aan422 102 10 (1) (2) (3) (4) (5) −20 1 0 1 2 f (GHz) 3 −30 0 1 2 f (GHz) 3 Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Fig 6. Rollett stability factor as function of frequency; typical values Fig 7. Input return loss as function of frequency; typical values BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 7 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 0 RLout (dB) −10 001aan423 35 Gp (dB) 30 001aan424 (1) (2) (3) (4) (5) −20 (1) (2) (3) (4) (5) 25 20 −30 15 0 1 2 f (GHz) 3 0 1 2 f (GHz) 3 Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Fig 8. Output return loss as function of frequency; typical values Fig 9. Insertion power gain as function of frequency; typical values BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 8 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 0 ISL 001aan425 6 NF (dB) 5 (1) (2) (3) (4) (5) 001aan426 (dB) −20 −40 (1) (2) (3) (4) (5) 4 −60 3 −80 2 0 1 2 f (GHz) 3 0 1 2 f (GHz) 3 Pdrive = −40 dBm; Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Z0 = 50 Ω. (1) VCC = 3.0 V; Tamb = 85 °C; ICC = 10.00 mA (2) VCC = 3.0 V; Tamb = −40 °C; ICC = 11.10 mA (3) VCC = 3.3 V; Tamb = 25 °C; ICC = 12.00 mA (4) VCC = 3.6 V; Tamb = 85 °C; ICC = 12.90 mA (5) VCC = 3.6 V; Tamb = −40 °C; ICC = 14.20 mA Fig 10. Isolation as function of frequency; typical values Fig 11. Noise figure as function of frequency; typical values 8.3 Tables Table 7. Supply current over temperature and supply voltages Typical values. Symbol ICC Parameter supply current Conditions VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V Tamb (°C) −40 11.10 12.70 14.20 25 10.50 12.00 13.50 85 10.00 11.50 12.90 mA mA mA Unit Table 8. Second harmonic output power over temperature and supply voltages Typical values. Symbol Parameter PL(2H) Conditions Tamb (°C) −40 25 second harmonic output power f = 250 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 950 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V BGA2802 All information provided in this document is subject to legal disclaimers. Unit 85 −52 −55 −59 dBm −53 −56 −59 dBm −54 −56 −59 dBm −46 −47 −48 dBm −45 −46 −48 dBm −45 −46 −47 dBm © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 9 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier Table 9. Input power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol Parameter Pi(1dB) input power at 1 dB gain compression Conditions f = 250 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 950 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 2150 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V −26 −26 −26 −27 −27 −28 −28 −29 −29 dBm dBm dBm −23 −23 −22 −24 −23 −23 −24 −24 −24 dBm dBm dBm −23 −22 −21 −23 −22 −22 −23 −22 −22 dBm dBm dBm Tamb (°C) −40 25 85 Unit Table 10. Output power at 1 dB gain compression over temperature and supply voltages Typical values. Symbol PL(1dB) Parameter output power at 1 dB gain compression Conditions f = 250 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 950 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 2150 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V −2 −1 0 −3 −3 −2 −6 −5 −5 dBm dBm dBm 1 2 3 0 1 2 −1 0 1 dBm dBm dBm 1 3 4 1 3 4 1 2 3 dBm dBm dBm Tamb (°C) −40 25 85 Unit BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 10 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier Table 11. Saturated output power over temperature and supply voltages Typical values. Symbol PL(sat) Parameter saturated output power Conditions f = 250 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 950 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f = 2150 MHz VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V 0 1 1 −2 −1 −1 −4 −3 −3 dBm dBm dBm 3 4 6 2 4 5 2 3 3 dBm dBm dBm 3 5 7 3 5 6 3 4 5 dBm dBm dBm Tamb (°C) −40 25 85 Unit Table 12. Second-order intermodulation distance over temperature and supply voltages Typical values. Symbol ΔIM2 Parameter second-order intermodulation distance Conditions f1 = 250 MHz; f2 = 251 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f1 = 950 MHz; f2 = 951 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V 34 37 40 37 39 dBc 40 42 dBc 42 44 dBc 36 40 44 42 56 dBc 47 67 dBc 51 63 dBc Tamb (°C) −40 25 85 Unit BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 11 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier Table 13. Output third-order intercept point over temperature and supply voltages Typical values. Symbol IP3O Parameter output third-order intercept point Conditions f1 = 250 MHz; f2 = 251 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f1 = 950 MHz; f2 = 951 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V f1 = 2150 MHz; f2 = 2151 MHz; Pdrive = −40 dBm VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V Table 14. −3 dB bandwidth over temperature and supply voltages Typical values. Symbol B−3dB Parameter −3 dB bandwidth Conditions VCC = 3.0 V VCC = 3.3 V VCC = 3.6 V Tamb (°C) −40 2.922 2.912 2.902 25 2.768 2.756 2.743 85 2.595 2.584 2.568 GHz GHz GHz Unit 8 9 9 6 6 6 3 4 4 dBm dBm dBm 13 14 16 11 13 14 10 11 12 dBm dBm dBm 14 16 18 13 15 17 12 14 15 dBm dBm dBm Tamb (°C) −40 25 85 Unit BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 12 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 9. Test information 30 mm IC1 C2 30 mm C1 C3 001aal226 True size = 30 mm × 30 mm. Fig 12. PCB layout and demo board with components Table 15. C1, C2 C3 IC1 List of components used for the typical application Description multilayer ceramic chip capacitor multilayer ceramic chip capacitor BGA2802 MMIC Value 100 pF 22 nF Dimensions 0603 0603 SOT363 Component BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 13 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 10. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 13. Package outline SOT363 BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 14 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 11. Abbreviations Table 16. Acronym DC IF LNA LNB PCB RF SMD Abbreviations Description Direct Current Intermediate Frequency Low-Noise Amplifier Low-Noise Block converter Printed-Circuit Board Radio Frequency Surface Mounted Device 12. Revision history Table 17. Revision history Release date 20110224 Data sheet status Product data sheet Change notice Supersedes Document ID BGA2802 v.1 BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 15 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2011. All rights reserved. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BGA2802 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 24 February 2011 16 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA2802 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 24 February 2011 17 of 18 NXP Semiconductors BGA2802 MMIC wideband amplifier 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 8.1 8.2 8.3 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Application information. . . . . . . . . . . . . . . . . . . 4 Application examples . . . . . . . . . . . . . . . . . . . . 4 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 February 2011 Document identifier: BGA2802