BGU7007

BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo Rev. 1 — 20 May 2011 Product data sheet 1. Product profile 1.1 General description The BGU7007 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7007 requires only one external matching inductor and one external decoupling capacitor. The BGU7007 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 18.5 dB gain at a noise figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure (NF) = 0.85 dB Gain 18.5 dB High input1 dB compression point Pi (1dB) of −12 dBm High out of band IP3i of 4 dBm Supply voltage 1.5 V to 2.85 V Power-down mode current consumption < 1 μA Optimized performance at low supply current of 4.8 mA Integrated temperature stabilized bias for easy design Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled ESD protection on all pins (HBM > 2 kV) Integrated matching for the output Small 6-pin leadless package 1 mm × 1.45 mm × 0.5 mm 110 GHz transit frequency - SiGe:C technology NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 1.3 Applications LNA for GPS, GLONASS and Galileo in smart phones, feature phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video Cameras, RF Front End modules, complete GPS chipset modules and theft protection (laptop, ATM) 1.4 Quick reference data Table 1. Quick reference data f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE ≥ 0.8 V Pi < −40 dBm Pi = −20 dBm Gp NF power gain noise figure Pi < −40 dBm, no jammer Pi = −20 dBm Pi < −40 dBm, no jammer Pi < −40 dBm, no jammer Pi = −20 dBm Pi(1dB) input power at 1 dB gain compression f = 1559 MHz to 1610 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V IP3i input third-order intercept point f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V [1] [2] [3] PCB losses are subtracted. Including PCB losses. f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = −30 dBm. [3] [3] [3] [1] [2] Min Typ Max Unit 1.5 3.4 8.9 4.8 2.85 V 6.1 mA 12.8 15.9 mA 16.5 18.5 20.5 dB 17.5 19.5 21.5 dB −16 −15 −14 1 1 2 0.85 1.2 0.90 1.3 1.2 −13 −12 −11 4 4 5 1.6 dB dB dB dBm dBm dBm dBm dBm dBm 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description GND GND RF_IN VCC ENABLE RF_OUT 6 5 bottom view 4 2 1 sym129 Simplified outline 1 2 3 Graphic symbol 4 5 3 6 BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 2 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 3. Ordering information Table 3. Ordering information Package Name BGU7007 XSON6 Description Version plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm Type number 4. Marking Table 4. BGU7007 Marking codes Marking code B6 Type number 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VENABLE VRF_IN Parameter supply voltage voltage on pin ENABLE voltage on pin RF_IN Conditions RF input AC coupled VCC ≥ 2.5 V VCC < 2.5 V DC VCC ≥ 3.0 V VCC < 3.0 V VRF_OUT voltage on pin RF_OUT DC VCC ≥ 1.8 V VCC < 1.8 V Pi Ptot Tstg Tj [1] [2] [3] [3] [2][3] [3] [2][3] [2] Min −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 - Max 3.1 3.1 Unit V V VCC + 0.6 V 3.6 V VCC + 0.6 V 3.6 0 55 150 150 V dBm mW °C °C VCC + 1.8 V input power total power dissipation storage temperature junction temperature Tsp is the temperature at the soldering point of the emitter lead. Tsp ≤ 130 °C [1] −65 - Due to internal ESD diode protection, the applied voltage should not exceed the specified maximum in order to avoid excess current. The RF input and RF output are AC coupled through internal DC blocking capacitors. 6. Thermal characteristics Table 6. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 225 Unit K/W BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 3 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 7. Characteristics Table 7. Characteristics f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE ≥ 0.8 V Pi < −40 dBm Pi = −20 dBm VENABLE ≤ 0.35 V Tamb Gp ambient temperature power gain Tamb = 25 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz −40 °C ≤ Tamb ≤ +85 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz RLin RLout ISL NF input return loss output return loss isolation noise figure Tamb = 25 °C Pi < −40 dBm, no jammer Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz −40 °C ≤ Tamb ≤ +85 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz 1.7 1.9 1.8 2.0 dB dB dB dB [1] [2] Min Typ Max 1.5 3.4 8.9 −40 4.8 2.85 6.1 1 Unit V mA mA μA °C dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB 12.8 15.9 +25 +85 16.5 18.5 20.5 17.5 19.5 21.5 17.5 19.5 21.5 17.5 19.5 21.5 16 17 17 17 5 7 12 15 22 7 10 18 24 24 21 22 22 22 - Pi < −40 dBm Pi = −20 dBm Pi < −40 dBm Pi = −20 dBm 0.85 1.2 0.90 1.3 1.2 1.1 1.3 1.6 1.5 1.7 BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 4 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo Table 7. Characteristics …continued f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Pi(1dB) Conditions VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 806 MHz to 928 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 1612 MHz to 1909 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V IP3i input third-order intercept point f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V ton toff K [1] [2] [3] [4] [5] [4] [4] [4] [5] [5] [3] [3] [3] [3] [3] [3] Min Typ Max −16 −15 −14 −16 −15 −15 −14 −13 −11 1 1 2 1 −13 −12 −11 −13 −12 −12 −11 −10 −8 4 4 5 2 1 - Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm μs μs input power at 1 dB gain compression f = 1559 MHz to 1610 MHz turn-on time turn-off time Rollett stability factor PCB losses are subtracted. Including PCB losses. Out of band. f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = −30 dBm. Within 10 % of the final gain. Table 8. ENABLE (pin 5) −40 °C ≤ Tamb ≤ +85 °C; 1.5 V ≤ VCC ≤ 2.85 V VENABLE (V) ≤ 0.35 ≥ 0.8 State OFF ON BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 5 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 8. Application information 8.1 GNSS LNA Ven Vcc C1 RFin 5 L1 3 IC1 4 1 6 RFout 2 001aak685 For a list of components see Table 9. Fig 1. Schematics GNSS LNA evaluation board Table 9. List of components For schematics see Figure 1. Component C1 IC1 L1 Description decoupling capacitor BGU7007 high quality matching inductor Value 1 nF 5.6 nH Supplier various NXP Murata LQW15A Remarks 6.5 ICC (mA) 5.5 001aao158 6.0 ICC (mA) 001aao159 (1) (2) (3) (3) 5.0 (2) (1) 4.5 4.0 3.5 1.0 1.5 2.0 2.5 3.0 3.5 VCC (V) 3.0 -55 -15 25 65 105 Tamb (°C) Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Pi = −45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 2. Supply current as a function of supply voltage; typical values Fig 3. Supply current as a function of ambient temperature; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 6 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 20 Gp (dB) 16 001aao160 20 Gp (dB) 16 001aao161 12 (1) (2) 12 (4) (3) 8 (3) 8 (2) (1) 4 4 0 500 1000 1500 2000 2500 3000 f (MHz) 0 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 4. Power gain as a function of frequency; typical values Fig 5. Power gain as a function of frequency; typical values 20 Gp (dB) 16 001aao162 22 Gp (dB) 19 001aao163 25 ICC (mA) 20 Gp (3) (2) (1) (3) 12 (2) (1) 16 ICC 13 8 (3) (2) (1) 10 5 4 0 500 1000 1500 2000 2500 3000 f (MHz) 10 -50 0 -40 -30 -20 -10 0 Pi (dBm) Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 6. Power gain as a function of frequency; typical values Fig 7. Power gain as a function of input power; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 7 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 1.6 NF (dB) 1.2 001aao164 0.8 0.4 0 1550 1564 1578 1592 1606 1620 f (MHz) VCC = 1.8 V; Tamb = 25 °C; no jammer. Fig 8. Noise figure as a function of frequency; typical values 1.6 NF (dB) 1.2 001aao165 1.6 NF (dB) 1.2 001aao166 0.8 0.8 0.4 0.4 0 1.2 1.6 2 2.4 2.8 3.2 VCC (V) 0 -50 -20 10 40 70 100 Tamb (°C) f = 1575 MHz; Tamb = 25 °C; no jammer. f = 1575 MHz; VCC = 1.8 V; no jammer. Fig 9. Noise figure as a function of supply voltage; typical values Fig 10. Noise figure as a function of ambient temperature; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 8 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 4 NF (dB) 3 001aao167 4 NF (dB) 3 001aao168 2 2 1 (3) (2) (1) 1 (3) (2) (1) 0 -50 -40 -30 -20 -10 0 Pjam (dBM) 0 -50 -40 -30 -20 -10 0 Pjam (dBM) fjam= 850 MHz; Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V fjam= 1850 MHz; Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 11. Noise figure as a function of jamming power; typical values Fig 12. Noise figure as a function of jamming power; typical values 0 RLin (dB) -5 001aao169 0 RLin (dB) -10 001aao170 -10 -15 -20 -20 (3) (2) (1) (1) (2) (4) (3) -25 500 1000 1500 2000 2500 3000 f (MHz) -30 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 13. Input return loss as a function of frequency; typical values Fig 14. Input return loss as a function of frequency; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 9 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 0 RLin (dB) -5 001aao171 0 RLin (dB) -3 001aao172 -10 -6 -15 -9 (1) (2) (3) -20 (1) (2) (3) -12 -25 500 1000 1500 2000 2500 3000 f (MHz) -15 -50 -40 -30 -20 -10 0 Pi (dBm) Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 15. Input return loss as a function of frequency; typical values Fig 16. Input return loss as a function of input power; typical values 0 RLout (dB) -5 001aao173 0 RLout (dB) -5 -10 001aao174 -10 -15 -20 (1) (2) -15 -25 -20 (1) (2) (3) (3) (4) -30 -35 500 -25 500 1000 1500 2000 2500 3000 f (MHz) 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 17. Output return loss as a function of frequency; typical values Fig 18. Output return loss as a function of frequency; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 10 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 0 RLout (dB) -4 001aao175 0 RLout (dB) -5 -10 001aao176 -8 -15 -20 (3) (1) -12 -25 -16 (3) (2) (1) -30 (2) -20 500 1000 1500 2000 2500 3000 f (MHz) -35 -50 -40 -30 -20 -10 0 Pi (dBm) Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 19. Output return loss as a function of frequency; typical values Fig 20. Output return loss as a function of input power; typical values 0 ISL (dB) -10 001aao177 0 ISL (dB) -10 001aao178 (3) -20 (2) (1) -20 (1) (2) (3) (4) -30 -30 -40 500 1000 1500 2000 2500 3000 f (MHz) -40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 21. Isolation as a function of frequency; typical values Fig 22. Isolation as a function of frequency; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 11 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 0 ISL (dB) -10 001aao179 0 ISL (dB) -10 (1) (2) (3) 001aao180 -20 (1) (2) (3) -20 -30 -30 -40 500 1000 1500 2000 2500 3000 f (MHz) -40 -50 -40 -30 -20 -10 0 Pi (dBm) Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 23. Isolation as a function of frequency; typical values Fig 24. Isolation as a function of input power; typical values 0 Pi(1dB) (dBm) -4 001aao181 0 Pi(1dB) (dBm) -4 001aao182 -8 (3) (2) (1) -8 (3) -12 -12 (2) (1) -16 -16 -20 1.2 1.6 2 2.4 2.8 3.2 VCC (V) -20 1.2 1.6 2 2.4 2.8 3.2 VCC (V) f = 850 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C f = 1850 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 25. Input power at 1 dB gain compression as a function of supply voltage; typical values Fig 26. Input power at 1 dB gain compression as a function of supply voltage; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 12 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 0 Pi(1dB) (dBm) -4 001aao183 -8 (3) (2) (1) -12 -16 -20 1.2 1.6 2 2.4 2.8 3.2 VCC (V) f = 1575 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 27. Input power at 1 dB gain compression as a function of supply voltage; typical values 20 IMD3, PL (dBm) 0 -20 -40 001aao184 PL of 1713 MHz signal (1) (2) (3) 20 IMD3, PL (dBm) 0 -20 001aao185 (1) (2) (3) PL of 1713 MHz signal IMD3 of 1575 MHz signal -40 (3) IMD3 of 1575 MHz signal -60 -80 -100 -120 -40 (1) (2) (3) -60 -80 -100 -120 -40 (2) (1) -30 -20 Pi (dBm) -10 -30 -20 Pi (dBm) -10 f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; VCC = 1.8 V. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 28. Third order intermodulation distortion and output power as function of input power; typical values Fig 29. Third order intermodulation distortion and output power as function of input power; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 13 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 102 K 001aao186 102 K 001aao187 (3) (2) 10 (1) (3) 10 (2) (1) 1 1 10-1 0 2000 4000 6000 8000 10000 f (MHz) 10-1 0 2000 4000 6000 8000 10000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Tamb = 25 °C; Pi = −45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 30. Rollett stability factor as a function of frequency; typical values Fig 31. Rollett stability factor as a function of frequency; typical values BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 14 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 9. Package outline XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 32. Package outline SOT886 (XSON6) BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 15 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 10. Abbreviations Table 10. Acronym AC ATM DC GLONASS GNSS GPS HBM MMIC PC PCB RF SiGe:C Abbreviations Description Alternating Current Automated Teller Machine (cash dispenser) Direct Current GLObal NAvigation Satellite System Global Navigation Satellite System Global Positioning System Human Body Model Monolithic Microwave Integrated Circuit Personal Computer Printed Circuit Board Radio Frequency Silicon Germanium Carbon 11. Revision history Table 11. Revision history Release date 20110520 Data sheet status Product data sheet Change notice Supersedes Document ID BGU7007 v.1 BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 16 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2011. All rights reserved. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BGU7007 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 20 May 2011 17 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 18 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 6 GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 20 May 2011 Document identifier: BGU7007