BSR16/LF1R

SO T2 3 BSR16 60V, 600 mA, PNP switching transistor 24 April 2015 Product data sheet 1. General description PNP switching transistor in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. NPN complement: BSR14 2. Features and benefits • • Single general-purpose switching transistor AEC-Q101 qualified 3. Applications • Switching and linear amplification 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - -60 V IC collector current - - -600 mA hFE DC current gain 100 - 300 VCE = -10 V; IC = -150 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 B base 2 E emitter 3 C collector Simplified outline Graphic symbol 3 C B E 1 2 TO-236AB (SOT23) Scan or click this QR code to view the latest information for this product sym132 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 6. Ordering information Table 3. Ordering information Type number BSR16 Package Name Description Version TO-236AB plastic surface-mounted package; 3 leads SOT23 7. Marking Table 4. Marking codes Type number Marking code [1] BSR16 T8% [1] BSR16 Product data sheet % = placeholder for manufacturing site code All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 2 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - -60 V VCEO collector-emitter voltage open base - -60 V VEBO emitter-base voltage open collector - -5 V IC collector current - -600 mA ICM peak collector current - -800 mA IBM peak base current - -200 mA Ptot total power dissipation - 250 mW Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] single pulse; tp ≤ 1 ms Tamb ≤ 25 °C [1] Transistor mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. aaa-014677 300 (1) Ptot (mW) 200 100 0 -75 -25 25 75 125 175 Tamb (°C) (1) FR4 PCB; standard footprint Fig. 1. Power derating curve 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air BSR16 Product data sheet [1] All information provided in this document is subject to legal disclaimers. 24 April 2015 Min Typ Max Unit - - 500 K/W © NXP Semiconductors N.V. 2015. All rights reserved 3 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor [1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. aaa-014479 103 duty cycle = 1 Zth (K/W) 0.75 0.5 102 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 Mounted on FR4 PCB; standard footprint. Fig. 2. Transient thermal impedance as a function of pulse time; typical values BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 4 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = -50 V; IE = 0 A; Tamb = 25 °C - - -10 nA VCB = -50 V; IE = 0 A; Tj = 150 °C - - -10 µA IEBO emitter-base cut-off current VEB = -5 V; IC = 0 A; Tamb = 25 °C - - -50 nA hFE DC current gain VCE = -10 V; IC = -0.1 mA; Tamb = 25 °C 75 - - VCE = -10 V; IC = -1 mA; Tamb = 25 °C 100 - - VCE = -10 V; IC = -10 mA; Tamb = 25 °C 100 - - VCE = -10 V; IC = -150 mA; pulsed; 100 - 300 50 - - - - -400 mV - - -1.6 V base-emitter saturation IC = -150 mA; IB = -15 mA; voltage Tamb = 25 °C - - -1.3 V IC = -500 mA; IB = -50 mA; - - -2.6 V tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C VCE = -10 V; IC = -500 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C VCEsat collector-emitter saturation voltage IC = -150 mA; IB = -15 mA; Tamb = 25 °C IC = -500 mA; IB = -50 mA; Tamb = 25 °C VBEsat Tamb = 25 °C td delay time IC = -150 mA; IBon = -15 mA; - - 12 ns tr rise time IBoff = 15 mA; Tamb = 25 °C - - 30 ns ton turn-on time - - 40 ns ts storage time - - 300 ns tf fall time - - 65 ns toff turn-off time - - 365 ns CC collector capacitance - - 8 pF - - 30 pF 200 - - MHz VCB = -10 V; IE = 0 A; ie = 0 A; f = 1 MHz; Tamb = 25 °C CE emitter capacitance VEB = -2 V; IC = 0 A; ic = 0 A; f = 1 MHz; Tamb = 25 °C fT transition frequency VCE = -20 V; IC = -50 mA; f = 100 MHz; Tamb = 25 °C BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 5 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor aaa-014480 400 hFE aaa-014481 -1 IB = -20 mA IC (A) (1) -18 300 -14 -16 -0.8 -12 -8 -0.6 -4 -0.4 -2 (3) 100 -0.2 -1 -102 -10 IC (mA) 0 -103 VCE = -10 V 0 -2 -4 -6 -8 -10 VCE (V) Tamb = 25 °C (1) Tamb = 150 °C Fig. 4. (2) Tamb = 25 °C (3) Tamb = −55 °C Fig. 3. -6 (2) 200 0 -10-1 -10 Collector current as a function of collectoremitter voltage; typical values DC current gain as a function of collector current; typical values aaa-014482 -1.2 aaa-014483 -1.2 VBEsat (V) VBE (V) -1.0 (1) -0.8 -0.4 (1) (2) -0.8 (3) -0.6 (2) (3) -0.4 0 -10-1 Fig. 5. -1 -10 -102 IC (mA) -0.2 -10-1 -103 -1 VCE = -10 V IC/IB = 10 (1) Tamb = −55 °C (1) Tamb = −55 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 150 °C (3) Tamb = 150 °C Base-emitter voltage as a function of collector current; typical values BSR16 Product data sheet Fig. 6. -102 IC (mA) -103 Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. 24 April 2015 -10 © NXP Semiconductors N.V. 2015. All rights reserved 6 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor aaa-014484 -1 aaa-014699 -1 VCEsat (V) VCEsat (V) -10-1 -10-1 (1) (2) (1) (2) (3) -10-2 -10-1 Fig. 7. -1 (3) -10 -102 IC (mA) -10-2 -10-1 -103 -1 IC/IB = 20 Tamb = 25 °C (1) Tamb = 150 °C (1) IC/IB = 100 (2) Tamb = 25 °C (2) IC/IB = 50 (3) Tamb = −55 °C (3) IC/IB = 10 Collector-emitter saturation voltage as a function of collector current; typical values BSR16 Product data sheet Fig. 8. -102 IC (mA) -103 Collector-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. 24 April 2015 -10 © NXP Semiconductors N.V. 2015. All rights reserved 7 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 11. Test information - IB input pulse (idealized waveform) 90 % - I Bon (100 %) 10 % - I Boff output pulse (idealized waveform) - IC 90 % - I C (100 %) 10 % t td ts tr t on Fig. 9. tf t off 006aaa266 BISS transistor switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω R2 VI oscilloscope DUT R1 mgd624 Fig. 10. Test circuit for switching times 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 8 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 12. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 0.48 0.38 1.9 Dimensions in mm 0.15 0.09 04-11-04 Fig. 11. Package outline TO-236AB (SOT23) 13. Soldering 3.3 2.9 1.9 solder lands 3 2 1.7 solder resist solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr Fig. 12. Reflow soldering footprint for TO-236AB (SOT23) BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 9 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig. 13. Wave soldering footprint for TO-236AB (SOT23) BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 10 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 14. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes BSR16 v.5 20150424 Product data sheet - BSR15; BSR16 v.4 Modifications: • • • Type BSR15 removed The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors Legal texts have been adapted to the new company name where appropriate BSR15; BSR16 v.4 20040113 Product data sheet - BSR15; BSR16 v.3 BSR15; BSR16 v.3 19990415 Product data sheet - - BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 11 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 15. Legal information 15.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Definition Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". 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NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. BSR16 Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 12 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, MIFARE, MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP Semiconductors N.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 13 / 14 BSR16 NXP Semiconductors 60V, 600 mA, PNP switching transistor 16. Contents 1 General description ............................................... 1 2 Features and benefits ............................................1 3 Applications ........................................................... 1 4 Quick reference data ............................................. 1 5 Pinning information ............................................... 1 6 Ordering information ............................................. 2 7 Marking ................................................................... 2 8 Limiting values .......................................................3 9 Thermal characteristics .........................................3 10 Characteristics ....................................................... 5 11 11.1 Test information ..................................................... 8 Quality information ............................................... 8 12 Package outline ..................................................... 9 13 Soldering ................................................................ 9 14 Revision history ................................................... 11 15 15.1 15.2 15.3 15.4 Legal information .................................................12 Data sheet status ............................................... 12 Definitions ...........................................................12 Disclaimers .........................................................12 Trademarks ........................................................ 13 © NXP Semiconductors N.V. 2015. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 April 2015 BSR16 Product data sheet All information provided in this document is subject to legal disclaimers. 24 April 2015 © NXP Semiconductors N.V. 2015. All rights reserved 14 / 14