BT1306-400D,412

TO -92 BT1306-400D/600D Logic level triac Rev. 2 — 14 September 2011 Product data sheet 1. Product profile 1.1 General description Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 1.2 Features and benefits  Sensitive gate in all four quadrants  Low cost package. 1.3 Applications  General purpose bidirectional switching  Solid state relays  Phase control applications  Low power AC fan speed controllers. 1.4 Quick reference data  VDRM  600 V (BT1306-600D)  ITSM  8 A  VDRM  400 V (BT1306-400D)  IT(RMS)  0.6 A. 2. Pinning information Table 1. Pinning - SOT54 (TO-92), simplified outline and symbol Pin Description 1 main terminal 2 2 gate 3 main terminal 1 Simplified outline 1 Symbol 1 2 3 2 msb033 SOT54 (TO-92) 3 mbl305 BT1306-400D/600D NXP Semiconductors Logic level triac 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BT1306-600D TO-92 Plastic single-ended leaded (through hole) package; 3 leads SOT54 BT1306-400D TO-92 Plastic single-ended leaded (through hole) package; 3 leads SOT54 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM Conditions Min Max Unit 25 C  Tj  125 C - 600 V - 400 V - 0.6 A t = 20 ms - 8 A t = 16.7 ms - 8.8 A - 0.32 A2s repetitive peak off-state voltage BT1306-600D BT1306-400D full sine wave; Tlead  65 C; Figure 1 and 2 IT(RMS) on-state current (RMS value) ITSM non-repetitive peak on-state current full sine wave; Tj = 25 C prior to surge; Figure 3 and 4 I2t I2t dIT/dt repetitive rate of rise of on-state current after triggering for fusing t = 10 ms ITM = 1 A; IG = 0.2 A; dIG/dt = 0.2 A/s T2+ G+ - 50 A/s T2+ G - 50 A/s T2 G - 50 A/s T2 G+ - 10 A/s t = 2 s max IGM gate current (peak value) - 1 A VGM gate voltage (peak value) - 5 V PGM gate power (peak value) - 5 W PG(AV) average gate power - 0.1 W Tstg storage temperature 40 +150 C Tj junction temperature 40 +125 C BT1306_XXXD_SER Product data sheet t = 2 s max; Tcase  80 C All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 2 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 003aaa037 0.8 IT(RMS) (A) 003aaa041 3 IT(RMS) (A) 0.6 2 0.4 1 0.2 0 0 50 100 0 10-3 150 10-2 1 Tlead (°C) tsurge (S) 10 f = 50 Hz Tlead  65 C Fig 1. Maximum permissible on-state current (RMS value) as a function of lead temperature. Fig 2. 003aaa040 103 ITSM IT ITSM (A) Maximum permissible repetitive on-state current (RMS value) as a function of surge duration for sinusoidal currents. 003aaa038 10 ITSM (A) 8 t Tp 102 6 dlT/dt limit T2- G+ quadrant 4 10 2 1 10-5 0 10-4 10-3 10-2 tp (s) 10-1 1 10 102 103 n tp  20 ms n = number of cycles initial Tj  25 C f = 50 Hz initial Tj  25 C Fig 3. Maximum permissible non-repetitive peak on-state current as a function of pulse width for sinusoidal currents. BT1306_XXXD_SER Product data sheet Fig 4. Maximum permissible non-repetitive peak on-state current as a function of number of cycles for sinusoidal currents; typical values. All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 3 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-lead) thermal resistance from junction to lead full cycle - - 60 K/W half cycle thermal resistance from junction to ambient Rth(j-a) 80 mounted on a printed-circuit board; lead length = 4 mm; Figure 5 150 - K/W 5.1 Transient thermal impedance 003aaa029 103 Zth(j-a) (K/W) 102 10 P tp 1 10-5 10-4 10-3 10-2 10-1 1 t 10 tp (s) Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values. BT1306_XXXD_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 4 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 6. Characteristics Table 5. Characteristics Tj = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit T2+ G+ - 1 5 mA T2+ G - 2 5 mA T2 G - 2 5 mA T2 G+ - 4 7 mA T2+ G+ - 1 10 mA T2+ G - 5 10 mA Static characteristics IGT IL gate trigger current latching current VD = 12 V; IT = 0.1 A; Figure 8 VD = 12 V; IT = 0.1 A; Figure 9 T2 G - 1 10 mA T2 G+ - 2 10 mA IH holding current VD = 12 V; IGT = 0.1 A; Figure 10 - 1 10 mA VT on-state voltage IT = 0.85 A; Figure 11 - 1.4 1.9 V VGT gate trigger voltage ID off-state leakage current VD = 12 V; IT = 0.1 A; Figure 7 - 0.9 2 V VD = VDRM; IT = 0.1 A; Tj = 110 C 0.1 0.7 - V VD = VDRM(max); Tj = 110 C - 3 100 A VD = 67% of VDM(max); Tcase = 110 C; exponential waveform; gate open circuit; Figure 12 30 45 - V/s Dynamic characteristics dVD/dt critical rate of rise of off-state voltage dVcom/dt critical rate of rise of commutation VD = rated VDM; Tcase = 50 C; ITM = 0.84 A; voltage commutating dI/dt = 0.3 A/ms - 5 - V/s tgt gate controlled turn-on time - 2 - s BT1306_XXXD_SER Product data sheet ITM = 1.0 A; VD = VDRM(max); IG = 25 mA; dIG/dt = 5 A/s All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 5 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 003aaa036 1.2 003aaa039 1.6 VGT Ptot (W) α VGT(25°C) α = 180° α 1.2 120° 0.8 90° 60° 0.8 30° 0.4 0.4 0 0 0.2 0.4 0 -60 0.8 0.6 IT(RMS) (A) 90 140 V GT  T  j a = ----------------------V GT 25 C  On-state dissipation as a function of on-state current (RMS value); maximum values. Fig 7. 003aaa030 3 Normalized gate trigger voltage as a function of junction temperature; typical values. 003aaa031 3 IL IL(25°C) IGT IGT(25°C) (1) (2) 2 2 (3) (4) (1) (2) (3) 1 1 (4) 0 -60 -10 40 90 0 -60 140 -10 I GT  T  j a = ---------------------I GT 25 C  Product data sheet 90 140 I LT  j a = -----------------I L 25 C  Normalized gate trigger current as a function of junction temperature; typical values. BT1306_XXXD_SER 40 Tj (°C) Tj (°C) Fig 8. 40 Tj (°C)  = conduction angle Fig 6. -10 Fig 9. Normalized latching current as a function of junction temperature; typical values. All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 6 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 003aaa032 2.0 IH IH(25°C) 003aaa033 1.6 Tj = 125 °C IT (A) Tj = 25 °C 1.2 1.5 (A) 1.0 0.8 Typ Max 0.4 0.5 0 0 -60 -10 40 90 140 0 0.8 1.6 Tj (°C) VT (V) 2.4 IH  T  j a = ------------------I H 25 C  Fig 10. Normalized holding current as a function of junction temperature; typical values. Fig 11. On-state current as a function of on-state voltage; typical and maximum values. 003aaa034 103 dVD/dt (V/μs) 102 10 1 0 25 50 75 100 125 Tj (°C) Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values. BT1306_XXXD_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 7 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC JEITA TO-92 SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 Fig 13. SOT54 (TO-92). BT1306_XXXD_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 8 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 8. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes BT1306_XXXD_SER v.2 20110914 Product data sheet - BT1306_XXXD_SER v.1 (9397 750 12593) Modifications: BT1306_XXXD_SER v.1 (9397 750 12593) BT1306_XXXD_SER Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Package outline drawings have been updated to the latest version. 20040219 Product data - All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 - © NXP B.V. 2011. All rights reserved. 9 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BT1306_XXXD_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 10 of 12 BT1306-400D/600D NXP Semiconductors Logic level triac Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BT1306_XXXD_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 14 September 2011 © NXP B.V. 2011. All rights reserved. 11 of 12 NXP Semiconductors BT1306-400D/600D Logic level triac 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 5.1 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 September 2011 Document identifier: BT1306_XXXD_SER